HK1244994A1 - Anisotropic connection structure - Google Patents

Anisotropic connection structure

Info

Publication number
HK1244994A1
HK1244994A1 HK18104097.4A HK18104097A HK1244994A1 HK 1244994 A1 HK1244994 A1 HK 1244994A1 HK 18104097 A HK18104097 A HK 18104097A HK 1244994 A1 HK1244994 A1 HK 1244994A1
Authority
HK
Hong Kong
Prior art keywords
connection structure
anisotropic connection
anisotropic
connection
Prior art date
Application number
HK18104097.4A
Other languages
Chinese (zh)
Inventor
Koji Ejima
Kenichi Hirayama
Hiromi Kubode
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1244994A1 publication Critical patent/HK1244994A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
HK18104097.4A 2015-03-20 2018-03-26 Anisotropic connection structure HK1244994A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015058069A JP6512632B2 (en) 2015-03-20 2015-03-20 ANISOTROPY CONNECTED STRUCTURE AND METHOD FOR MANUFACTURING ANISOTROPY CONNECTED STRUCTURE
PCT/JP2016/056610 WO2016152441A1 (en) 2015-03-20 2016-03-03 Anisotropic connection structure

Publications (1)

Publication Number Publication Date
HK1244994A1 true HK1244994A1 (en) 2018-08-17

Family

ID=56977307

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18104097.4A HK1244994A1 (en) 2015-03-20 2018-03-26 Anisotropic connection structure

Country Status (6)

Country Link
JP (1) JP6512632B2 (en)
KR (1) KR102092615B1 (en)
CN (1) CN107409467B (en)
HK (1) HK1244994A1 (en)
TW (1) TWI708413B (en)
WO (1) WO2016152441A1 (en)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3193457B2 (en) * 1992-06-17 2001-07-30 ジーイー横河メディカルシステム株式会社 MR device and diffusion measuring device
US6621766B2 (en) * 2001-08-01 2003-09-16 Fossil, Inc. Flexible timepiece in multiple environments
JP3910527B2 (en) 2002-03-13 2007-04-25 シャープ株式会社 Liquid crystal display device and manufacturing method thereof
JP4389447B2 (en) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 Manufacturing method of electro-optical device
JP2006278637A (en) * 2005-03-29 2006-10-12 Sharp Corp Substrate packaging structure and display
CN101530007B (en) * 2006-10-18 2011-06-01 日本电气株式会社 Circuit substrate device and circuit substrate module device
JP2008165219A (en) 2006-12-08 2008-07-17 Bridgestone Corp Flexible driver ic
JP2008281638A (en) 2007-05-08 2008-11-20 Bridgestone Corp Method for mounting flexible driver ic and flexible driver ic
JP5039427B2 (en) 2007-05-08 2012-10-03 株式会社ブリヂストン Mounting method of flexible driver IC and flexible driver IC
KR101878251B1 (en) * 2011-04-08 2018-07-13 삼성전자주식회사 Bending sensor and fabrication method thereof
TWI547369B (en) * 2011-05-27 2016-09-01 康寧公司 Glass-plastic laminate device, processing line and methods therefor
JP5508480B2 (en) * 2011-07-06 2014-05-28 積水化学工業株式会社 Anisotropic conductive paste, connection structure, and manufacturing method of connection structure
JP5887790B2 (en) * 2011-09-21 2016-03-16 ソニー株式会社 Display device and electronic device
US8780568B2 (en) * 2011-12-28 2014-07-15 Panasonic Corporation Flexible display device
JP5910106B2 (en) * 2012-01-23 2016-04-27 大日本印刷株式会社 Touch panel module and display device with touch panel
JP2013160942A (en) * 2012-02-06 2013-08-19 Sony Corp Semiconductor device, method of manufacturing the same, and electronic apparatus
JP2013210491A (en) * 2012-03-30 2013-10-10 Sony Corp Display device and electronic apparatus
KR101889008B1 (en) * 2012-06-11 2018-08-20 삼성전자주식회사 Flexible display apparatus and control method thereof
US8960899B2 (en) * 2012-09-26 2015-02-24 Google Inc. Assembling thin silicon chips on a contact lens
EP2743785B1 (en) * 2012-12-17 2014-12-17 The Swatch Group Research and Development Ltd. Flexible portable electronic device
US9348362B2 (en) * 2013-02-08 2016-05-24 Samsung Electronics Co., Ltd. Flexible portable terminal
JP6376355B2 (en) * 2013-05-22 2018-08-22 パナソニックＩｐマネジメント株式会社 Wearable equipment
JP3193457U (en) * 2014-07-24 2014-10-02 双葉電子工業株式会社 Organic EL display element

Also Published As

Publication number Publication date
TWI708413B (en) 2020-10-21
KR102092615B1 (en) 2020-03-24
TW201637260A (en) 2016-10-16
CN107409467B (en) 2019-08-06
WO2016152441A1 (en) 2016-09-29
JP6512632B2 (en) 2019-05-15
CN107409467A (en) 2017-11-28
JP2016178226A (en) 2016-10-06
KR20170113621A (en) 2017-10-12

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