HK1114185A1 - Method for imprint lithography at constant temperature - Google Patents

Method for imprint lithography at constant temperature

Info

Publication number
HK1114185A1
HK1114185A1 HK08103894.3A HK08103894A HK1114185A1 HK 1114185 A1 HK1114185 A1 HK 1114185A1 HK 08103894 A HK08103894 A HK 08103894A HK 1114185 A1 HK1114185 A1 HK 1114185A1
Authority
HK
Hong Kong
Prior art keywords
constant temperature
imprint lithography
imprint
lithography
constant
Prior art date
Application number
HK08103894.3A
Inventor
Marc Beck
Babak Heidari
Erik Bolmsjoe
Erik Theander
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP04445057.5A external-priority patent/EP1594001B1/en
Application filed by Obducat Ab filed Critical Obducat Ab
Publication of HK1114185A1 publication Critical patent/HK1114185A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
HK08103894.3A 2004-05-07 2008-04-08 Method for imprint lithography at constant temperature HK1114185A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04445057.5A EP1594001B1 (en) 2004-05-07 2004-05-07 Device and method for imprint lithography
US52156204P 2004-05-25 2004-05-25
PCT/EP2004/053106 WO2005109095A2 (en) 2004-05-07 2004-11-25 Method for imprint lithography at constant temperature

Publications (1)

Publication Number Publication Date
HK1114185A1 true HK1114185A1 (en) 2008-10-24

Family

ID=35320858

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08103894.3A HK1114185A1 (en) 2004-05-07 2008-04-08 Method for imprint lithography at constant temperature

Country Status (3)

Country Link
JP (1) JP4879511B2 (en)
KR (1) KR101166278B1 (en)
HK (1) HK1114185A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101171190B1 (en) 2005-11-02 2012-08-06 삼성전자주식회사 Manufacturing method of dsplay device and mold therefor
KR100776633B1 (en) 2006-06-21 2007-11-15 이우영 Imprint system and imprinting method using the same
US7854877B2 (en) * 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
JP4578517B2 (en) 2007-12-26 2010-11-10 Ｓｃｉｖａｘ株式会社 Imprint apparatus and imprint method
KR100982110B1 (en) * 2008-08-21 2010-09-14 성균관대학교산학협력단 Method of fabricating a ultra fine pattern using a organometallic solution
JP5388539B2 (en) * 2008-10-28 2014-01-15 旭化成イーマテリアルズ株式会社 Pattern formation method
JP5319326B2 (en) 2009-02-25 2013-10-16 株式会社東芝 Method for forming uneven pattern and sheet for forming uneven pattern
JP2012220346A (en) * 2011-04-08 2012-11-12 Institute Of National Colleges Of Technology Japan Hardness tester and imprint device
US10203597B2 (en) * 2013-11-22 2019-02-12 Soken Chemical & Engineering Co., Ltd. Structure-manufacturing method using step-and-repeat imprinting technique
JP6421980B2 (en) * 2015-03-02 2018-11-14 パナソニックＩｐマネジメント株式会社 Imprint device
KR20160111697A (en) 2015-03-17 2016-09-27 권은순 Flexible control panel device of the vehicle

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190929B1 (en) 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays

Also Published As

Publication number Publication date
KR20070010195A (en) 2007-01-22
JP2006013453A (en) 2006-01-12
JP4879511B2 (en) 2012-02-22
KR101166278B1 (en) 2012-07-17

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