GB9506506D0 - Insulation of component leads - Google Patents

Insulation of component leads

Info

Publication number
GB9506506D0
GB9506506D0 GBGB9506506.6A GB9506506A GB9506506D0 GB 9506506 D0 GB9506506 D0 GB 9506506D0 GB 9506506 A GB9506506 A GB 9506506A GB 9506506 D0 GB9506506 D0 GB 9506506D0
Authority
GB
United Kingdom
Prior art keywords
insulation
component leads
leads
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9506506.6A
Other versions
GB2299456A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Priority to GB9506506A priority Critical patent/GB2299456A/en
Publication of GB9506506D0 publication Critical patent/GB9506506D0/en
Publication of GB2299456A publication Critical patent/GB2299456A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
GB9506506A 1995-03-30 1995-03-30 Insulation of component leads Withdrawn GB2299456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9506506A GB2299456A (en) 1995-03-30 1995-03-30 Insulation of component leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9506506A GB2299456A (en) 1995-03-30 1995-03-30 Insulation of component leads

Publications (2)

Publication Number Publication Date
GB9506506D0 true GB9506506D0 (en) 1995-05-17
GB2299456A GB2299456A (en) 1996-10-02

Family

ID=10772154

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9506506A Withdrawn GB2299456A (en) 1995-03-30 1995-03-30 Insulation of component leads

Country Status (1)

Country Link
GB (1) GB2299456A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9716222D0 (en) * 1997-08-01 1997-10-08 Lucas Ind Plc Circuit assembly
ITTV20060030A1 (en) * 2006-03-10 2007-09-11 Elettrolab Srl AN ELECTRONIC DEVICE FOR ENVIRONMENTAL LIGHTING.
ITTV20060031A1 (en) * 2006-03-10 2007-09-11 Elettrolab Srl PROCESS OF PROCESSING A SUPPORT ELEMENT FOR AN ELECTRONIC CIRCUIT AND SUPPORT ELEMENT SOON OBTAINED.
EP2230891A1 (en) * 2009-03-20 2010-09-22 Eurocir, S.A. Procedure for manufacture of printed circuit boards with high thermal conductibility base materials suitable for insertion on non-superficial components
DE102010029227A1 (en) * 2010-05-21 2011-11-24 Osram Gesellschaft mit beschränkter Haftung lighting device

Also Published As

Publication number Publication date
GB2299456A (en) 1996-10-02

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)