GB9814292D0 - Manufacturing method for a cell matrix of a cooling element for semiconductors and a cell matrix according to the method - Google Patents

Manufacturing method for a cell matrix of a cooling element for semiconductors and a cell matrix according to the method

Info

Publication number
GB9814292D0
GB9814292D0 GBGB9814292.0A GB9814292A GB9814292D0 GB 9814292 D0 GB9814292 D0 GB 9814292D0 GB 9814292 A GB9814292 A GB 9814292A GB 9814292 D0 GB9814292 D0 GB 9814292D0
Authority
GB
United Kingdom
Prior art keywords
cell matrix
semiconductors
manufacturing
cooling element
matrix according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9814292.0A
Other versions
GB2326937A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAJUPEK Oy
Original Assignee
LAJUPEK Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI972845A external-priority patent/FI972845A0/en
Priority claimed from FI972846A external-priority patent/FI972846A/en
Priority claimed from FI980119U external-priority patent/FI3573U1/en
Application filed by LAJUPEK Oy filed Critical LAJUPEK Oy
Publication of GB9814292D0 publication Critical patent/GB9814292D0/en
Publication of GB2326937A publication Critical patent/GB2326937A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Element Separation (AREA)
GB9814292A 1997-07-03 1998-07-01 Heat sink formed from interlocking stack of extruded aluminum strips Withdrawn GB2326937A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI972845A FI972845A0 (en) 1997-07-03 1997-07-03 Kylelement Foer halvledare
FI972846A FI972846A (en) 1997-07-03 1997-07-03 Method for manufacturing semiconductor heat sinks
FI980119U FI3573U1 (en) 1998-03-11 1998-03-11 Semiconductor cooling element

Publications (2)

Publication Number Publication Date
GB9814292D0 true GB9814292D0 (en) 1998-09-02
GB2326937A GB2326937A (en) 1999-01-06

Family

ID=27241712

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9814292A Withdrawn GB2326937A (en) 1997-07-03 1998-07-01 Heat sink formed from interlocking stack of extruded aluminum strips

Country Status (3)

Country Link
DE (1) DE29811666U1 (en)
DK (1) DK199800250U3 (en)
GB (1) GB2326937A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960768C3 (en) * 1969-12-03 1979-09-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Heat sink provided with cooling fins, in particular for semiconductor elements and a method for producing such a heat sink
DE3406122A1 (en) * 1984-02-21 1985-08-22 Harri Wilke Werkzeugbau, 5600 Wuppertal Extruded profile and process for the production thereof
US4669535A (en) * 1985-08-07 1987-06-02 North American Specialties Corp. Heat sink formed of stacked fin elements
JPH0750494A (en) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp Cooling device

Also Published As

Publication number Publication date
DK199800250U3 (en) 1998-11-27
GB2326937A (en) 1999-01-06
DE29811666U1 (en) 1998-10-29

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)