HK1063451A1 - Molding method of a handle made of synthetic resin - Google Patents

Molding method of a handle made of synthetic resin

Info

Publication number
HK1063451A1
HK1063451A1 HK04106277A HK04106277A HK1063451A1 HK 1063451 A1 HK1063451 A1 HK 1063451A1 HK 04106277 A HK04106277 A HK 04106277A HK 04106277 A HK04106277 A HK 04106277A HK 1063451 A1 HK1063451 A1 HK 1063451A1
Authority
HK
Hong Kong
Prior art keywords
synthetic resin
molding method
handle made
handle
molding
Prior art date
Application number
HK04106277A
Inventor
Masakazu Hoshikawa
Original Assignee
Hoshipura Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoshipura Co Ltd filed Critical Hoshipura Co Ltd
Publication of HK1063451A1 publication Critical patent/HK1063451A1/en

Links

HK04106277A 2002-12-09 2004-08-23 Molding method of a handle made of synthetic resin HK1063451A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002357240A JP3705595B2 (en) 2002-12-09 2002-12-09 Molding method of synthetic resin handle

Publications (1)

Publication Number Publication Date
HK1063451A1 true HK1063451A1 (en) 2004-12-31

Family

ID=32757331

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04106277A HK1063451A1 (en) 2002-12-09 2004-08-23 Molding method of a handle made of synthetic resin

Country Status (3)

Country Link
JP (1) JP3705595B2 (en)
CN (1) CN1283441C (en)
HK (1) HK1063451A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251712A (en) 2009-03-26 2010-11-04 Sony Corp Bi-section semiconductor laser device, method for manufacturing the same, and method for driving the same
JP2011187579A (en) 2010-03-05 2011-09-22 Sony Corp Mode-locked semiconductor laser element and driving method thereof
JP2011187580A (en) 2010-03-05 2011-09-22 Sony Corp Self-oscillation type semiconductor laser element and driving method of the same
JP5138023B2 (en) 2010-12-08 2013-02-06 ソニー株式会社 Semiconductor laser element
JP2012151210A (en) 2011-01-18 2012-08-09 Sony Corp Semiconductor laser device
CN102322176A (en) * 2011-06-30 2012-01-18 厦门建霖工业有限公司 Method for preparing imitation metal composite door handle
KR101566245B1 (en) * 2014-06-17 2015-11-05 (주)태양프라스틱 Knob of apparatus for folding the automobile seat and method of manufacturing it
DE102019210375A1 (en) * 2019-07-12 2021-01-14 Continental Teves Ag & Co. Ohg Method of manufacturing a robust sensor

Also Published As

Publication number Publication date
CN1506212A (en) 2004-06-23
CN1283441C (en) 2006-11-08
JP3705595B2 (en) 2005-10-12
JP2004188678A (en) 2004-07-08

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20230729