GB9417088D0 - Test method and materials for use therein - Google Patents

Test method and materials for use therein

Info

Publication number
GB9417088D0
GB9417088D0 GB9417088A GB9417088A GB9417088D0 GB 9417088 D0 GB9417088 D0 GB 9417088D0 GB 9417088 A GB9417088 A GB 9417088A GB 9417088 A GB9417088 A GB 9417088A GB 9417088 D0 GB9417088 D0 GB 9417088D0
Authority
GB
United Kingdom
Prior art keywords
materials
test method
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9417088A
Other versions
GB2292603A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Ltd
Original Assignee
Texas Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Ltd filed Critical Texas Instruments Ltd
Priority to GB9417088A priority Critical patent/GB2292603A/en
Publication of GB9417088D0 publication Critical patent/GB9417088D0/en
Publication of GB2292603A publication Critical patent/GB2292603A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB9417088A 1994-08-24 1994-08-24 Testing systems for counting contaminant particles Withdrawn GB2292603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9417088A GB2292603A (en) 1994-08-24 1994-08-24 Testing systems for counting contaminant particles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9417088A GB2292603A (en) 1994-08-24 1994-08-24 Testing systems for counting contaminant particles

Publications (2)

Publication Number Publication Date
GB9417088D0 true GB9417088D0 (en) 1994-10-12
GB2292603A GB2292603A (en) 1996-02-28

Family

ID=10760326

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9417088A Withdrawn GB2292603A (en) 1994-08-24 1994-08-24 Testing systems for counting contaminant particles

Country Status (1)

Country Link
GB (1) GB2292603A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691812A (en) * 1996-03-22 1997-11-25 Ade Optical Systems Corporation Calibration standard for calibrating a defect inspection system and a method of forming same
US6122562A (en) * 1997-05-05 2000-09-19 Applied Materials, Inc. Method and apparatus for selectively marking a semiconductor wafer
DE102007015558B4 (en) 2007-03-12 2018-06-21 Vistec Semiconductor Systems Gmbh Process for the production of artificial defects in semiconductor surfaces
CN108344747B (en) * 2018-02-08 2021-12-03 芜湖美智空调设备有限公司 Filter screen cleanliness detection method, filter screen cleanliness sensor and air treatment equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386850A (en) * 1980-12-23 1983-06-07 Rca Corporation Calibration device and method for an optical defect scanner
US4512659A (en) * 1983-08-10 1985-04-23 Tencor Instruments Apparatus for calibrating a surface scanner
US5144524A (en) * 1988-04-27 1992-09-01 Hewlett-Packard Company Light trap for blocking reflection and scattering of light
US5083035A (en) * 1990-07-17 1992-01-21 Tencor Instruments Position location in surface scanning using interval timing between scan marks on test wafers
US5078492A (en) * 1990-09-24 1992-01-07 Vlsi Standards, Inc. Test wafer for an optical scanner
JP3027241B2 (en) * 1991-07-30 2000-03-27 株式会社堀場製作所 Foreign matter inspection device

Also Published As

Publication number Publication date
GB2292603A (en) 1996-02-28

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)