HK1117865A1 - Heat conductive paste - Google Patents
Heat conductive pasteInfo
- Publication number
- HK1117865A1 HK1117865A1 HK08108697.1A HK08108697A HK1117865A1 HK 1117865 A1 HK1117865 A1 HK 1117865A1 HK 08108697 A HK08108697 A HK 08108697A HK 1117865 A1 HK1117865 A1 HK 1117865A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- conductive paste
- heat conductive
- paste
- heat
- conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006248357A JP4351239B2 (en) | 2006-09-13 | 2006-09-13 | Thermal conductive paste |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1117865A1 true HK1117865A1 (en) | 2009-01-23 |
Family
ID=39206747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08108697.1A HK1117865A1 (en) | 2006-09-13 | 2008-08-07 | Heat conductive paste |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4351239B2 (en) |
KR (1) | KR101369047B1 (en) |
CN (1) | CN101144007B (en) |
HK (1) | HK1117865A1 (en) |
TW (1) | TWI475080B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100109791A (en) | 2009-04-01 | 2010-10-11 | 주식회사 동진쎄미켐 | Paste composition used for forming an electrode or wiring which is curable at a low temperature |
KR101410058B1 (en) * | 2011-12-16 | 2014-06-23 | 주식회사 유니코정밀화학 | Environment friendly heat-dissipating resin composition having excellent heat-dissipating property and steel sheet using the same |
KR101294672B1 (en) * | 2012-03-30 | 2013-08-09 | 엘지전자 주식회사 | Thermal interface material and manufacturing method for thereof |
KR102603421B1 (en) * | 2019-01-22 | 2023-11-17 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | Integrated circuit packaging structure and manufacturing method thereof |
CN116606528B (en) * | 2023-07-18 | 2023-09-29 | 成都上泰科技有限公司 | Toughening modified epoxy resin high polymer for wide bandgap semiconductor packaging and preparation method thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3792327B2 (en) * | 1996-12-24 | 2006-07-05 | 日立化成工業株式会社 | Thermally conductive adhesive composition and thermally conductive adhesive film using the composition |
JP2001181482A (en) * | 1999-12-27 | 2001-07-03 | Hitachi Chem Co Ltd | Resin paste composition and semi-conductor device using the same |
JP2002012738A (en) * | 2000-06-28 | 2002-01-15 | Hitachi Chem Co Ltd | Resin paste composition and semiconductor device made therewith |
ATE518922T1 (en) * | 2000-10-11 | 2011-08-15 | Chemetall Gmbh | METHOD FOR THE PRETREATMENT OR/AND COATING OF METAL SURFACES PRIOR TO FORMING WITH A PAINT-LIKE COATING AND USE OF THE SUCH COATED SUBSTRATES |
JP4752109B2 (en) * | 2000-12-12 | 2011-08-17 | 日立化成工業株式会社 | Resin paste composition and semiconductor device using the same |
DE50210398D1 (en) * | 2001-03-30 | 2007-08-16 | Degussa | Silicon organic nano-microhybrid systems or micro hybrid systems containing composition for scratch and abrasion resistant coatings |
JP3911690B2 (en) * | 2001-07-19 | 2007-05-09 | 山栄化学株式会社 | Thermosetting resin composition, smooth plate manufacturing method and smooth plate |
JP2004168907A (en) * | 2002-11-20 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Die attach paste and semiconductor device |
JP2004168922A (en) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Die attach paste and semiconductor device |
JP2004217861A (en) * | 2003-01-17 | 2004-08-05 | Hitachi Chem Co Ltd | Heat-resistant adhesive, laminate using this adhesive, heat sink with adhesive, and metal foil with adhesive |
JP4635423B2 (en) * | 2003-09-11 | 2011-02-23 | 住友ベークライト株式会社 | Resin paste for semiconductor and semiconductor device |
JP4213616B2 (en) * | 2004-03-31 | 2009-01-21 | 大日本印刷株式会社 | Base film for liquid crystal panel, functional film for liquid crystal panel, method for producing functional film, and apparatus for producing functional film |
JP4534716B2 (en) * | 2004-10-26 | 2010-09-01 | 日立化成工業株式会社 | Circuit connection material, circuit terminal connection structure and connection method |
JP4639766B2 (en) * | 2004-11-16 | 2011-02-23 | 横浜ゴム株式会社 | Two-component room temperature curable epoxy resin composition and metal adhesive composition |
-
2006
- 2006-09-13 JP JP2006248357A patent/JP4351239B2/en not_active Expired - Fee Related
-
2007
- 2007-08-10 TW TW096129651A patent/TWI475080B/en not_active IP Right Cessation
- 2007-09-05 KR KR1020070089944A patent/KR101369047B1/en not_active IP Right Cessation
- 2007-09-13 CN CN2007101547148A patent/CN101144007B/en not_active Expired - Fee Related
-
2008
- 2008-08-07 HK HK08108697.1A patent/HK1117865A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200817481A (en) | 2008-04-16 |
KR20080024444A (en) | 2008-03-18 |
CN101144007B (en) | 2012-11-14 |
CN101144007A (en) | 2008-03-19 |
KR101369047B1 (en) | 2014-02-28 |
JP4351239B2 (en) | 2009-10-28 |
JP2008069238A (en) | 2008-03-27 |
TWI475080B (en) | 2015-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20180911 |