HK1190362A1 - Substrate bumping machine flux supply mechanism - Google Patents

Substrate bumping machine flux supply mechanism

Info

Publication number
HK1190362A1
HK1190362A1 HK14103445.9A HK14103445A HK1190362A1 HK 1190362 A1 HK1190362 A1 HK 1190362A1 HK 14103445 A HK14103445 A HK 14103445A HK 1190362 A1 HK1190362 A1 HK 1190362A1
Authority
HK
Hong Kong
Prior art keywords
supply mechanism
flux supply
machine flux
bumping machine
substrate bumping
Prior art date
Application number
HK14103445.9A
Other languages
Chinese (zh)
Inventor
劉勁松林海濤任永軍
Original Assignee
上海微松工業自動化有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海微松工業自動化有限公司 filed Critical 上海微松工業自動化有限公司
Publication of HK1190362A1 publication Critical patent/HK1190362A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
HK14103445.9A 2013-12-09 2014-04-10 Substrate bumping machine flux supply mechanism HK1190362A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310660739.0A CN103612045B (en) 2013-12-09 2013-12-09 Soldering flux supply mechanism for substrate ball mounter

Publications (1)

Publication Number Publication Date
HK1190362A1 true HK1190362A1 (en) 2014-07-04

Family

ID=50162779

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14103445.9A HK1190362A1 (en) 2013-12-09 2014-04-10 Substrate bumping machine flux supply mechanism

Country Status (2)

Country Link
CN (1) CN103612045B (en)
HK (1) HK1190362A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103871915B (en) * 2014-03-24 2016-08-17 上海微松工业自动化有限公司 Manually BGA ball attachment machine
CN107946209B (en) * 2017-11-15 2020-06-23 唐人制造（宁波）有限公司 Device glue dipping alignment device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1306923B1 (en) * 1999-01-07 2001-10-11 Cmp Spa VERTICAL GLUING MACHINE FOR PLANTS FOR THE PRODUCTION OF PANEL PANELS
CN201848618U (en) * 2010-09-01 2011-06-01 东莞市众信电子涂装自动化设备厂(普通合伙) Full-automatic soldering machine
CN102059850B (en) * 2010-11-16 2012-01-25 汤志 Printing press scraper device
CN202264000U (en) * 2011-09-15 2012-06-06 中山市三礼电子有限公司 Full-automatic tin soldering machine
CN102765598A (en) * 2012-08-07 2012-11-07 湖北东神楚天化工有限公司 Conveying device with automatic drain separator mechanism
CN203610857U (en) * 2013-12-09 2014-05-28 上海微松工业自动化有限公司 Scaling powder supplying mechanism of substrate ball mounter

Also Published As

Publication number Publication date
CN103612045A (en) 2014-03-05
CN103612045B (en) 2015-04-29

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