GB8818522D0 - Laser bonding - Google Patents

Laser bonding

Info

Publication number
GB8818522D0
GB8818522D0 GB888818522A GB8818522A GB8818522D0 GB 8818522 D0 GB8818522 D0 GB 8818522D0 GB 888818522 A GB888818522 A GB 888818522A GB 8818522 A GB8818522 A GB 8818522A GB 8818522 D0 GB8818522 D0 GB 8818522D0
Authority
GB
United Kingdom
Prior art keywords
laser bonding
bonding
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB888818522A
Other versions
GB2221570B (en
GB2221570A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Priority to GB8818522A priority Critical patent/GB2221570B/en
Publication of GB8818522D0 publication Critical patent/GB8818522D0/en
Publication of GB2221570A publication Critical patent/GB2221570A/en
Application granted granted Critical
Publication of GB2221570B publication Critical patent/GB2221570B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

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    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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GB8818522A 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate Expired - Fee Related GB2221570B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8818522A GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8818522A GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Publications (3)

Publication Number Publication Date
GB8818522D0 true GB8818522D0 (en) 1988-09-07
GB2221570A GB2221570A (en) 1990-02-07
GB2221570B GB2221570B (en) 1992-02-12

Family

ID=10641599

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8818522A Expired - Fee Related GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Country Status (1)

Country Link
GB (1) GB2221570B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116352244A (en) * 2023-04-12 2023-06-30 汕尾市栢林电子封装材料有限公司 Preparation method for presetting gold-tin soldering lug by utilizing transient liquid phase diffusion soldering

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Publication number Priority date Publication date Assignee Title
US5197654A (en) * 1991-11-15 1993-03-30 Avishay Katz Bonding method using solder composed of multiple alternating gold and tin layers
US5234153A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Permanent metallic bonding method
KR19990029741A (en) * 1997-09-29 1999-04-26 갈라스 윌리엄 이 How to solder without flux using gold plated solder material and solder
DE60137995D1 (en) * 2000-08-09 2009-04-30 Avago Technologies General Ip Light-emitting devices
DE602004010061T2 (en) 2004-03-09 2008-09-11 Infineon Technologies Ag High reliability, low cost and thermally enhanced semiconductor chip mounting technology with AuSn
EP2426743B1 (en) * 2004-10-22 2019-02-20 Seoul Viosys Co., Ltd GaN compound semiconductor light emitting element and method of manufacturing the same
US7628309B1 (en) 2005-05-03 2009-12-08 Rosemount Aerospace Inc. Transient liquid phase eutectic bonding
US7538401B2 (en) 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
US7400042B2 (en) 2005-05-03 2008-07-15 Rosemount Aerospace Inc. Substrate with adhesive bonding metallization with diffusion barrier
CN101361203B (en) * 2006-10-13 2012-05-02 三洋电机株式会社 Semiconductor light-emitting element, lighting apparatus, and manufacturing method of semiconductor light-emitting element
JP2015173215A (en) * 2014-03-12 2015-10-01 株式会社東芝 Semiconductor device and method of manufacturing the same
DE102017119346A1 (en) 2017-08-24 2019-02-28 Osram Opto Semiconductors Gmbh Component with buffer layer and method for producing a component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137131B (en) * 1983-03-15 1986-06-25 Standard Telephones Cables Ltd Bonding semiconductive bodies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116352244A (en) * 2023-04-12 2023-06-30 汕尾市栢林电子封装材料有限公司 Preparation method for presetting gold-tin soldering lug by utilizing transient liquid phase diffusion soldering

Also Published As

Publication number Publication date
GB2221570B (en) 1992-02-12
GB2221570A (en) 1990-02-07

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732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
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