HK91788A - Copper alloys - Google Patents
Copper alloysInfo
- Publication number
- HK91788A HK91788A HK91788A HK91788A HK91788A HK 91788 A HK91788 A HK 91788A HK 91788 A HK91788 A HK 91788A HK 91788 A HK91788 A HK 91788A HK 91788 A HK91788 A HK 91788A
- Authority
- HK
- Hong Kong
- Prior art keywords
- copper alloys
- alloys
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8410620A GB2158095B (en) | 1984-04-26 | 1984-04-26 | Copper alloys for integrated circuit leads |
Publications (1)
Publication Number | Publication Date |
---|---|
HK91788A true HK91788A (en) | 1988-11-18 |
Family
ID=10560091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK91788A HK91788A (en) | 1984-04-26 | 1988-11-10 | Copper alloys |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2158095B (en) |
HK (1) | HK91788A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2751990B1 (en) * | 1996-07-30 | 1998-10-02 | Griset Ets | COPPER-BASED ALLOY WITH HIGH ELECTRICAL CONDUCTIVITY AND SOFTENING TEMPERATURE FOR ELECTRONIC APPLICATIONS |
KR20000064324A (en) * | 1996-09-05 | 2000-11-06 | 후루까와 준노스께 | Copper alloy for electronic device |
US7928541B2 (en) | 2008-03-07 | 2011-04-19 | Kobe Steel, Ltd. | Copper alloy sheet and QFN package |
-
1984
- 1984-04-26 GB GB8410620A patent/GB2158095B/en not_active Expired
-
1988
- 1988-11-10 HK HK91788A patent/HK91788A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2158095A (en) | 1985-11-06 |
GB8410620D0 (en) | 1984-05-31 |
GB2158095B (en) | 1988-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |
Effective date: 20040425 |
|
PE | Patent expired |