GB964350A - Resin compositions - Google Patents

Abstract

A thermosetting resin composition comprises a resin based on vinyl chloride or vinylidene chloride in admixture with an amine having more than one amino group in its molecule and/or an amide having more than one primary or secondary amido-group in its molecule, and a phenol which is not condensed with formaldehyde or furfural. The thermosetting composition can have a plasticizer for the resin included in it. The resin can be used in the form of a dispersion in a plasticizer in which the amine and/or amide and phenol have been incorporated. Such a dispersion constitutes a plastisol; the plastisol can be of the type in which substantially none of the resin is dissolved in the plasticizer or a portion of the resin can be dissolved. Another form of the composition can be prepared by first mixing together the resin and plasticizer on a heated mill. The preferred amines are the alkylene polyamines H2N-(-CR2-CR2-NH-)n-H where R is hydrogen, methyl, ethyl or propyl and n is an integer 1 to 5, but other amines are mentioned. Mixtures of amines may be used. The amides may be derived from dibasic acids and ammonia or amines, the preferred acids being the unsaturated dibasic aliphatic carboxylic acids having a chain containing 10 or more carbon atoms in the molecule, e.g. dilinoleic acid and the preferred amines used to prepare the amides are the alkylene polyamines. Any phenol or phenolic derivative containing a hydroxy group attached to the aromatic nucleus can be used, e.g. phenol, o-, m- and p-cresol, orthohydroxy-acetophenone, orthohydroxydiphenyl, catechol, resorcinol, hydroquinone, pyrogallol, hydroxyhydroquinone, phloroglucinol, nitrophenols, chlorophenols and bromophenols. The resin may be polyvinyl chloride, polyvinylidene chloride or copolymers of vinyl chloride with a monomer copolymerizable therewith. The preferred thermosetting composition contains a bentonite clay which has been activated with an amine. Pigments, fillers and stabilizers may be added. The thermosetting composition can be moulded by heating the composition at least at its surface to a temperature of at least 150 DEG C. in a mould until thermoset and then releasing the shaped article, e.g. a shoe sole (see Division B5) from the mould without applying excessive strain to the article while it is still hot.