HK1085428A1 - System and method for bending a substantially rigid substrate - Google Patents

System and method for bending a substantially rigid substrate

Info

Publication number
HK1085428A1
HK1085428A1 HK06106548.8A HK06106548A HK1085428A1 HK 1085428 A1 HK1085428 A1 HK 1085428A1 HK 06106548 A HK06106548 A HK 06106548A HK 1085428 A1 HK1085428 A1 HK 1085428A1
Authority
HK
Hong Kong
Prior art keywords
bending
substantially rigid
rigid substrate
substrate
rigid
Prior art date
Application number
HK06106548.8A
Inventor
David Fiedler
David W Currier
Horace M Long
James V Lowery
Original Assignee
Motorola Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Solutions Inc filed Critical Motorola Solutions Inc
Publication of HK1085428A1 publication Critical patent/HK1085428A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/02—Bending or folding
    • B29C53/04—Bending or folding of plates or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Structure Of Printed Boards (AREA)
HK06106548.8A 2003-03-14 2006-06-07 System and method for bending a substantially rigid substrate HK1085428A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/389,105 US6908583B2 (en) 2003-03-14 2003-03-14 System and method for bending a substantially rigid substrate
PCT/US2004/003403 WO2004082923A1 (en) 2003-03-14 2004-02-05 System and method for bending a substantially rigid substrate

Publications (1)

Publication Number Publication Date
HK1085428A1 true HK1085428A1 (en) 2006-08-25

Family

ID=32962196

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06106548.8A HK1085428A1 (en) 2003-03-14 2006-06-07 System and method for bending a substantially rigid substrate

Country Status (6)

Country Link
US (1) US6908583B2 (en)
EP (1) EP1603732B1 (en)
JP (1) JP2006520276A (en)
CN (1) CN100349723C (en)
HK (1) HK1085428A1 (en)
WO (1) WO2004082923A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5016003B2 (en) * 2009-07-13 2012-09-05 巨騰國際控股有限公司 Method for molding U-shaped plastic sheet suitable for use in thin display device
ITMI20121591A1 (en) * 2012-09-25 2014-03-26 St Microelectronics Srl FLAT ELECTRICAL BOARD WITH FOLDABLE FLAPS AND COMPONENT DETECTION SYSTEM LONG THREE COORDINATED AXES OF INTERNAL FORCES IN A CONSTRUCTION MATERIAL PRODUCT
EP2891527B1 (en) * 2014-01-06 2016-05-04 dSPACE digital signal processing and control engineering GmbH Bending device for semiflex circuit boards
KR20180029458A (en) * 2016-09-12 2018-03-21 (주)디디피테크 Mold for bending metal printed circuit board
US10880995B2 (en) 2017-12-15 2020-12-29 2449049 Ontario Inc. Printed circuit board with stress relief zones for component and solder joint protection
JP6996811B2 (en) * 2019-05-16 2022-01-17 エーティーアンドエス オーストリア テクノロジー アンド システムテクニック アクツィエンゲゼルシャフト Bending resistant to breakage of component carriers, including rigid and flexible parts
CN111546613B (en) * 2020-04-30 2022-02-08 博众精工科技股份有限公司 Flexible flat cable heating and folding multi-angle mechanism
EP4221469A1 (en) * 2022-01-27 2023-08-02 thyssenkrupp Presta Aktiengesellschaft Method for manufacturing a control circuit for a steering system of a motor vehicle, method for manufacturing a steering system for a motor vehicle, control circuit for a steering system of a motor vehicle and steering system for a motor vehicle
KR102618552B1 (en) * 2023-04-24 2023-12-27 제이씨엘테크 주식회사 Pouch bending machine

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US3341742A (en) * 1965-02-18 1967-09-12 Burroughs Corp Circuit assembly
US4465453A (en) * 1982-11-23 1984-08-14 Rca Corporation Apparatus for manufacturing disc record package
JPS60149196A (en) * 1984-01-17 1985-08-06 ソニー株式会社 Printed board and method of producing same
FR2561952B1 (en) 1984-03-30 1992-08-14 Amada Co Ltd BENDING MACHINE AND SHAPE-CHANGING APPARATUS FOR SUCH A MACHINE
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate
JPS6466990A (en) * 1987-09-08 1989-03-13 Furukawa Electric Co Ltd Molded circuit board
US5008496A (en) * 1988-09-15 1991-04-16 Siemens Aktiengesellschaft Three-dimensional printed circuit board
US5015169A (en) * 1989-06-08 1991-05-14 General Electric Company Apparatus for die forming thermoplastic sheet material
US5170326A (en) * 1990-02-05 1992-12-08 Motorola, Inc. Electronic module assembly
DE4003344C1 (en) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
ES2072477T3 (en) * 1990-05-10 1995-07-16 Wegener Gmbh A PROCEDURE FOR BENDING PLATE SHAPED PARTS.
US5121297A (en) * 1990-12-31 1992-06-09 Compaq Computer Corporation Flexible printed circuits
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5434362A (en) * 1994-09-06 1995-07-18 Motorola, Inc. Flexible circuit board assembly and method
JP3487680B2 (en) 1995-06-20 2004-01-19 セイレイ工業株式会社 Root crop harvester pull-up conveyor
DE19607068A1 (en) * 1996-02-24 1997-08-28 Braun Ag Method and device for bending a component made of a thermoplastic and component itself
JPH09314655A (en) * 1996-05-31 1997-12-09 Aikoo:Kk Method and apparatus for bending processing of polycarbonate resin panel
US5998738A (en) * 1996-08-30 1999-12-07 Motorola Inc. Electronic control module
US5796050A (en) * 1997-02-05 1998-08-18 International Business Machines Corporation Flexible board having adhesive in surface channels
US5981870A (en) * 1997-05-15 1999-11-09 Chrysler Corporation Flexible circuit board interconnect with strain relief
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
US5963427A (en) * 1997-12-11 1999-10-05 Sun Microsystems, Inc. Multi-chip module with flexible circuit board
US5903440A (en) * 1998-01-30 1999-05-11 Delco Electronics Corporaiton Method of forming assemblies of circuit boards in different planes
US6146480A (en) * 1999-03-12 2000-11-14 Ga-Tek Inc. Flexible laminate for flexible circuit
US6292370B1 (en) * 1999-10-01 2001-09-18 Motorola, Inc. Flexible circuit board and method for making a flexible circuit board
US6477052B1 (en) * 2000-08-01 2002-11-05 Daimlerchrysler Corporation Multiple layer thin flexible circuit board

Also Published As

Publication number Publication date
US20040178539A1 (en) 2004-09-16
CN100349723C (en) 2007-11-21
US6908583B2 (en) 2005-06-21
CN1759001A (en) 2006-04-12
EP1603732B1 (en) 2012-10-17
JP2006520276A (en) 2006-09-07
EP1603732A1 (en) 2005-12-14
EP1603732A4 (en) 2010-08-11
WO2004082923A1 (en) 2004-09-30

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20240204