GB992829A - - Google Patents

Abstract

992,829. Circuit assemblies. SPERRY RAND CORPORATION. Aug. 28, 1963 [Dec. 10, 1962], No. 34037/63. Heading H1R. In a circuit assembly comprising a stack of insulating layers 10, each having a pattern of conductors 12, 14 thereon, and an identical pattern of conductively lined holes therein, a heat-dissipating arrangement includes a plurality of electrically-insulated heat-conducting strips such as 20, 22, having conductive pins 30 spaced so as to fit into the pattern of apertures, while a plurality of encapsulated circuit units such as 50 have conductive leads 52 similarly spaced and connected to the pins 30. The units 50, each of which may comprise a plurality of components integrated in a semi-conductor wafer, fit between the heat-conducting strips 20, 22, which may be of aluminium with aluminium oxide coatings; the conductors 30 are located by fixing dividers to the strips 22, 24 or by cutting transverse notches in the strips. The stack of insulating layers is held in a frame comprising slotted side rails 32, 34, and end pieces 36, 38, the latter being notched at 44 to receive strips 20, 22, and the frame being held together by bolts 48. A heat-conductive cover plate 54 may be provided, and one assembly may be connected with another by means of flexible printed wiring 56.