GB968095A - Cooling arrangement for one or more semi-conductor devices - Google Patents

Cooling arrangement for one or more semi-conductor devices

Info

Publication number
GB968095A
GB968095A GB494861A GB494861A GB968095A GB 968095 A GB968095 A GB 968095A GB 494861 A GB494861 A GB 494861A GB 494861 A GB494861 A GB 494861A GB 968095 A GB968095 A GB 968095A
Authority
GB
United Kingdom
Prior art keywords
cooling member
semi
cooling
stem
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB494861A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB968095A publication Critical patent/GB968095A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB494861A 1960-02-09 1961-02-09 Cooling arrangement for one or more semi-conductor devices Expired GB968095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES66999A DE1195869B (de) 1960-02-09 1960-02-09 Kuehlanordnung fuer ein oder mehrere Halbleiter-bauelemente und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
GB968095A true GB968095A (en) 1964-08-26

Family

ID=7499215

Family Applications (1)

Application Number Title Priority Date Filing Date
GB494861A Expired GB968095A (en) 1960-02-09 1961-02-09 Cooling arrangement for one or more semi-conductor devices

Country Status (4)

Country Link
CH (1) CH389102A (enrdf_load_stackoverflow)
DE (1) DE1195869B (enrdf_load_stackoverflow)
GB (1) GB968095A (enrdf_load_stackoverflow)
NL (1) NL258020A (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
NL100659C (enrdf_load_stackoverflow) * 1954-12-27
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
CH344786A (de) * 1956-06-29 1960-02-29 Bbc Brown Boveri & Cie Kühler für die Wärmeableitung an einer in einem Gefäss eingebauten Halbleiterzelle
DE1773097U (de) * 1958-01-15 1958-08-28 Bbc Brown Boveri & Cie Anordnung fuer die kuehlung von halbleiterelementen.

Also Published As

Publication number Publication date
CH389102A (de) 1965-03-15
NL258020A (enrdf_load_stackoverflow)
DE1195869B (de) 1965-07-01

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