HK1259552B

HK1259552B - Electronic assembly and eyewear

Info

Publication number: HK1259552B
Application number: HK19101904.2A
Authority: HK
Inventors: 李永坚; 王跃强; 刘银超; 张浩锋
Original assignee: 深圳市韶音科技有限公司
Filing date: 2019-02-01
Publication date: 2024-11-08

Description

An electronic component and glasses

Technical Field

This application relates to the field of electronic equipment technology, and in particular to an electronic component and glasses.

Background Technology

With the development of technology, people have increasingly higher requirements for the waterproof performance of electronic devices. In addition to minimizing the number of contact points in the design, waterproofing electronic devices also requires improving the sealing of the electronic device's casing and outer layers to cover the internal components.

The casings of current electronic devices are usually made of rigid materials, which makes it easy for gaps to appear at the joints between casings, thus reducing the airtightness of the electronic devices.

Summary of the Invention

The main technical problem addressed by this application is to provide an electronic component and glasses that can improve the waterproof performance of the electronic component and simplify the assembly process of the electronic component.

To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide an electronic component, the electronic component comprising: a housing body having a cavity having at least one opening; a cover covering the opening for sealing the cavity; wherein the cover comprises a rigid support and a soft cover layer integrally injection molded on the surface of the support, the support being used for physical connection with the housing body, and the cover layer being used for providing a seal for the cavity after the support is connected to the housing body.

To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide eyeglasses, the eyeglasses including: an eyeglass frame, the eyeglass frame including an eyeglass frame and two eyeglass temples, the eyeglass temples including temple bodies connected to the eyeglass frame, at least one of the temple bodies including the electronic components as described above, and the accommodating body being at least a part of the temple body.

The beneficial effects of this application are as follows: Unlike the prior art, the cover of the electronic component in this application includes a rigid bracket and a soft cover layer integrally injection-molded on the surface of the rigid bracket. The bracket is physically connected to the housing body, and the cover layer further provides a seal for the cavity after the bracket and housing body are connected. Moreover, the soft cover layer is more conducive to fitting the gap between the bracket and the housing body, thereby further improving the sealing performance of the electronic component and thus improving its waterproof effect. At the same time, the bracket and cover layer are integrally injection-molded, which simplifies the assembly process of the electronic component.

Attached Figure Description

Figure 1 is an exploded structural diagram of one embodiment of the electronic component of this application;

Figure 2 is a partial cross-sectional view of one embodiment of the electronic component of this application;

Figure 3 is an enlarged view of part A in Figure 2;

Figure 4 is a cross-sectional view of the electronic component of this application in its assembled state along the A-A axis in Figure 1;

Figure 5 is an enlarged view of part B in Figure 4;

Figure 6 is a partial cross-sectional view of one embodiment of the electronic component of this application;

Figure 7 is a cross-sectional view of the electronic component of this application in its assembled state along the B-B axis in Figure 1;

Figure 8 is a cross-sectional view of the electronic component of this application in its assembled state along the C-C axis in Figure 1;

Figure 9 is a structural schematic diagram of one embodiment of the glasses of this application;

Figure 10 is a structural schematic diagram of another state of the glasses according to one embodiment of the present application;

Figure 11 is a cross-sectional view along the D-D axis in Figure 9;

Figure 12 is a diagram of the original state of the protective sleeve in one embodiment of the eyeglasses of this application;

Figure 13 is a partial cross-sectional view of the original state of the protective sleeve in one embodiment of the eyeglasses of this application;

Figure 14 is a diagram showing the bent state of the protective sleeve in one embodiment of the eyeglasses of this application;

Figure 15 is a partial cross-sectional view of the protective sleeve in a bent state according to one embodiment of the glasses of this application;

Figures 16 to 19 are schematic diagrams of relevant surfaces in one embodiment of the eyeglasses of this application;

Figures 20 and 21 are schematic diagrams showing the distances between relevant elements in one embodiment of the eyeglasses of this application.

Detailed Implementation

Please refer to Figures 1 to 3 together. Figure 1 is an exploded structural view of an embodiment of the electronic component of this application, Figure 2 is a partial cross-sectional view of an embodiment of the electronic component of this application, and Figure 3 is an enlarged view of part A in Figure 2.

The electronic components in this application can be used in electronic devices, which can be any electronic device that requires sealing of its internal structure, such as mobile phones, tablets, glasses with circuit components and electronic devices, etc., without specific limitations.

Specifically, the electronic component includes a housing body 11 and a cover 12. The housing body 11 is provided with a cavity 111 having at least one opening 112, and the cover 12 covers the opening 112 of the cavity 111 and is used to seal the cavity 111.

The accommodating body 11 can be at least a part of an electronic device. In this embodiment, the accommodating body 11 can specifically be a structure in an electronic device used to hold, for example, circuit boards, batteries, and electronic components, and can be the entirety or part of the casing of the electronic device.

In addition, the accommodating body 11 is used to accommodate the aforementioned circuit board, battery, and electronic components through a cavity 111 with an opening 112. Specifically, the number of openings 112 can be one or more, and is not limited here.

The shape of the cover 12 at least partially matches the opening 112, thereby sealing the cavity 111 by placing the cover 12 over the opening 112. The material of the cover 12 may be different from or partially the same as the housing body 11.

In this embodiment, the cover 12 includes a rigid support 121 and a soft cover layer 122. The support 121 is used to physically connect with the accommodating body 11, and the cover layer 122 is integrally injection molded on the surface of the support 121 to provide a seal for the cavity 111 after the support 121 is connected to the accommodating body 11.

Specifically, the support 121 can be made of rigid plastic, while the cover 122 can be made of soft silicone, rubber, or similar materials. The shape of the support 121 facing the receiving body 11 matches the opening 112, allowing it to be fixed to the opening 112 of the cavity 111 via insertion, snap-fit, or other methods, thus physically connecting it to the receiving body 11. Since a rigid support 121 can easily create gaps at the physical connection with the receiving body 11, reducing the sealing of the cavity 111, the soft cover 122 is integrally injection molded onto the outer surface of the support 121 away from the receiving body 11, further covering the connection between the support 121 and the receiving body 11, thereby achieving a seal in the cavity 111.

In the above method, the cover 12 includes a rigid support 121 and a soft cover layer 122 integrally injection-molded onto the surface of the rigid support 121. The support 121 is physically connected to the housing body 11. The cover layer 122 further provides a seal for the cavity 111 after the support 121 and the housing body 11 are connected. The soft cover layer 122 is more conducive to fitting the gap between the support 121 and the housing body 11, thereby further improving the sealing performance of the electronic component and thus improving the waterproof effect of the electronic component. At the same time, the support 121 and the cover layer 122 are integrally injection-molded, which simplifies the assembly process of the electronic component.

In one embodiment, the bracket 121 includes an insertion part 1211 and a covering part 1212. The covering part 1212 covers the opening 112, and the insertion part 1211 is disposed on one side of the covering part 1212 and extends into the cavity 111 along the inner wall of the cavity 111 to fix the covering part 1212 to the opening 112.

