HK1244994A1 - Anisotropic connection structure - Google Patents
Anisotropic connection structureInfo
- Publication number
- HK1244994A1 HK1244994A1 HK18104097.4A HK18104097A HK1244994A1 HK 1244994 A1 HK1244994 A1 HK 1244994A1 HK 18104097 A HK18104097 A HK 18104097A HK 1244994 A1 HK1244994 A1 HK 1244994A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- connection structure
- anisotropic connection
- anisotropic
- connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015058069A JP6512632B2 (en) | 2015-03-20 | 2015-03-20 | ANISOTROPY CONNECTED STRUCTURE AND METHOD FOR MANUFACTURING ANISOTROPY CONNECTED STRUCTURE |
PCT/JP2016/056610 WO2016152441A1 (en) | 2015-03-20 | 2016-03-03 | Anisotropic connection structure |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1244994A1 true HK1244994A1 (en) | 2018-08-17 |
Family
ID=56977307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18104097.4A HK1244994A1 (en) | 2015-03-20 | 2018-03-26 | Anisotropic connection structure |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6512632B2 (en) |
KR (1) | KR102092615B1 (en) |
CN (1) | CN107409467B (en) |
HK (1) | HK1244994A1 (en) |
TW (1) | TWI708413B (en) |
WO (1) | WO2016152441A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7313913B2 (en) * | 2018-06-06 | 2023-07-25 | デクセリアルズ株式会社 | Connection body, manufacturing method of connection body, connection method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3193457B2 (en) * | 1992-06-17 | 2001-07-30 | ジーイー横河メディカルシステム株式会社 | MR device and diffusion measuring device |
US6621766B2 (en) * | 2001-08-01 | 2003-09-16 | Fossil, Inc. | Flexible timepiece in multiple environments |
JP3910527B2 (en) | 2002-03-13 | 2007-04-25 | シャープ株式会社 | Liquid crystal display device and manufacturing method thereof |
JP4389447B2 (en) * | 2003-01-28 | 2009-12-24 | セイコーエプソン株式会社 | Manufacturing method of electro-optical device |
JP2006278637A (en) * | 2005-03-29 | 2006-10-12 | Sharp Corp | Substrate packaging structure and display |
JP5040920B2 (en) * | 2006-10-18 | 2012-10-03 | 日本電気株式会社 | Circuit board device and circuit board module device |
JP2008165219A (en) | 2006-12-08 | 2008-07-17 | Bridgestone Corp | Flexible driver ic |
JP5039427B2 (en) | 2007-05-08 | 2012-10-03 | 株式会社ブリヂストン | Mounting method of flexible driver IC and flexible driver IC |
JP2008281638A (en) | 2007-05-08 | 2008-11-20 | Bridgestone Corp | Method for mounting flexible driver ic and flexible driver ic |
KR101878251B1 (en) * | 2011-04-08 | 2018-07-13 | 삼성전자주식회사 | Bending sensor and fabrication method thereof |
TWI547369B (en) * | 2011-05-27 | 2016-09-01 | 康寧公司 | Glass-plastic laminate device, processing line and methods therefor |
JP5508480B2 (en) * | 2011-07-06 | 2014-05-28 | 積水化学工業株式会社 | Anisotropic conductive paste, connection structure, and manufacturing method of connection structure |
JP5887790B2 (en) * | 2011-09-21 | 2016-03-16 | ソニー株式会社 | Display device and electronic device |
US8780568B2 (en) * | 2011-12-28 | 2014-07-15 | Panasonic Corporation | Flexible display device |
JP5910106B2 (en) * | 2012-01-23 | 2016-04-27 | 大日本印刷株式会社 | Touch panel module and display device with touch panel |
JP2013160942A (en) * | 2012-02-06 | 2013-08-19 | Sony Corp | Semiconductor device, method of manufacturing the same, and electronic apparatus |
JP2013210491A (en) * | 2012-03-30 | 2013-10-10 | Sony Corp | Display device and electronic apparatus |
KR101889008B1 (en) * | 2012-06-11 | 2018-08-20 | 삼성전자주식회사 | Flexible display apparatus and control method thereof |
US8960899B2 (en) * | 2012-09-26 | 2015-02-24 | Google Inc. | Assembling thin silicon chips on a contact lens |
EP2743785B1 (en) * | 2012-12-17 | 2014-12-17 | The Swatch Group Research and Development Ltd. | Flexible portable electronic device |
US9348362B2 (en) * | 2013-02-08 | 2016-05-24 | Samsung Electronics Co., Ltd. | Flexible portable terminal |
CN109375710A (en) * | 2013-05-22 | 2019-02-22 | 松下知识产权经营株式会社 | Wearable device |
JP3193457U (en) * | 2014-07-24 | 2014-10-02 | 双葉電子工業株式会社 | Organic EL display element |
-
2015
- 2015-03-20 JP JP2015058069A patent/JP6512632B2/en active Active
-
2016
- 2016-03-03 KR KR1020177024610A patent/KR102092615B1/en active IP Right Grant
- 2016-03-03 WO PCT/JP2016/056610 patent/WO2016152441A1/en active Application Filing
- 2016-03-03 CN CN201680014091.1A patent/CN107409467B/en active Active
- 2016-03-09 TW TW105107194A patent/TWI708413B/en active
-
2018
- 2018-03-26 HK HK18104097.4A patent/HK1244994A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201637260A (en) | 2016-10-16 |
JP2016178226A (en) | 2016-10-06 |
CN107409467B (en) | 2019-08-06 |
TWI708413B (en) | 2020-10-21 |
JP6512632B2 (en) | 2019-05-15 |
KR20170113621A (en) | 2017-10-12 |
WO2016152441A1 (en) | 2016-09-29 |
KR102092615B1 (en) | 2020-03-24 |
CN107409467A (en) | 2017-11-28 |
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