GB8927655D0 - Die eject head - Google Patents

Die eject head

Info

Publication number
GB8927655D0
GB8927655D0 GB898927655A GB8927655A GB8927655D0 GB 8927655 D0 GB8927655 D0 GB 8927655D0 GB 898927655 A GB898927655 A GB 898927655A GB 8927655 A GB8927655 A GB 8927655A GB 8927655 D0 GB8927655 D0 GB 8927655D0
Authority
GB
United Kingdom
Prior art keywords
eject head
die eject
die
head
eject
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB898927655A
Other versions
GB2238781A (en
GB2238781B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aven Tools Ltd
Original Assignee
Dynapert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynapert Ltd filed Critical Dynapert Ltd
Priority to GB8927655A priority Critical patent/GB2238781B/en
Publication of GB8927655D0 publication Critical patent/GB8927655D0/en
Publication of GB2238781A publication Critical patent/GB2238781A/en
Application granted granted Critical
Publication of GB2238781B publication Critical patent/GB2238781B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
GB8927655A 1989-12-07 1989-12-07 Die eject head Expired - Fee Related GB2238781B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8927655A GB2238781B (en) 1989-12-07 1989-12-07 Die eject head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8927655A GB2238781B (en) 1989-12-07 1989-12-07 Die eject head

Publications (3)

Publication Number Publication Date
GB8927655D0 true GB8927655D0 (en) 1990-02-07
GB2238781A GB2238781A (en) 1991-06-12
GB2238781B GB2238781B (en) 1993-11-24

Family

ID=10667558

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8927655A Expired - Fee Related GB2238781B (en) 1989-12-07 1989-12-07 Die eject head

Country Status (1)

Country Link
GB (1) GB2238781B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117810160A (en) * 2023-12-29 2024-04-02 江苏佑光科技股份有限公司 Micro-motion thimble device of die bonder

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472218A (en) * 1983-12-23 1984-09-18 At&T Technologies, Inc. Removing articles from an adhesive web

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117810160A (en) * 2023-12-29 2024-04-02 江苏佑光科技股份有限公司 Micro-motion thimble device of die bonder

Also Published As

Publication number Publication date
GB2238781A (en) 1991-06-12
GB2238781B (en) 1993-11-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940224