GB8728371D0 - Method of forming electrical conductors - Google Patents

Method of forming electrical conductors

Info

Publication number
GB8728371D0
GB8728371D0 GB878728371A GB8728371A GB8728371D0 GB 8728371 D0 GB8728371 D0 GB 8728371D0 GB 878728371 A GB878728371 A GB 878728371A GB 8728371 A GB8728371 A GB 8728371A GB 8728371 D0 GB8728371 D0 GB 8728371D0
Authority
GB
United Kingdom
Prior art keywords
electrical conductors
forming electrical
forming
conductors
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB878728371A
Other versions
GB2213319A (en
GB2213319B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Priority to GB8728371A priority Critical patent/GB2213319B/en
Publication of GB8728371D0 publication Critical patent/GB8728371D0/en
Publication of GB2213319A publication Critical patent/GB2213319A/en
Application granted granted Critical
Publication of GB2213319B publication Critical patent/GB2213319B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
GB8728371A 1987-12-04 1987-12-04 A method of forming electrical conductors Expired - Fee Related GB2213319B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8728371A GB2213319B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8728371A GB2213319B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Publications (3)

Publication Number Publication Date
GB8728371D0 true GB8728371D0 (en) 1988-01-13
GB2213319A GB2213319A (en) 1989-08-09
GB2213319B GB2213319B (en) 1991-03-06

Family

ID=10627984

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8728371A Expired - Fee Related GB2213319B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Country Status (1)

Country Link
GB (1) GB2213319B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4326424A1 (en) * 1993-08-06 1995-02-09 Ant Nachrichtentech Process for the production of TAB film supports

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1383297A (en) * 1972-02-23 1974-02-12 Plessey Co Ltd Electrical integrated circuit package
GB2113477B (en) * 1981-12-31 1985-04-17 Hara J B O Method of producing printed circuits
US4786545A (en) * 1986-02-28 1988-11-22 Seiko Epson Corporation Circuit substrate and method for forming bumps on the circuit substrate

Also Published As

Publication number Publication date
GB2213319A (en) 1989-08-09
GB2213319B (en) 1991-03-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee