GB9426405D0 - Semiconductor device and method for fabricating the same - Google Patents

Semiconductor device and method for fabricating the same

Info

Publication number
GB9426405D0
GB9426405D0 GB9426405A GB9426405A GB9426405D0 GB 9426405 D0 GB9426405 D0 GB 9426405D0 GB 9426405 A GB9426405 A GB 9426405A GB 9426405 A GB9426405 A GB 9426405A GB 9426405 D0 GB9426405 D0 GB 9426405D0
Authority
GB
United Kingdom
Prior art keywords
fabricating
same
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9426405A
Other versions
GB2286286A (en
GB2286286B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9426405D0 publication Critical patent/GB9426405D0/en
Publication of GB2286286A publication Critical patent/GB2286286A/en
Application granted granted Critical
Publication of GB2286286B publication Critical patent/GB2286286B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB9426405A 1993-12-31 1994-12-30 Improvements in or relating to the fabrication of semiconductor devices Expired - Fee Related GB2286286B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR930031822 1993-12-31

Publications (3)

Publication Number Publication Date
GB9426405D0 true GB9426405D0 (en) 1995-03-01
GB2286286A GB2286286A (en) 1995-08-09
GB2286286B GB2286286B (en) 1998-05-27

Family

ID=19374754

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9426405A Expired - Fee Related GB2286286B (en) 1993-12-31 1994-12-30 Improvements in or relating to the fabrication of semiconductor devices

Country Status (1)

Country Link
GB (1) GB2286286B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2341272B (en) * 1998-09-03 2003-08-20 Ericsson Telefon Ab L M High voltage shield
US6133621A (en) * 1998-10-15 2000-10-17 Stmicroelectronics S.R.L. Integrated shielded electric connection
FR2826780A1 (en) * 2001-06-28 2003-01-03 St Microelectronics Sa SEMICONDUCTOR DEVICE WITH MICROWAVE STRUCTURE
KR100631212B1 (en) * 2005-08-01 2006-10-04 삼성전자주식회사 The monolithic duplexer and method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514749A (en) * 1983-01-18 1985-04-30 At&T Bell Laboratories VLSI Chip with ground shielding
US5296735A (en) * 1991-01-21 1994-03-22 Mitsubishi Denki Kabushiki Kaisha Power semiconductor module with multiple shielding layers
KR940008132B1 (en) * 1991-11-28 1994-09-03 삼성전자 주식회사 Semiconductor memory device
JP3283984B2 (en) * 1993-12-28 2002-05-20 株式会社東芝 Semiconductor integrated circuit device

Also Published As

Publication number Publication date
GB2286286A (en) 1995-08-09
GB2286286B (en) 1998-05-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091230