GB9512387D0 - Ovenized crystal assembly and method of manufacture - Google Patents

Ovenized crystal assembly and method of manufacture

Info

Publication number
GB9512387D0
GB9512387D0 GBGB9512387.3A GB9512387A GB9512387D0 GB 9512387 D0 GB9512387 D0 GB 9512387D0 GB 9512387 A GB9512387 A GB 9512387A GB 9512387 D0 GB9512387 D0 GB 9512387D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
crystal assembly
ovenized crystal
ovenized
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9512387.3A
Other versions
GB2302446B (en
GB2302446A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Israel Ltd
Original Assignee
Motorola Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Israel Ltd filed Critical Motorola Israel Ltd
Priority to GB9512387A priority Critical patent/GB2302446B/en
Publication of GB9512387D0 publication Critical patent/GB9512387D0/en
Priority to IL11852296A priority patent/IL118522A0/en
Priority to DE19623799A priority patent/DE19623799A1/en
Priority to CN96102279.5A priority patent/CN1150718A/en
Publication of GB2302446A publication Critical patent/GB2302446A/en
Application granted granted Critical
Publication of GB2302446B publication Critical patent/GB2302446B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04Constructional details for maintaining temperature constant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212Printed circuits or mounted components having integral heating means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10083Electromechanical or electro-acoustic component, e.g. microphone
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10462Flat component oriented parallel to the PCB surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1581Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/165Stabilizing, e.g. temperature stabilization

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
GB9512387A 1995-06-17 1995-06-17 Ovenized crystal assembly. Expired - Fee Related GB2302446B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9512387A GB2302446B (en) 1995-06-17 1995-06-17 Ovenized crystal assembly.
IL11852296A IL118522A0 (en) 1995-06-17 1996-05-31 Ovenized crystal assembly and its manufacture
DE19623799A DE19623799A1 (en) 1995-06-17 1996-06-14 Heated crystal device and manufacturing method
CN96102279.5A CN1150718A (en) 1995-06-17 1996-06-14 Ovenized crystal assembly and method of manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9512387A GB2302446B (en) 1995-06-17 1995-06-17 Ovenized crystal assembly.

Publications (3)

Publication Number Publication Date
GB9512387D0 true GB9512387D0 (en) 1995-08-16
GB2302446A GB2302446A (en) 1997-01-15
GB2302446B GB2302446B (en) 1999-04-21

Family

ID=10776267

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9512387A Expired - Fee Related GB2302446B (en) 1995-06-17 1995-06-17 Ovenized crystal assembly.

Country Status (4)

Country Link
CN (1) CN1150718A (en)
DE (1) DE19623799A1 (en)
GB (1) GB2302446B (en)
IL (1) IL118522A0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917272A (en) * 1998-06-11 1999-06-29 Vectron, Inc. Oven-heated crystal resonator and oscillator assembly
ATE534191T1 (en) * 2009-03-09 2011-12-15 Micro Crystal Ag OSCILLATOR DEVICE COMPRISING A HEAT CONTROLLED PIEZOELETRIC QUARTZ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2668876B1 (en) * 1990-11-07 1992-12-24 Alcatel Espace ELECTRONIC TEMPERATURE CONTROL CIRCUIT.
US5180942A (en) * 1992-02-14 1993-01-19 Motorola, Inc. Thermally isolated ovenized crystal oscillator

Also Published As

Publication number Publication date
GB2302446B (en) 1999-04-21
IL118522A0 (en) 1996-09-12
DE19623799A1 (en) 1996-12-19
GB2302446A (en) 1997-01-15
CN1150718A (en) 1997-05-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020617