In one application scenario, the insertion part 1211 can also be inserted without passing through the inner wall of the cavity 111. For example, the cavity 111 can also be provided with a plug-in part whose shape matches the insertion part 1211 of the bracket 121, so that the insertion part 1211 can engage with the plug-in part and fix the plug-in part inside the cavity 111. For example, the shape of the insertion part 1211 is cylindrical, and the plug-in part can be a cylindrical ring that can surround the cylindrical plug-in part. The inner diameter of the plug-in part of the cylindrical ring can be appropriately smaller than the outer diameter of the plug-in part of the cylinder, so that when the insertion part 1211 is inserted into the plug-in part, it is interference-fitted with the plug-in part, so that the bracket 121 can be stably connected to the cavity 111. Of course, other insertion methods can also be used, as long as the insertion part 1211 can be inserted into the cavity 111 and fixed to the cavity 111.

The cover portion 1212 is disposed on the side of the insertion portion 1211 opposite to the cavity 111, and covers the opening 112 after the insertion portion 1211 is inserted into the cavity 111. The cover portion 1212 can be a complete structure, or it can be further provided with some holes as needed to achieve certain functions.

Please refer further to Figure 4, which is a cross-sectional view of the electronic component of this application in its assembled state along the A-A axis in Figure 1. In one embodiment, the accommodating body 11 includes an opening edge 113 for defining an opening 112, a cover portion 1212 is pressed onto the inner region 1131 of the opening edge 113 near the opening 112, and a cover layer 122 covers the outer surface of the cover portion 1212 away from the accommodating body 11 and is pressed onto the outer region 1132 surrounding the inner region 1131 of the opening edge 113, thereby achieving a seal with the opening edge 113.

Specifically, the inner region 1131 and the outer region 1132 of the opening edge 113 both belong to the opening edge 113, and are not other regions outside the opening edge 113. The inner region 1131 of the opening edge 113 is the region of the opening edge 113 that is close to the opening 112, while the outer region 1132 of the opening edge 113 is the region of the opening edge 113 that is far away from the opening 112.

In this embodiment, the cover portion 1212 of the bracket 121 is pressed against the inner region 1131 of the opening edge 113 near the opening 112, which allows the cover portion 1212 to initially seal the opening edge 113. However, since both the accommodating body 11 and the bracket 121 are made of rigid materials, the connection between them and the further coverage of the cover portion 1212 cannot achieve a good sealing effect. A gap is easily generated between the end of the cover portion 1212 pressed against the opening edge 113 and away from the opening 112, and further communicates with the cavity 111 through the gap, thereby reducing the sealing performance.

Therefore, in this embodiment, the cover layer 122 covers the outer surface of the cover portion 1212 away from the accommodating body 11, and is further pressed onto the outer region 1132 surrounding the inner region 1131 of the opening edge 113, thereby further covering the gap between the cover portion 1212 of the bracket 121 and the opening edge 113. Since the cover layer 122 is made of soft material, the sealing effect of the electronic components can be further improved, resulting in better waterproof performance of the electronic components.

Please refer to Figure 5 for further details. Figure 5 is an enlarged view of part B in Figure 4. In one application scenario, with the cover 12 in the closed state, the outer periphery of the covering portion 1212 covers and contacts the inner region 1131 of the opening edge 113. The cover layer 122 is located on the side of the covering portion 1212 away from the receiving body 11, so that the covering portion 1212 located in the inner region 1131 of the opening edge 113 is sandwiched between the inner region 1131 of the opening edge 113 and the cover. Between the layers 122, the cover layer 122 extends further toward the cover portion 1212 away from the opening 112 and toward the opening edge 113 until it contacts the outer region 1132 of the opening edge 113, so that the contact end face of the cover portion 1212 and the contact end face of the opening edge 113 and the cover layer 122 and the opening edge 113 are flush with each other, and a structure of "opening edge 113-cover portion 1212-cover layer 122" is formed on the inner region 1131 of the opening edge 113.

In another application scenario, please refer further to FIG6, which is a partial cross-sectional view of an embodiment of the electronic component of this application. In this application scenario, after the cover layer 122 extends to contact the outer region 1132 of the opening edge 113, it further extends along the region between the cover portion 1212 and the opening edge 113 to the inner region 1131 of the opening edge 113. It is assumed that the cover portion 1212 is pressed onto the inner region 1131 of the opening edge 113 between the inner region 1131 of the opening edge 113 and the cover portion 1212, thereby forming a structure of "opening edge 113-cover layer 122-cover portion 1212-cover layer 122". In this application scenario, the soft cover layer 122 extends further between the support 121 and the opening edge 113 on the basis of the cover portion 1212 covering the rigid support 121, thereby further improving the seal between the cavity 111 and the cover 12, and further improving the waterproof effect of the electronic component.

Furthermore, in one embodiment, please continue to refer to Figures 1 to 4, the electronic component also includes a circuit component 13 disposed in the cavity 111, and a switch 1311 is disposed on the circuit component 13.

Specifically, the circuit assembly 13 may include a first circuit board 131, and a switch 1311 is disposed on the outer side of the first circuit board 131 facing the opening 112 of the cavity 111. The number of switches 1311 may be one or more. When there are multiple switches 1311, they may be spaced apart on the first circuit board 131.

Correspondingly, the bracket 121 is provided with a switch hole 1213 corresponding to the switch 1311, the cover 122 further covers the switch hole 1213, and a pressing part 1221 is provided at the position corresponding to the switch hole 1213. The pressing part 1221 extends into the cavity 111 through the switch hole 1213. When the corresponding position of the cover 122 is pressed, the pressing part 1221 presses against the switch 1311 on the circuit assembly 13, thereby triggering the circuit assembly 13 to perform a preset function.

The pressing part 1221 on the cover layer 122 protrudes from the side of the cover layer 122 facing the bracket 121 and towards the switch hole 1213 and the switch 1311. The shape of the pressing part 1221 matches the switch hole 1213, so that when the corresponding position of the cover layer 122 is pressed, the pressing part 1221 can pass through the switch hole 1213 and reach the corresponding switch 1311 on the first circuit board 131. At the same time, the length of the pressing part 1221 along the direction towards the switch 1311 is set so that it does not press the switch 1311 when the corresponding position of the cover layer 122 is not pressed, but can press the corresponding switch 1311 when pressed.

In one application scenario, the cover layer 122 protrudes further to the side opposite to the support 121 to form a raised pressing part 1222, so that the user can clearly identify the position of the switch 1311 and trigger the circuit component 13 to perform the corresponding function by pressing the corresponding pressing part 1222.

Further, in one embodiment, please refer to FIG7, which is a cross-sectional view of the electronic component of this application in its assembled state along the B-B axis in FIG1. The electronic component includes a first microphone element 1312. Specifically, the first microphone element 1312 may also be disposed on the first circuit board 131 of the circuit assembly 13, and housed within the cavity 111. For example, the first microphone element 1312 may be disposed on the first circuit board 131 at a distance from the switch 1311 in the above embodiment. Specifically, the first microphone element 1312 is used to receive sound signals from outside the electronic component and convert the sound signals into electrical signals for analysis and processing.

Correspondingly, the bracket 121 is provided with a microphone hole 1214 corresponding to the first microphone element 1312, the cover layer 122 is provided with a first sound guide hole 1223 corresponding to the microphone hole 1214, and a first sound baffle 1224 is provided at the position corresponding to the microphone hole 1214. The first sound baffle 1224 extends into the cavity 111 through the microphone hole 1214 and defines a sound guide channel 12241. One end of the sound guide channel 12241 is connected to the first sound guide hole 1223 on the cover layer 122, and the first microphone element 1312 is inserted into the sound guide channel 12241 from the other end of the sound guide channel 12241.

When the electronic components also include the switch 1311 in the above embodiments, the switch hole 1213 and the microphone hole 1214 can be arranged on the bracket 121 at intervals.

