HK1117865A1 - Heat conductive paste - Google Patents

Heat conductive paste

Info

Publication number
HK1117865A1
HK1117865A1 HK08108697.1A HK08108697A HK1117865A1 HK 1117865 A1 HK1117865 A1 HK 1117865A1 HK 08108697 A HK08108697 A HK 08108697A HK 1117865 A1 HK1117865 A1 HK 1117865A1
Authority
HK
Hong Kong
Prior art keywords
conductive paste
heat conductive
paste
heat
conductive
Prior art date
Application number
HK08108697.1A
Inventor
Kiyoshi Iwai
Hiroaki Umeda
Original Assignee
Tatsuta System Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta System Electronics Co Ltd filed Critical Tatsuta System Electronics Co Ltd
Publication of HK1117865A1 publication Critical patent/HK1117865A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
HK08108697.1A 2006-09-13 2008-08-07 Heat conductive paste HK1117865A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006248357A JP4351239B2 (en) 2006-09-13 2006-09-13 Thermal conductive paste

Publications (1)

Publication Number Publication Date
HK1117865A1 true HK1117865A1 (en) 2009-01-23

Family

ID=39206747

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08108697.1A HK1117865A1 (en) 2006-09-13 2008-08-07 Heat conductive paste

Country Status (5)

Country Link
JP (1) JP4351239B2 (en)
KR (1) KR101369047B1 (en)
CN (1) CN101144007B (en)
HK (1) HK1117865A1 (en)
TW (1) TWI475080B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100109791A (en) 2009-04-01 2010-10-11 주식회사 동진쎄미켐 Paste composition used for forming an electrode or wiring which is curable at a low temperature
KR101410058B1 (en) * 2011-12-16 2014-06-23 주식회사 유니코정밀화학 Environment friendly heat-dissipating resin composition having excellent heat-dissipating property and steel sheet using the same
KR101294672B1 (en) * 2012-03-30 2013-08-09 엘지전자 주식회사 Thermal interface material and manufacturing method for thereof
KR102603421B1 (en) * 2019-01-22 2023-11-17 양쯔 메모리 테크놀로지스 씨오., 엘티디. Integrated circuit packaging structure and manufacturing method thereof
CN116606528B (en) * 2023-07-18 2023-09-29 成都上泰科技有限公司 Toughening modified epoxy resin high polymer for wide bandgap semiconductor packaging and preparation method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3792327B2 (en) * 1996-12-24 2006-07-05 日立化成工業株式会社 Thermally conductive adhesive composition and thermally conductive adhesive film using the composition
JP2001181482A (en) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd Resin paste composition and semi-conductor device using the same
JP2002012738A (en) * 2000-06-28 2002-01-15 Hitachi Chem Co Ltd Resin paste composition and semiconductor device made therewith
ATE518922T1 (en) * 2000-10-11 2011-08-15 Chemetall Gmbh METHOD FOR THE PRETREATMENT OR/AND COATING OF METAL SURFACES PRIOR TO FORMING WITH A PAINT-LIKE COATING AND USE OF THE SUCH COATED SUBSTRATES
JP4752109B2 (en) * 2000-12-12 2011-08-17 日立化成工業株式会社 Resin paste composition and semiconductor device using the same
DE50210398D1 (en) * 2001-03-30 2007-08-16 Degussa Silicon organic nano-microhybrid systems or micro hybrid systems containing composition for scratch and abrasion resistant coatings
JP3911690B2 (en) * 2001-07-19 2007-05-09 山栄化学株式会社 Thermosetting resin composition, smooth plate manufacturing method and smooth plate
JP2004168907A (en) * 2002-11-20 2004-06-17 Sumitomo Bakelite Co Ltd Die attach paste and semiconductor device
JP2004168922A (en) * 2002-11-21 2004-06-17 Sumitomo Bakelite Co Ltd Die attach paste and semiconductor device
JP2004217861A (en) * 2003-01-17 2004-08-05 Hitachi Chem Co Ltd Heat-resistant adhesive, laminate using this adhesive, heat sink with adhesive, and metal foil with adhesive
JP4635423B2 (en) * 2003-09-11 2011-02-23 住友ベークライト株式会社 Resin paste for semiconductor and semiconductor device
JP4213616B2 (en) * 2004-03-31 2009-01-21 大日本印刷株式会社 Base film for liquid crystal panel, functional film for liquid crystal panel, method for producing functional film, and apparatus for producing functional film
JP4534716B2 (en) * 2004-10-26 2010-09-01 日立化成工業株式会社 Circuit connection material, circuit terminal connection structure and connection method
JP4639766B2 (en) * 2004-11-16 2011-02-23 横浜ゴム株式会社 Two-component room temperature curable epoxy resin composition and metal adhesive composition

Also Published As

Publication number Publication date
TW200817481A (en) 2008-04-16
KR20080024444A (en) 2008-03-18
CN101144007B (en) 2012-11-14
CN101144007A (en) 2008-03-19
KR101369047B1 (en) 2014-02-28
JP4351239B2 (en) 2009-10-28
JP2008069238A (en) 2008-03-27
TWI475080B (en) 2015-03-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180911