HK1036354A1 - Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly. - Google Patents

Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly.

Info

Publication number
HK1036354A1
HK1036354A1 HK01106741A HK01106741A HK1036354A1 HK 1036354 A1 HK1036354 A1 HK 1036354A1 HK 01106741 A HK01106741 A HK 01106741A HK 01106741 A HK01106741 A HK 01106741A HK 1036354 A1 HK1036354 A1 HK 1036354A1
Authority
HK
Hong Kong
Prior art keywords
chip
manufacturing
suspension assembly
head suspension
head
Prior art date
Application number
HK01106741A
Inventor
Takao Matsumoto
Takeshi Wada
Masashi Shiraishi
Atsushi Hirose
Mitsuyoshi Kawai
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1036354A1 publication Critical patent/HK1036354A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Wire Bonding (AREA)
HK01106741A 1999-11-04 2001-09-25 Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly. HK1036354A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31373899A JP2001134916A (en) 1999-11-04 1999-11-04 Ic chip, head suspension assembly, and manufacturing method for manufacturing the head suspension assembly

Publications (1)

Publication Number Publication Date
HK1036354A1 true HK1036354A1 (en) 2001-12-28

Family

ID=18044942

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01106741A HK1036354A1 (en) 1999-11-04 2001-09-25 Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly.

Country Status (4)

Country Link
JP (1) JP2001134916A (en)
CN (1) CN1188839C (en)
HK (1) HK1036354A1 (en)
SG (1) SG90178A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660640B2 (en) 2001-07-02 2005-06-15 アルプス電気株式会社 Chip-on-suspension type magnetic head and manufacturing method thereof
JP2007227965A (en) * 2007-04-25 2007-09-06 Athlete Fa Kk Bonding method
JP2008307710A (en) 2007-06-12 2008-12-25 Canon Inc Inkjet recording head, method for manufacturing inkjet recording head and mounting tool for inkjet recording head
JP5681376B2 (en) * 2010-04-20 2015-03-04 日東電工株式会社 Manufacturing method of semiconductor device and flip chip type semiconductor device
JP5681377B2 (en) * 2010-04-20 2015-03-04 日東電工株式会社 Manufacturing method of semiconductor device and flip chip type semiconductor device
JP5681375B2 (en) * 2010-04-20 2015-03-04 日東電工株式会社 Manufacturing method of semiconductor device and flip chip type semiconductor device
US9196533B2 (en) 2010-04-20 2015-11-24 Nitto Denko Corporation Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device
JP6379447B2 (en) * 2013-04-16 2018-08-29 凸版印刷株式会社 IC chip mounting method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765322A (en) * 1993-08-27 1995-03-10 Sanyo Electric Co Ltd Floating type thin film head and its production
ES2112169B1 (en) * 1994-07-13 1998-10-16 Sansung Electronics Co Ltd MANUFACTURE METHOD OF A MAGNETIC HEAD.
JPH08138223A (en) * 1994-11-10 1996-05-31 Hitachi Ltd Production of thin-film magnetic head slider
US5867888A (en) * 1996-10-08 1999-02-09 International Business Machines Corporation Magnetic head/silicon chip integration method

Also Published As

Publication number Publication date
JP2001134916A (en) 2001-05-18
CN1295319A (en) 2001-05-16
CN1188839C (en) 2005-02-09
SG90178A1 (en) 2002-07-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081102