Specifically, the first sound guide hole 1223 is disposed through the cover layer 122 and corresponds to the position of the first microphone element 1312. The first sound guide hole 1223 corresponds to the microphone hole 1214 on the bracket 121, thereby connecting the first microphone element 1312 with the outside of the electronic component, so that the sound from the outside of the electronic component can be received by the first microphone element 1312 through the first sound guide hole 1223 and the microphone hole 1214.

The shape of the first sound guide hole 1223 can be arbitrary, as long as it can allow sound from the outside world to enter the electronic component. In one application scenario, the first sound guide hole 1223 is a small circular hole, located in the area of the cover layer 122 corresponding to the microphone hole 1214. The small size of the first sound guide hole 1223 can reduce the connection between the first microphone element 1312 and the outside world inside the electronic component, thereby improving the sealing of the electronic component.

Correspondingly, the first sound-blocking component 1224 extends from the periphery of the first sound guide hole 1223 through the microphone hole 1214 from the cover layer 122 into the cavity 111 to the periphery of the first microphone element 1312, thereby forming a sound guide channel 12241 from the first sound guide hole 1223 to the first microphone element 1312, so that the sound signal of the electronic component entering the sound guide hole can directly reach the first microphone element 1312 through the sound guide channel 12241.

Specifically, the shape of the sound guide channel 12241 in its cross-section perpendicular to its length direction can be the same as or different from the shape of the microphone hole 1214 or the first microphone element 1312. In one application scenario, the cross-sectional shape of both the microphone hole 1214 and the first microphone element 1312 in the direction perpendicular to the bracket 121 toward the cavity 111 is square, and the size of the microphone hole 1214 is slightly larger than the outer dimension of the sound guide channel 12241, while the inner dimension of the sound guide channel 12241 is not smaller than the outer dimension of the first microphone element 1312, so that the sound guide channel 12241 can pass through the first sound guide hole 1223 to reach the first microphone element 1312 and surround the outer periphery of the first microphone element 1312.

In the above manner, the cover layer 122 of the electronic component is provided with a first sound guide hole 1223 and a sound guide channel 12241 that passes through the microphone hole 1214 from the periphery of the first sound guide hole 1223 to reach the first microphone element 1312 and surrounds the periphery of the first microphone element 1312. The arrangement of the sound guide channel 12241 enables the sound signal entering through the first sound guide hole 1223 to reach the first microphone element 1312 and be received by the first microphone element 1312, thereby reducing the leakage of the sound signal during the propagation process and improving the efficiency of the electronic component in receiving sound signals.

In one application scenario, the electronic component also includes a waterproof mesh 14 disposed in the sound guide channel 12241. The waterproof mesh 14 is held against the side of the cover layer 122 facing the microphone element by the first microphone element 1312 and covers the first sound guide hole 1223.

Specifically, the support 121 in the sound channel 12241, which is close to the first microphone element 1312, protrudes to form a convex surface opposite to the first microphone element 1312, so that the waterproof mesh 14 is sandwiched between the first microphone element 1312 and the convex surface, or it can be directly glued to the periphery of the first microphone element 1312. The specific setting method is not limited here.

In this embodiment, the waterproof mesh 14 not only further waterproofs the first microphone element 1312, but also has the function of sound transmission, so as to avoid adversely affecting the sound receiving effect of the sound receiving area 13121 of the first microphone element 1312.

In one embodiment, the cover 12 is elongated, with the main axis of the first sound guide hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 spaced apart from each other in the width direction of the cover 12. The main axis of the sound receiving area 13121 of the first microphone element 1312 refers to the main axis of the sound receiving area 13121 of the first microphone element 1312 in the width direction of the cover 12, as shown by axis n in Figure 7, and the main axis of the first sound guide hole 1223 is shown by axis m in Figure 7.

It should be noted that, due to the requirements of the circuit assembly 13 itself, the first microphone element 1312 can be set at the first position of the first circuit board 131. However, when setting the first sound guide hole 1223, due to aesthetic and convenience requirements, the first sound guide hole 1223 is set at the second position of the cover 12. In this embodiment, the first position and the second position may not correspond in the width direction of the cover 12, which results in the main axis of the first sound guide hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 being spaced apart from each other in the width direction of the cover 12. As a result, the sound input from the first sound guide hole 1223 may not be able to reach the sound receiving area 13121 of the first microphone element 1312 along a straight line.

Furthermore, in order to guide the sound signal entering through the first sound guide hole 1223 to the first microphone element 1312, the sound guide channel 12241 can be configured to be curved.

Specifically, in one application scenario, the main axis of the first sound guide hole 1223 is located in the middle of the cover 12 in the width direction of the cover 12.

In this embodiment, the cover 12 can be part of the outer shell of the electronic device. In order to meet the overall aesthetic requirements of the electronic device, the first sound guide hole 1223 can be set in the middle of the width direction of the cover 12 so that the first sound guide hole 1223 looks more symmetrical and meets people's visual needs.

In this application scenario, the corresponding sound guide channel 12241 can be set to have a stepped cross-section along the B-B axis in Figure 1, so that the sound signal introduced by the first sound guide hole 1223 can be transmitted to the first microphone element 1312 through the stepped sound guide channel 12241 and received by the first microphone element 1312.

Further, please refer to Figure 8, which is a cross-sectional view of the electronic component of this application in its assembled state along the C-C axis in Figure 1. In one embodiment, the electronic component further includes a light-emitting element 1313. Specifically, the light-emitting element 1313 may be disposed on the first circuit board 131 of the circuit assembly 13, and housed within the cavity 111. For example, the light-emitting element 1313 may be disposed on the first circuit board 131 together with the switch 1311 and the first microphone element 1312 in the above embodiment in a certain arrangement.

Correspondingly, the bracket 121 is provided with a light-emitting hole 1215 corresponding to the light-emitting element 1313, the cover layer 122 covers the light-emitting hole 1215, and the thickness of the cover layer 122 corresponding to the area of the light-emitting hole 1215 is set to allow the light generated by the light-emitting element 1313 to be transmitted through the cover layer 122.

Among them, the light-emitting element 1313 can be a light-emitting diode, etc., and the number of light-emitting elements 1313 can be one or more. The number of light-emitting holes 1215 on the bracket 121 can be the same as the number of light-emitting elements 1313. When there are multiple light-emitting elements 1313, there are different light-emitting holes 1215, and different signals can be transmitted through different light-emitting elements 1313.

In this embodiment, a certain means can be used to ensure that the cover layer 122 can still transmit the light emitted by the light-emitting element 1313 to the outside of the electronic component even when it covers the light-emitting hole 1215.

Specifically, in one application scenario, the thickness of the cover layer 122 corresponding to the entire area or part of the light-emitting aperture 1215 can be set to be less than the thickness of the area of the cover layer 122 corresponding to the periphery of the light-emitting aperture 1215, so that the light emitted by the light-emitting element 1313 can pass through the light-emitting aperture 1215 and be further transmitted out by the cover layer 122. Of course, other means can also be used to enable light to be transmitted in the area of the cover layer 122 covering the light-emitting aperture 1215, which is not specifically limited here.

In the above manner, the cover layer 122, on the basis of covering the light emission hole 1215 of the corresponding light-emitting element 1313, is further configured to allow the light emitted by the light-emitting element 1313 to be transmitted from the cover layer 122 to the outside of the electronic component, thereby sealing the light-emitting element 1313 through the cover layer 122 without affecting the light-emitting function of the electronic component, so as to improve the sealing and waterproof performance of the electronic component.

Specifically, in one embodiment, the bracket 121 is further provided with a light-blocking member 1216 extending toward the interior of the cavity 111 around the light-emitting hole 1215, and the light-blocking member 1216 restricts the transmission direction of the light generated by the light-emitting element 1313.

The shape of the light-emitting aperture 1215 can be any shape that allows the light emitted by the light-emitting element 1313 to pass through, such as a circle, a square, a triangle, etc. In this embodiment, the shape of the light-emitting aperture 1215 is a circle.

Since there is a certain distance between the light-emitting element 1313 and the light-emitting aperture 1215, without constraint, some of the light emitted by the light-emitting element 1313 will leak during its journey to the light-emitting aperture 1215, thus failing to effectively propagate to the aperture and reducing the brightness of the light visible from outside the electronic component, making it difficult for the user to receive signals. In this embodiment, the light-blocking member 1216 restricts the transmission direction of the light emitted by the light-emitting element 1313, reducing light leakage and thereby increasing the brightness of the light transmitted through the light-emitting aperture 1215.

Specifically, in this embodiment, the light-blocking member 1216 can be partially or entirely formed by the bracket 121. For example, the bracket 121 can extend along the periphery of the light-emitting hole 1215 into the cavity 111 and surround the light-emitting element 1313, thereby forming a light transmission channel. Through this light channel, the light generated by the light-emitting element 1313 can propagate directly to the light-emitting hole 1215 along the direction of the channel. Alternatively, the bracket 121 may not form a light channel, but only restrict the propagation of light in one or several directions. For example, the bracket 121 can extend only from one side of the light-emitting hole 1215 into the cavity 111 to form a light-blocking member 1216 that blocks the light-emitting element 1313 on one side. Alternatively, it can be further combined with other components to restrict the propagation of light. For example, the bracket 121 extends from one side of the light outlet 1215 into the cavity 111 to form a light-blocking member 1216 that blocks the light-emitting element 1313 on one side. The light-blocking member 1216 further cooperates with the inner wall of the cavity 111 or other structures of the bracket 121 to restrict the transmission direction of the light generated by the light-emitting element 1313 from multiple directions.

In one application scenario, the light-emitting element 1313 and the first microphone element 1312 are disposed adjacently on the first circuit board 131, and the corresponding light-emitting hole 1215 and microphone hole 1214 are disposed at intervals on the bracket 121. As described in the above embodiment, a first sound-blocking element 1224, which defines a sound guiding channel 12241, is disposed around the first microphone element 1312 by the cover layer 122. The first sound-blocking element 1224 passes through the microphone hole 1214, thereby spacing the first microphone element 1312 and the light-emitting element 1313, as well as the microphone hole 1214 and the light-emitting hole 1215.

Specifically, in this application scenario, the light-blocking member 1216 formed by the bracket 121 cooperates with the side wall of the first sound-blocking member 1224 near the light-emitting element 1313, and the two together restrict the transmission direction of the light generated by the light-emitting element 1313.

In another application scenario, the cavity 111 is elongated in cross-section perpendicular to the opening 112. Correspondingly, the bracket 121 is also elongated and is inserted into the cavity 111 through the insertion part 1211 via the opening 112, thus forming a physical connection with the cavity 111. Insertion parts 1211 are provided on both sides along the length of the bracket 121, so that the light-emitting element 1313 also has corresponding bracket 1211 insertion parts 1211 on both sides along the length of the bracket 121, thus restricting light on both sides of the light-emitting element 1313. Furthermore, in this application scenario, the light-blocking member 1216 is further provided on one side of the light-emitting element 1313 perpendicular to the length of the bracket 121, while the sidewall of the first sound-blocking member 1224 is provided on the other side of the light-emitting element 1313 perpendicular to the length of the bracket 121. These two can be parallel plates, further restricting the transmission direction of the light generated by the light-emitting element 1313 together with the insertion parts 1211 on both sides of the light-emitting element 1313.

In one embodiment, the circuit component 13 in the electronic component includes the first circuit board 131 in the above-described electronic component embodiment, and may further include the second circuit board 132, as shown in Figures 1, 4, 7 and 8.

The first circuit board 131 is disposed in the cavity 111 parallel to the opening plane of the opening 112. The first microphone element 1312 is disposed on the side surface of the first circuit board 131 facing the cover 12. The specific arrangement is the same as in the above embodiment, and will not be repeated here.

The opening plane of opening 112 refers to the plane tangent to the side of the cavity 111 forming opening 112 facing opening 112, as shown by plane θ in Figure 1. It should be noted that plane θ in Figure 1 is only for illustrative purposes and is not an actual existing element.

The second circuit board 132 is disposed perpendicular to the first circuit board 131 in the cavity 111, and a second microphone element 1321 is disposed on the side surface of the second circuit board 132 facing the side wall of the accommodating body 11.

A second sound guide hole 114 is correspondingly provided on the side wall of the accommodating body 11. As described in the above embodiment of the electronic component of this application, a first sound guide hole 1223 corresponding to the first microphone element 1312 and the microphone hole 1214 is provided on the cover layer 122. The first microphone element 1312 is used to receive the sound input through the first sound guide hole 1223, and the second microphone element 1321 is used to receive the sound input through the second sound guide hole 114.

Specifically, the first circuit board 131 is positioned parallel to and close to the opening plane of the opening 112. Furthermore, the first circuit board 131 may also be equipped with the switch 1311, light-emitting element 1313, etc., as described above. The switch 1311, light-emitting element 1313, and first microphone element 1312, etc., can be arranged on the first circuit board 131 in a certain manner. Correspondingly, switch holes 1213, light-emitting holes 1215, and microphone holes 1214, etc., are respectively provided at intervals on the cover 12 to transmit signals to the outside of the electronic components through the corresponding holes.

Furthermore, the accommodating body 11 extends from the opening 112 in a direction perpendicular to the opening plane to form a cavity 111 with a certain width. The second circuit board 132 is parallel to the width direction of the cavity 111 and is disposed perpendicular to the opening plane, so that the second circuit board 132 is disposed perpendicular to the first circuit board 131 within the cavity 111. The second circuit board 132 may further be provided with a main control chip and an antenna, etc.

In one application scenario, when a user uses the electronic device, the first microphone element 1312 and the second microphone element 1321 are aligned with the user's mouth.

In this embodiment, a first microphone element 1312 and a second microphone element 1321 are respectively set on two circuit boards. The two microphone elements receive sound signals through the first sound guide hole 1223 and the second sound guide hole 114 respectively. One microphone element can be used to collect the main sound such as human voice, while the other microphone element can have the function of collecting background noise, which is convenient for collecting ambient noise. The two work together to analyze and process the received sound signals, which can play a role in noise reduction, thereby improving the processing quality of sound signals.

Furthermore, in the above method, the first circuit board 131 and the second circuit board 132 are arranged perpendicularly to each other in the same cavity 111, without the need to expand the space to place the two circuit boards separately, thereby improving the space utilization of electronic components. When further applied to electronic devices, it can save space in electronic devices, which is conducive to the thinning and lightening of electronic devices.

Specifically, in one application scenario, the opening 112 and the cover 12 are arranged in corresponding elongated shapes. The shape of the first circuit board 131 matches the shape of the opening 112, and the width _d1 of the first circuit board 131 is not greater than the dimension of the opening plane along the width direction of the opening 112, so that the first circuit board 131 can be accommodated in the cavity 111 near the opening 112, that is, the first circuit board 131 is also arranged in an elongated shape. Correspondingly, the switch 1311, the light-emitting element 1313, and the first microphone element 1312 can be arranged at intervals on the first circuit board 131 along the length direction of the first circuit board 131, that is, the length direction of the cover 12.

The cavity 111 is formed by accommodating the body 11 extending from the opening 112 in a direction perpendicular to the opening plane. The second circuit board 132 is parallel to the width direction of the cavity 111 and perpendicular to the opening plane, and has a certain dimension in the direction perpendicular to the first circuit board 131. In this application scenario, the dimension of the side of the second circuit board 132 closest to the first circuit board 131 can be the same as the dimension of the first circuit board 131 in the length direction.

Furthermore, in this application scenario, the cavity 111 has a larger dimension along the direction perpendicular to the opening plane, and is larger than the width of the opening plane. Correspondingly, the dimension _d1 of the first circuit board 131 along the width direction of the cover 12 is smaller than the dimension _d2 of the second circuit board 132 along the vertical direction of the first circuit board 131, while the dimensions of the two are the same along the length direction of the cover 12, thereby making the area of the first circuit board 131 smaller than the area of the second circuit board 132.

In one embodiment, a second sound guide hole 114 is provided on the accommodating body 11, which penetrates the side wall of the cavity 111, and a second sound blocking element 115 is provided at the position corresponding to the second sound guide hole 114. The second sound blocking element 115 extends toward the interior of the cavity 111 through the second sound guide hole 114 to limit the direction of sound transmission to the second microphone element 1321.

Specifically, in this embodiment, the second sound guide hole 114 corresponding to the second microphone element 1321 is disposed on the accommodating body 11 and passes through the cavity 111 to connect the second microphone element 1321 with the outside world, so that the second microphone element 1321 can receive external sound signals.

The second sound-blocking element 115 can be made of a rigid or soft material. For example, the second sound-blocking element 115 can be formed by the housing body 11 extending from the periphery of the second sound guide hole 114 into the cavity 111 on one side inside the cavity 111. In this embodiment, the second sound-blocking element 114 can be formed by a soft rubber integrally injection molded with the housing body 11 extending from the periphery of the second sound guide hole 114 into the cavity 111 on one side inside the cavity 111. In one application scenario, the second sound-blocking element 115 can extend from the periphery of the second sound guide hole 114 into the cavity 111 and extend to the second microphone element 1321, thereby surrounding the sound receiving area of the second microphone element 1321 to form a channel connecting the second sound guide hole 114 and the second microphone element 1321, so that the sound signal input to the second sound guide hole 114 from the outside can directly pass through this channel and be received by the sound receiving area of the second microphone element 1321. In another application scenario, the second sound element 115 may not completely surround the second sound guide hole 114, but may extend into the cavity 111 along one or both sides of the second sound guide hole 114 and extend to the second microphone element 1321, so as to guide the sound input from the second sound guide hole 114 to the second microphone element 1321 and be received by its receiving area.

Please refer further to Figures 9 and 10. Figure 9 is a structural schematic diagram of one state of the glasses according to one embodiment of the present application, and Figure 10 is a structural schematic diagram of another state of the glasses according to another embodiment of the present application. Compared with conventional glasses, the glasses in this embodiment are further provided with circuit structures, electronic devices, etc., making them electronic devices with other functions.

Specifically, the eyeglasses in this embodiment include an eyeglass frame 20, which includes an eyeglass frame 21 and two eyeglass temples 22. The eyeglass temples 22 include temple bodies 221 connected to the eyeglass frame 21, and at least one temple body 221 includes an electronic component as described in the above-described embodiment of the electronic components in this application.

Specifically, the eyeglass frame 20 in this embodiment can be an eyeglass frame for nearsightedness, farsightedness, sunglasses, smart glasses, virtual reality glasses, holographic glasses, augmented reality glasses, etc., and is not limited here.

In this embodiment, the accommodating body 11 in the electronic components is the temple body 221, or a part of the temple body 221. In this embodiment, a cavity 111 is provided inside the temple body 221 to accommodate the circuit component 13 corresponding to the above-described electronic component embodiment, thereby enabling the glasses to have the corresponding functions.

It should be further noted that when the electronic components described above are used in this embodiment, when the glasses are worn, the first circuit board 131 and the second circuit board 132 are both disposed within the cavity 111 of the same temple 22, for example, they can be disposed within the right temple, or of course, they can be disposed within the left temple. The cover 12, the corresponding light-emitting hole 1215, the button, and the first sound guide hole 1223 are all located on the side of the temple body 221 facing downwards from the user's head. The side of the temple body 221 facing upwards from the user's head can be completely surrounded by the shell of the temple body 221. Additionally, the second sound guide hole 114 is located on the side of the temple body 221 facing outwards from the user's head, slightly above the head.

Other related structures and functions of the electronic components are the same as those in the above-described electronic component embodiments of this application. For details, please refer to the above-described electronic component embodiments of this application, which will not be repeated here.

In one embodiment, the temple 22 further includes a connector 23 that is hinged to the end of the temple body 221 away from the frame 21 via a hinge 231. Furthermore, the glasses also include a functional component 30, which is disposed on the connector 23 to perform corresponding functions through the circuit components 13, etc., housed within the body 11.

Specifically, in one embodiment, the functional component may be a bone conduction speaker 31. In this embodiment, the connector 23 is configured such that the bone conduction speaker 31 can switch between a first relatively fixed position and a second relatively fixed position relative to the temple body 221, and when the bone conduction speaker 31 is in the first relatively fixed position, it is attached to the back of the user's auricle via the contact surface 311.

Specifically, the first relatively fixed position of the bone conduction speaker 31 relative to the temple body 221 is shown in Figure 9, and the second relatively fixed position relative to the temple body 221 is shown in Figure 10.

The auricle, part of the outer ear, is primarily composed of cartilage. In this embodiment, the speaker mechanism is attached to the back of the auricle, thereby utilizing the cartilage to transmit bone conduction sound/vibration. Attaching the speaker mechanism to the back of the auricle improves sound quality and reduces the impact on the ear canal during sound transmission.

Please refer further to Figure 11, which is a cross-sectional view along the D-D axis in Figure 9. In one embodiment, the receiving body 11 of the temple body 221 is located on the side of the temple body 221 closer to the eyeglass frame 21. The temple body 221 further includes a rod-shaped member 2211 extending from the receiving body 11 to the connector 23. The rod-shaped member 2211 is provided with a weight-reducing groove 22111. The cover layer 122 further extends outward from the bracket 121 to cover and seal the weight-reducing groove 22111.

In this embodiment, the temple body 221 is divided into two parts: one part is located near the frame, and the other part is located near the connector 23. A housing body 11 is provided on the side near the frame to house the corresponding circuit components 13. The rod-shaped member near the connector 23 is used to at least partially support the user's ears when the user wears the glasses.

The weight-reducing groove 22111 can be set inside the temple body 221 and along the extension direction of the rod-shaped member 2211, thereby making the rod-shaped member 2211 a partially hollow structure. This can reduce the overall weight of the glasses to a certain extent and improve the overall elasticity of the rod-shaped member, thereby improving the user's wearing comfort.

