GB9211682D0 - Integrated circuit cards - Google Patents

Integrated circuit cards

Info

Publication number
GB9211682D0
GB9211682D0 GB9211682A GB9211682A GB9211682D0 GB 9211682 D0 GB9211682 D0 GB 9211682D0 GB 9211682 A GB9211682 A GB 9211682A GB 9211682 A GB9211682 A GB 9211682A GB 9211682 D0 GB9211682 D0 GB 9211682D0
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit cards
cards
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9211682A
Other versions
GB2267683A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Weigh Tronix Ltd
Original Assignee
GEC Avery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Avery Ltd filed Critical GEC Avery Ltd
Priority to GB9211682A priority Critical patent/GB2267683A/en
Publication of GB9211682D0 publication Critical patent/GB9211682D0/en
Publication of GB2267683A publication Critical patent/GB2267683A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
GB9211682A 1992-06-02 1992-06-02 Integrated circuit card or token Withdrawn GB2267683A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9211682A GB2267683A (en) 1992-06-02 1992-06-02 Integrated circuit card or token

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9211682A GB2267683A (en) 1992-06-02 1992-06-02 Integrated circuit card or token

Publications (2)

Publication Number Publication Date
GB9211682D0 true GB9211682D0 (en) 1992-07-15
GB2267683A GB2267683A (en) 1993-12-15

Family

ID=10716414

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9211682A Withdrawn GB2267683A (en) 1992-06-02 1992-06-02 Integrated circuit card or token

Country Status (1)

Country Link
GB (1) GB2267683A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK0650620T4 (en) * 1993-03-18 2001-12-10 Nagraid Sa A method of producing cards comprising at least one electronic element and a card provided by such a method
GB9313749D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A device comprising a flexible printed circuit
US5763868A (en) * 1994-07-25 1998-06-09 Dai Nippon Printing Co., Ltd. Optical card
DE4437844C2 (en) * 1994-10-22 2001-03-08 Cubit Electronics Gmbh Contactless data carrier and method for its production
JP4015717B2 (en) * 1995-06-29 2007-11-28 日立マクセル株式会社 Information carrier manufacturing method
US5703350A (en) * 1995-10-31 1997-12-30 Lucent Technologies Inc. Data carriers having an integrated circuit unit
FR2741010B1 (en) * 1995-11-15 1997-12-26 Em Microelectronic Marin Sa CARD COMPRISING AN ELECTRONIC UNIT AND METHOD FOR MANUFACTURING SUCH A CARD
WO1997016801A1 (en) * 1995-11-01 1997-05-09 Em Microelectronic-Marin S.A. Card including an electronic unit and method for making same
DE19654902C2 (en) * 1996-03-15 2000-02-03 David Finn Smart card
US8538801B2 (en) 1999-02-19 2013-09-17 Exxonmobile Research & Engineering Company System and method for processing financial transactions
EP1089220B1 (en) * 1999-10-01 2001-04-11 Sihl GmbH Multilayer laminated substrate in web form with integrated RF-ID transponders, in particular in roll form
ATE517397T1 (en) 2004-06-16 2011-08-15 Gemalto Sa SHIELDED CONTACTLESS ELECTRONIC DOCUMENT
WO2009121793A2 (en) * 2008-04-01 2009-10-08 Agfa Gevaert Lamination process for producung security laminates

Also Published As

Publication number Publication date
GB2267683A (en) 1993-12-15

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)