GB8924832D0 - A method of plating a hole and adjacent surface portion of a substrate - Google Patents

A method of plating a hole and adjacent surface portion of a substrate

Info

Publication number
GB8924832D0
GB8924832D0 GB898924832A GB8924832A GB8924832D0 GB 8924832 D0 GB8924832 D0 GB 8924832D0 GB 898924832 A GB898924832 A GB 898924832A GB 8924832 A GB8924832 A GB 8924832A GB 8924832 D0 GB8924832 D0 GB 8924832D0
Authority
GB
United Kingdom
Prior art keywords
plating
substrate
hole
surface portion
adjacent surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB898924832A
Other versions
GB2237580A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Priority to GB8924832A priority Critical patent/GB2237580A/en
Publication of GB8924832D0 publication Critical patent/GB8924832D0/en
Publication of GB2237580A publication Critical patent/GB2237580A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB8924832A 1989-11-03 1989-11-03 A method for plating a hole and adjacent surface portion of a printed circuit board Withdrawn GB2237580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8924832A GB2237580A (en) 1989-11-03 1989-11-03 A method for plating a hole and adjacent surface portion of a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8924832A GB2237580A (en) 1989-11-03 1989-11-03 A method for plating a hole and adjacent surface portion of a printed circuit board

Publications (2)

Publication Number Publication Date
GB8924832D0 true GB8924832D0 (en) 1989-12-20
GB2237580A GB2237580A (en) 1991-05-08

Family

ID=10665672

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8924832A Withdrawn GB2237580A (en) 1989-11-03 1989-11-03 A method for plating a hole and adjacent surface portion of a printed circuit board

Country Status (1)

Country Link
GB (1) GB2237580A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110129859A (en) * 2018-02-08 2019-08-16 通用电气公司 The method sheltered the hole in element and element is handled

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1320407C (en) * 2003-12-30 2007-06-06 中芯国际集成电路制造(上海)有限公司 Method for restoring chromium pollution point on mask and used positioning board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL268976A (en) * 1961-09-05
GB1549862A (en) * 1976-04-20 1979-08-08 Owens Ltd S Electroplating
DE3070493D1 (en) * 1980-12-31 1985-05-15 Sonix Limited A plating apparatus
US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer
US4750981A (en) * 1986-09-30 1988-06-14 The Boeing Company Apparatus for electroplating limited surfaces on a workpiece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110129859A (en) * 2018-02-08 2019-08-16 通用电气公司 The method sheltered the hole in element and element is handled
CN110129859B (en) * 2018-02-08 2021-09-21 通用电气公司 Method for masking holes in and treating components

Also Published As

Publication number Publication date
GB2237580A (en) 1991-05-08

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)