In one embodiment, please further refer to Figures 12 to 15. Figure 12 is a diagram of the original state of the protective sleeve in one embodiment of the glasses of this application; Figure 13 is a partial cross-sectional view of the original state of the protective sleeve in one embodiment of the glasses of this application; Figure 14 is a diagram of the bent state of the protective sleeve in one embodiment of the glasses of this application; and Figure 15 is a partial cross-sectional view of the bent state of the protective sleeve in one embodiment of the glasses of this application. The glasses may further include a protective sleeve 40 disposed around the hinge 231. This protective sleeve 40 can bend with the hinge 231, protecting the hinge 231 and preventing the hinge 231 from catching the user's hair while wearing the glasses, thus avoiding an unpleasant experience for the user.

Specifically, the protective sleeve bends as the hinge 231 switches between the first and second relatively fixed positions of the bone conduction speaker 31.

Specifically, the protective sleeve 40 includes a plurality of annular ridges 41 spaced apart along the length of the protective sleeve 40, and an annular connecting portion 42 disposed between the annular ridges 41 and used to connect two adjacent annular ridges, wherein the wall thickness of the annular ridges 41 is greater than the wall thickness of the annular connecting portion 42.

The protective sleeve 40 is aligned with the length of the hinge 231, and can be specifically positioned along the length of the hinge 231. The protective sleeve 40 can be made of a soft material, such as soft silicone or rubber.

The annular ridge 41 can be formed by further protruding outward from the outer wall of the protective sleeve 40, while the shape of the inner wall of the protective sleeve 40 corresponding to the annular ridge 41 is not specifically limited here. For example, the inner wall can be smooth, or a recess can be provided on the inner wall corresponding to the annular ridge 41.

The annular connecting portion 42 is used to connect adjacent annular ridge portions 41, specifically connected to the edge region of the annular ridge portion 41 near the interior of the protective sleeve 40, so that it can be recessed relative to the annular ridge portion 41 on the outer side wall of the protective sleeve 40.

Specifically, the number of annular ridges 41 and annular connecting parts 42 can be determined according to the actual use. For example, it can be set according to the length of the protective sleeve 40, the width of the annular ridges 41 and annular connecting parts 42 in the length direction of the protective sleeve 40, etc.

Furthermore, the wall thicknesses of the annular ridge 41 and the annular connecting portion 42 refer to the thicknesses between the inner and outer walls of the protective sleeve 40 corresponding to the annular ridge 41 and the annular connecting portion 42, respectively. In this embodiment, the wall thickness of the annular ridge 41 is greater than the wall thickness of the annular connecting portion 42.

As shown in Figures 14 and 15, when the protective sleeve 40 bends with the hinge 231, the annular ridge 41 and the annular connecting part 42 are in a stretched state in the outer region of the bent shape formed by the protective sleeve 40, while the annular ridge 41 and the annular connecting part 42 are in a compressed state in the inner region of the bent state of the protective sleeve 40.

In this embodiment, the wall thickness of the annular ridge portion 41 is greater than that of the annular connecting portion 42, making the annular ridge portion 41 harder than the annular connecting portion 42. Thus, when the protective sleeve 40 is in a bent state, the outer side of the protective sleeve 40 in the bent shape is in a stretched state, and the annular ridge portion 41 can provide a certain strength support for the protective sleeve 40. At the same time, the inner side of the protective sleeve 40 in the bent state is compressed, and the annular ridge portion 41 can also withstand a certain compressive force, thereby protecting the protective sleeve 40, improving the stability of the protective sleeve 40, and extending the service life of the protective sleeve 40.

Furthermore, it should be noted that the bending shape of the protective sleeve 40 is consistent with the state of the hinge 231. In this embodiment, the functional component 30 and the temple body 221 can rotate within a range of less than or equal to 180° via the hinge 231. That is to say, the protective sleeve 40 can only be bent to one side. Therefore, during the use of the glasses, one side of the protective sleeve 40 along its length can be compressed, and the other side can be stretched.

In one embodiment, the width of the annular ridge 41 along the length of the protective sleeve 40 on the side facing the outside of the bent shape formed by the protective sleeve 40 when the protective sleeve 40 is in a bent state is greater than the width along the length of the protective sleeve 40 on the side facing the inside of the bent shape.

Increasing the width of the annular ridge 41 along the length of the protective sleeve 40 can further improve the strength of the protective sleeve. Meanwhile, in this embodiment, the initial angle between the functional component 30 and the temple body 221 is less than 180°. In this case, if the annular ridges 41 of the protective sleeve 40 are evenly distributed, the protective sleeve 40 will be compressed in its original state. In this embodiment, the width of the annular ridge 41 facing outwards from the bent shape in the bent state is larger, thereby increasing the length of the protective sleeve 40 on that side. This improves the strength of the protective sleeve 40 and reduces the degree of stretching on the stretching side when the protective sleeve 40 is bent. Simultaneously, the width of the annular ridge 41 facing inwards from the bent shape along the length of the protective sleeve 40 is smaller when the protective sleeve 40 is bent, increasing the space of the compressed annular connecting portion 42 along the length of the protective sleeve 40, thereby alleviating the compression on the compression side to some extent.

Furthermore, in one application scenario, the width of the annular ridge 41 gradually decreases from the side facing the outer region of the bent shape to the side facing the inner region of the bent shape, so that when the protective sleeve 40 is in a bent state, the width of the side facing the outer region of the bent shape formed by the protective sleeve 40 is greater than the width of the side facing the inner region of the bent shape.

It is easy to understand that the annular ridge 41 is disposed around the periphery of the protective sleeve 40, with one side corresponding to the stretching side and the other side corresponding to the compression side along the length of the protective sleeve 40. In this embodiment, the width of the annular ridge 41 gradually decreases from the side facing the outside of the bent shape to the side facing the inside of the bent shape, thereby making the width change of the annular ridge 41 more uniform and improving the stability of the protective sleeve 40 to a certain extent.

In one embodiment, the annular ridge 41 has a groove 411 on the inner annular surface of the protective sleeve 40 facing the outside of the bent shape formed by the protective sleeve 40 when the protective sleeve 40 is in a bent state.

Specifically, in this embodiment, the groove 411 is provided along the length direction perpendicular to the protective sleeve 40, so that the corresponding annular ridge 41 can be appropriately stretched when the protective sleeve 40 is stretched in the length direction.

As described above, when the protective sleeve 40 is in a bent state, the protective sleeve 40 facing the outer region of the bent shape formed by the protective sleeve 40 is in a stretched state. In this embodiment, a groove 411 is further provided on the inner ring surface inside the protective sleeve 40 corresponding to the annular ridge 41. This allows the annular ridge 41 corresponding to the groove 411 to extend appropriately to bear part of the stretch when the protective sleeve on this side is stretched, thereby reducing the tensile force on the protective sleeve on this side and thus protecting the protective sleeve 40.

It should be noted that when the protective sleeve 40 is in a bent state, the annular ridge 41 on the side facing the inner region of the bent shape may not have a groove 41 on the corresponding inner wall of the protective sleeve 40. In one embodiment, the width of the groove 41 along the length direction of the protective sleeve 40 gradually decreases from the side facing the outer region of the bent shape to the side facing the inner region of the bent shape, so that no groove 411 is provided on the inner wall of the protective sleeve 40 corresponding to the annular ridge 41 facing the inner region of the bent shape.

