GB9519088D0 - Method of manufacturing flash eeprom cells - Google Patents

Method of manufacturing flash eeprom cells

Info

Publication number
GB9519088D0
GB9519088D0 GBGB9519088.0A GB9519088A GB9519088D0 GB 9519088 D0 GB9519088 D0 GB 9519088D0 GB 9519088 A GB9519088 A GB 9519088A GB 9519088 D0 GB9519088 D0 GB 9519088D0
Authority
GB
United Kingdom
Prior art keywords
flash eeprom
eeprom cells
manufacturing flash
manufacturing
cells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9519088.0A
Other versions
GB2293688B (en
GB2293688A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9519088D0 publication Critical patent/GB9519088D0/en
Publication of GB2293688A publication Critical patent/GB2293688A/en
Application granted granted Critical
Publication of GB2293688B publication Critical patent/GB2293688B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7884Programmable transistors with only two possible levels of programmation charging by hot carrier injection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
GB9519088A 1994-09-27 1995-09-19 Method of manufacturing flash eeprom cells Expired - Fee Related GB2293688B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940024257A KR0150050B1 (en) 1994-09-27 1994-09-27 Fabricating method of flash eeprom cell

Publications (3)

Publication Number Publication Date
GB9519088D0 true GB9519088D0 (en) 1995-11-22
GB2293688A GB2293688A (en) 1996-04-03
GB2293688B GB2293688B (en) 1998-07-22

Family

ID=19393521

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9519088A Expired - Fee Related GB2293688B (en) 1994-09-27 1995-09-19 Method of manufacturing flash eeprom cells

Country Status (4)

Country Link
US (1) US5527727A (en)
KR (1) KR0150050B1 (en)
DE (1) DE19534921C2 (en)
GB (1) GB2293688B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69636738D1 (en) * 1996-12-27 2007-01-11 St Microelectronics Srl Contact structure for electronic EPROM or flash EPROM semiconductor circuits and their manufacturing method
US6004829A (en) * 1997-09-12 1999-12-21 Taiwan Semiconductor Manufacturing Company Method of increasing end point detection capability of reactive ion etching by adding pad area
US6017795A (en) * 1998-05-06 2000-01-25 Taiwan Semiconductor Manufacturing Company Method of fabricating buried source to shrink cell dimension and increase coupling ratio in split-gate flash
US6011289A (en) * 1998-09-16 2000-01-04 Advanced Micro Devices, Inc. Metal oxide stack for flash memory application
CN1324690C (en) * 2001-06-28 2007-07-04 旺宏电子股份有限公司 Process for preparing silicon nitride ROM
US6624025B2 (en) 2001-08-27 2003-09-23 Taiwan Semiconductor Manufacturing Company Method with trench source to increase the coupling of source to floating gate in split gate flash
KR100577011B1 (en) * 2002-07-10 2006-05-10 매그나칩 반도체 유한회사 Method for forming the semiconductor device
JP4481557B2 (en) * 2002-07-17 2010-06-16 Okiセミコンダクタ株式会社 Method for manufacturing nonvolatile semiconductor memory device
US20060243524A1 (en) * 2005-04-29 2006-11-02 Raymond Jarrell Collapsible hanging scaffold bracket
CN109461735B (en) * 2018-10-18 2021-03-26 上海华力微电子有限公司 Process integration method for improving multi-step polysilicon etching damage of split-gate structure flash memory

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795719A (en) * 1984-05-15 1989-01-03 Waferscale Integration, Inc. Self-aligned split gate eprom process
US4852062A (en) * 1987-09-28 1989-07-25 Motorola, Inc. EPROM device using asymmetrical transistor characteristics
US4924437A (en) * 1987-12-09 1990-05-08 Texas Instruments Incorporated Erasable programmable memory including buried diffusion source/drain lines and erase lines
US5162247A (en) * 1988-02-05 1992-11-10 Emanuel Hazani Process for trench-isolated self-aligned split-gate EEPROM transistor and memory array
US5364806A (en) * 1991-08-29 1994-11-15 Hyundai Electronics Industries Co., Ltd. Method of making a self-aligned dual-bit split gate (DSG) flash EEPROM cell
US5278439A (en) * 1991-08-29 1994-01-11 Ma Yueh Y Self-aligned dual-bit split gate (DSG) flash EEPROM cell
US5313421A (en) * 1992-01-14 1994-05-17 Sundisk Corporation EEPROM with split gate source side injection
US5395779A (en) * 1994-04-08 1995-03-07 United Microelectronics Corporation Process of manufacture of split gate EPROM device

Also Published As

Publication number Publication date
DE19534921C2 (en) 2002-10-31
GB2293688B (en) 1998-07-22
GB2293688A (en) 1996-04-03
KR960012530A (en) 1996-04-20
DE19534921A1 (en) 1996-03-28
KR0150050B1 (en) 1998-10-01
US5527727A (en) 1996-06-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130919