GB9903081D0 - Improvements in or relating to the slicing of monocrystalline silicon ingots - Google Patents

Improvements in or relating to the slicing of monocrystalline silicon ingots

Info

Publication number
GB9903081D0
GB9903081D0 GBGB9903081.9A GB9903081A GB9903081D0 GB 9903081 D0 GB9903081 D0 GB 9903081D0 GB 9903081 A GB9903081 A GB 9903081A GB 9903081 D0 GB9903081 D0 GB 9903081D0
Authority
GB
United Kingdom
Prior art keywords
slicing
relating
monocrystalline silicon
silicon ingots
ingots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9903081.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Europe Ltd
Original Assignee
Shin Etsu Handotai Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Europe Ltd filed Critical Shin Etsu Handotai Europe Ltd
Priority to GBGB9903081.9A priority Critical patent/GB9903081D0/en
Publication of GB9903081D0 publication Critical patent/GB9903081D0/en
Priority to PCT/GB2000/000393 priority patent/WO2000047383A1/en
Priority to AU24479/00A priority patent/AU2447900A/en
Ceased legal-status Critical Current

Links

GBGB9903081.9A 1999-02-12 1999-02-12 Improvements in or relating to the slicing of monocrystalline silicon ingots Ceased GB9903081D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB9903081.9A GB9903081D0 (en) 1999-02-12 1999-02-12 Improvements in or relating to the slicing of monocrystalline silicon ingots
PCT/GB2000/000393 WO2000047383A1 (en) 1999-02-12 2000-02-10 Apparatus and process for the slicing of monocrystalline silicon ingots
AU24479/00A AU2447900A (en) 1999-02-12 2000-02-10 Apparatus and process for the slicing of monocrystalline silicon ingots

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9903081.9A GB9903081D0 (en) 1999-02-12 1999-02-12 Improvements in or relating to the slicing of monocrystalline silicon ingots

Publications (1)

Publication Number Publication Date
GB9903081D0 true GB9903081D0 (en) 1999-03-31

Family

ID=10847539

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9903081.9A Ceased GB9903081D0 (en) 1999-02-12 1999-02-12 Improvements in or relating to the slicing of monocrystalline silicon ingots

Country Status (3)

Country Link
AU (1) AU2447900A (en)
GB (1) GB9903081D0 (en)
WO (1) WO2000047383A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2777903B1 (en) * 2013-03-15 2017-07-26 Toyo Advanced Technologies Co., Ltd. ingot feeding system and method
FR3010922B1 (en) * 2013-09-24 2016-07-01 Commissariat Energie Atomique METHOD AND DEVICE FOR WIRED CUTTING OF A MATERIAL
EP3015238A1 (en) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Wire monitoring system
EP3015237A1 (en) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Wire monitoring system
CN111497045A (en) * 2020-04-24 2020-08-07 江苏晶科天晟能源有限公司 Optimized production process of solar monocrystalline silicon wafer
CN111873202A (en) * 2020-08-25 2020-11-03 青岛高测科技股份有限公司 Diamond wire cutting force measuring device and using method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228782A (en) * 1978-09-08 1980-10-21 Rca Corporation System for regulating the applied blade-to-boule force during the slicing of wafers
JPS5741118A (en) * 1980-08-22 1982-03-08 Sumitomo Electric Ind Ltd Cutting of work
DE3469498D1 (en) * 1984-06-27 1988-04-07 Meyer & Burger Ag Maschf Cutting machine with measuring device and utilization of this measuring device
JPH0687118A (en) * 1992-09-04 1994-03-29 Nippon Steel Corp Cutting method with wire saw
JP2885270B2 (en) * 1995-06-01 1999-04-19 信越半導体株式会社 Wire saw device and work cutting method
JP2891187B2 (en) * 1995-06-22 1999-05-17 信越半導体株式会社 Wire saw device and cutting method
JP3107143B2 (en) * 1995-07-14 2000-11-06 株式会社東京精密 Wire traverse device for wire saw

Also Published As

Publication number Publication date
AU2447900A (en) 2000-08-29
WO2000047383A1 (en) 2000-08-17

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)