Specifically, the protective sleeve 40 can be connected to the temple body 221 and the bone conduction speaker 31 respectively disposed on both sides of the protective sleeve 40 along its length. In one application scenario, the protective sleeve 40 is integrally formed with the cover layer 122 in the cover body 12, thereby making the glasses more sealed and integrated.

In one embodiment, the functional component is a bone conduction speaker 31, and the hinge 231 includes a pivot 2311. The central plane α of the pivot 2311, the symmetry plane β of the connector 23, and the center point O of the contact surface 311 of the bone conduction speaker 31 that is in contact with the ear are all in the same plane or within a predetermined error range of the relative planes.

The perpendicular plane α of the pivot 2311 of the hinge 231 refers to the plane that is perpendicular to the axial direction of the pivot 2311 of the hinge 231 and symmetrically divides the pivot 2311 of the hinge 231. Please refer to Figure 16 for details.

The symmetry plane β of connector 23 refers to the plane that symmetrically divides connector 23. That is, connector 23 is symmetrically distributed on both sides of the symmetry plane β of connector 23. Please refer to Figure 17 for details.

The predetermined error range can be derived from experience and statistical data on the material, specifications, and shape of the connecting parts and the ears.

It should be noted that when the central plane α of the pivot 2311 of the hinge 231, the symmetrical plane β of the connector 23, and the center point of the contact surface 311 of the bone conduction speaker 31 that contacts the ear are all in the same plane, the bone conduction speaker 31 connected to the connector 23 can directly contact the back of the user's auricle. When the connector 23 is deformed by force, the deformation direction and the movement direction of the bone conduction speaker 31 are consistent and both are located in the same plane. This avoids the situation where the above-mentioned planes and points are not in the same plane, and when the connector 23 is elastically deformed by force, the bone conduction speaker 31 cannot contact or completely contact the back of the user's auricle due to the torsion of the connector 23 and the bone conduction speaker 31, thereby reducing the sound/vibration transmission efficiency and thus reducing the sound quality of the bone conduction sound device. Of course, the mid-height plane α of the pivot 2311 of the hinge 231, the symmetry plane β of the connector 23, and the center point of the contact surface 311 of the bone conduction speaker 31 that fits against the ear can be within the predetermined error range of the relative plane. This ensures that it will not have too much impact on the user's use in actual use. However, it should be noted that this may affect the fit between the contact surface 311 of the bone conduction speaker 31 and the back of the user's auricle to some extent.

Furthermore, when the bone conduction speaker 31 is in a first relatively fixed position relative to the temple body 221, the angle between the horizontal reference plane γ defined by the top of the two temple bodies 221 and the symmetry plane β of the connector 23 is 65° to 85°.

The horizontal reference plane γ defined by the top of the two temple bodies 221 refers to the plane that is tangent to the top of the two temple bodies 221 at the same time. In one application scenario, this plane is further perpendicular to the plane of symmetry of the eyeglass frame 21, as shown in Figure 18. The plane of symmetry β of the connector 23 is the same as that shown in Figure 17 above, and will not be described again here.

It is easy to understand that when the bone conduction speaker 31 is in a first relatively fixed position relative to the temple body 221, if the angle between the horizontal reference plane γ defined by the tops of the two temple bodies 221 and the symmetry plane β of the connector 23 is large, the bone conduction speaker 31 will be closer to the outer side of the back of the auricle, and if the angle is too large, it may not even fit against the auricle. If the angle is small, it will be too close to the inner side of the back of the auricle, and may even compress the skull, which will reduce the user's comfort and affect the transmission of sound/vibration through the ear cartilage, thus reducing the sound quality of the bone conduction speaker mechanism. When the angle is in the range of 65° to 85°, the bone conduction speaker mechanism can fit against a more moderate position on the back of the user's auricle.

In addition, when the bone conduction speaker 31 is in the first relatively fixed position relative to the temple body 221, the angle between the horizontal reference plane γ defined by the top of the two temple bodies 221 and the symmetry plane β of the connector 23 can be 70° to 82°, so that the contact surface 311 of the bone conduction speaker 31 is closer to the back of the auricle area directly opposite the helix foot position.

Specifically, when the bone conduction speaker 31 is in the first relatively fixed position relative to the temple body 221, the angle between the horizontal reference plane γ defined by the top of the two temple bodies 221 and the symmetry plane β of the connector 23 can be any angle within the above range, such as 70°, 75°, 80°, 82°, etc., without specific limitation here.

Furthermore, when the bone conduction speaker 31 is in a first relatively fixed position relative to the temple body 221, the angle between the symmetry plane λ of the eyeglass frame 21 and the symmetry plane β of the connector 23 is 5° to 30°.

In this context, the plane of symmetry λ of the eyeglass frame 21 refers to the plane of symmetry that symmetrically divides the eyeglass frame 21, as shown in Figure 19. The plane of symmetry β of the connector 23 is the same as that shown in Figure 17 above, and will not be described again here.

The angle between the symmetrical plane λ of the eyeglass frame 21 and the symmetrical plane β of the connector 23 is related to the user's head shape. For example, this angle differs between European and Asian populations. When the user wears the glasses, the bottom of the temple body 221 is supported by the user's ears, while the side of the temple body 221 rests against the side of the user's head to fix the bone conduction speaker 31 in a suitable position. Therefore, if the angle is large, the front of the temple body 221 rests against the head while the back moves away from the head; if the angle is large, the front of the temple body 221 moves away from the head while the back rests against the head. In both cases, the temple body 221 cannot make good contact with the head, which can easily cause the contact surface 311 of the bone conduction speaker 31 to detach from the back of the ear, thereby reducing the sound quality of the bone conduction speaker 31 and causing inconvenience to the user.

When the bone conduction speaker 31 is in the first relatively fixed position relative to the temple body 221, the angle between the symmetry plane λ of the eyeglass frame 21 and the symmetry plane β of the connector 23 can be 10° to 25°, specifically 10°, 15°, 20°, 25°, etc., which are not limited here.

Further, referring to Figure 20, the distance _h1 between the center points of the pivot points 2311 of the hinges 231 corresponding to the two temples 22 can be 90–150 mm. This distance _h1 corresponds to the left and right width of the user's head.

It is easy to understand that the two temples 22 are placed on the upper part of the user's ears and clamped on both sides of the head. If the distance h ₁ between the center points of the pivots 2311 of the hinges 231 corresponding to the two temples 22 is large, the clamping force of the temples 22 toward the user's head will be small, resulting in a situation where they are "not clamped tightly", which will cause them to easily loosen from the user's head, and thus cause the bone conduction speaker 31 to deviate from the position of the back of the corresponding auricle. If the inward angle is small, the temples 22 will clamp the user's head too tightly, which will easily cause discomfort to the user.

The distance _h1 between the center points of the pivot points 2311 of the hinges 231 corresponding to the two temples 22 can be 100-130mm, specifically 100mm, 110mm, 120mm, 130mm, etc. It should be noted that different users have different head shapes, and a suitable range of _h1 can be selected for the headphones. For example, the distance _h1 for men's headphones can be 115-130mm, while for women's headphones it can be 100-115mm. Alternatively, it can be set to a value between the two ranges to accommodate both groups of people.

Optionally, please continue to refer to Figure 20. The vertical distance _h2 of the line connecting the center point of symmetry of the eyeglass frame 21 to the center point of the pivot 2311 of the two hinges 231 is 105-170 mm.

It should be noted that the center of symmetry of the eyeglass frame 21 is the midpoint of the bridge of the nose located in the middle of the eyeglass frame 21, and this vertical distance corresponds to the front-to-back length of the user's head.

It is easy to understand that if the vertical distance _h2 is large, the eyeglass frame 21 may be far from the user's eyes when the contact surface 311 of the bone conduction speaker 31 can fit against the back of the ear. When the headphone eyeglass frame 21 is worn properly, the contact surface 311 of the bone conduction speaker 31 cannot fit properly against the back of the ear because it is far from the back of the ear. If the distance is small, when using the eyeglass function and the headphone function at the same time, the eyeglass frame 21 and the bone conduction speaker 31 will clamp the user's head too tightly at the front and back, causing discomfort to the user. Or, if the distance is too small, it may even be difficult to use the two functions at the same time.

The perpendicular distance _h2 from the center point of symmetry of the eyeglass frame 21 to the center point of the pivot point 2311 of the two hinges 231 can be 130-150mm, specifically 130mm, 140mm, 150mm, etc. It should be noted that different user groups can have different distance ranges. For example, the distance _h2 for men's frames can be 140-160mm, while for women's frames it can be 105-135mm. Alternatively, it can be set to a value between the two ranges to accommodate both groups.

Optionally, referring to Figures 20 and 21, the ratio of the distance h3 between the center point of the pivot 2311 of each hinge ₂₃₁ and the center point O of the mating surface 311 of the corresponding bone conduction speaker 31 to the perpendicular distance _h2 of the line connecting the center point of the symmetry center of the eyeglass frame 21 to the center point of the pivot 2311 of the _two hinges 231 is _0.1 to 1.5.

The distance _h3 between the center point of the pivot 2311 of each hinge 231 and the center point O of the contact surface 311 of the corresponding bone conduction speaker 31 corresponds to the distance between the center point of the pivot 2311 of the hinge 231 and the contact surface 311 and the back of the user's auricle; while the vertical distance _h2 between the symmetrical center point of the eyeglass frame 21 and the line connecting the center points of the pivot 2311 of the two hinges 231 corresponds to the vertical distance from the front of the user's head to the back of the ear. When the vertical distance from the front of the user's head to the back of the ear is constant, if the distance from the center point of the pivot 2311 of the hinge 231 to the contact point between the contact surface 311 and the back of the user's auricle is large, that is, when the aforementioned ratio is large, it indicates that the distance between the center point of the pivot 2311 of the hinge 231 and the center point O of the contact surface 311 of the corresponding bone conduction speaker 31 is large, and the bone conduction speaker 31 is more likely to be contacted at a lower part of the back of the auricle; while when the aforementioned ratio is small, it indicates that the distance between the center point of the pivot 2311 of the hinge 231 and the center point O of the contact surface 311 of the corresponding bone conduction speaker 31 is small, and the bone conduction speaker 31 is more likely to be contacted at a higher part of the back of the auricle, which will affect the sound/vibration transmission efficiency of the bone conduction speaker 31, and thus affect the sound quality.

The ratio of _h3 / _h2 can also be 0.125 to 0.35, such as 0.125, 0.15, 0.20, 0.25, 0.30, 0.35, etc. Different ratios can be designed according to different user needs, and no limit is imposed here.

Furthermore, different specifications of bone conduction sound devices can be set according to the different parameters mentioned above, so that users can choose according to their head shape to meet their usage needs.

The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

An electronic component and glasses

Technical Field

Background Technology

Summary of the Invention

Attached Figure Description

Figure 3 is an enlarged view of part A in Figure 2;

Figure 5 is an enlarged view of part B in Figure 4;

Figure 11 is a cross-sectional view along the D-D axis in Figure 9;

Detailed Implementation

Technical Field

Background Technology

Summary of the Invention

Attached Figure Description

Figure 3 is an enlarged view of part A in Figure 2;

Figure 5 is an enlarged view of part B in Figure 4;

Figure 11 is a cross-sectional view along the D-D axis in Figure 9;

Detailed Implementation

Claims

1. An electronic component, characterized in that the electronic component comprises:

A receiving body having a cavity having at least one opening, the receiving body including an opening edge for defining the opening;

A cover is placed over the opening to seal the cavity;

The cover includes a rigid support and a soft cover layer integrally injection-molded onto the surface of the support. The support is used for physical connection with the receiving body, and the support includes a covering portion. After the support is connected to the receiving body, the covering portion is pressed against the inner region of the opening edge near the opening. The cover layer covers the outer surface of the covering portion away from the receiving body and is pressed against the outer region surrounding the inner region of the opening edge to achieve a seal with the opening edge. The contact end faces of the covering portion and the opening edge and the contact end faces of the cover layer and the opening edge are flush with each other, or the cover layer further extends between the covering portion and the inner region of the opening edge and is pressed against the inner region of the opening edge by the covering portion. The support is made of plastic.

2. The electronic component according to claim 1, wherein the shape of the bracket facing the receiving body matches the opening to engage with the opening.

3. The electronic component according to claim 2, characterized in that,

The bracket also includes an insertion part, the covering part covers the opening, the insertion part is disposed on one side of the covering part and extends into the cavity along the inner wall of the cavity to fix the covering part on the opening.

4. The electronic component according to claim 2, characterized in that,

The electronic component also includes a circuit component disposed within the cavity, and the circuit component is provided with a switch;

The bracket is provided with a switch hole corresponding to the switch. The cover layer covers the switch hole and is provided with a pressing part at the position corresponding to the switch hole. The pressing part extends into the cavity through the switch hole. When the corresponding position of the cover layer is pressed, the pressing part presses against the switch on the circuit assembly, thereby triggering the circuit assembly to perform a preset function.

5. The electronic component according to claim 4, wherein the circuit component is further provided with a light-emitting element, the bracket is provided with a light-emitting hole corresponding to the light-emitting element, the cover layer covers the light-emitting hole, and the thickness of the cover layer corresponding to the area of the light-emitting hole is set to allow the light generated by the light-emitting element to be transmitted through the cover layer.

6. The electronic component according to claim 4, characterized in that the circuit component is further provided with a first microphone element, the bracket is provided with a microphone hole, the cover layer is provided with a first sound guide hole corresponding to the microphone hole, and a first sound blocker is provided at the position corresponding to the microphone hole, the first sound blocker extends toward the interior of the cavity through the microphone hole and defines a sound guide channel, one end of the sound guide channel is connected to the first sound guide hole on the cover layer, and the first microphone element is inserted into the sound guide channel from the other end of the sound guide channel.

7. A pair of eyeglasses, characterized in that the eyeglasses comprise: an eyeglass frame, the eyeglass frame including an eyeglass frame and two eyeglass temples, the eyeglass temples including temple bodies connected to the eyeglass frame, at least one of the temple bodies including an electronic component as described in any one of claims 1-6, and the accommodating body being at least a portion of the temple body.

8. The eyeglasses according to claim 7, wherein the temple further comprises a connecting member hinged to the end of the temple body away from the eyeglass frame via a hinge;

The glasses also include a bone conduction speaker, which is disposed on the connector. The connector is configured such that the bone conduction speaker can switch between a first relatively fixed position and a second relatively fixed position relative to the temple body, and can fit against the back of the user's ear when the bone conduction speaker is in the first relatively fixed position.

The receiving body of the temple body is located on the side of the temple body close to the eyeglass frame. The temple body further includes a rod-shaped member extending from the receiving body to the connector. The rod-shaped member is provided with a weight-reducing groove. The cover layer further extends outward from the bracket to cover and seal the weight-reducing groove.