GB8504314D0 - Soldering semiconductor chips to metal substrates - Google Patents
Soldering semiconductor chips to metal substratesInfo
- Publication number
- GB8504314D0 GB8504314D0 GB858504314A GB8504314A GB8504314D0 GB 8504314 D0 GB8504314 D0 GB 8504314D0 GB 858504314 A GB858504314 A GB 858504314A GB 8504314 A GB8504314 A GB 8504314A GB 8504314 D0 GB8504314 D0 GB 8504314D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor chips
- metal substrates
- soldering semiconductor
- soldering
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Coating With Molten Metal (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8419749A IT1213144B (en) | 1984-02-23 | 1984-02-23 | PROCESS FOR WELDING PLATES OF SEMICONDUCTIVE MATERIAL TO A METAL SUPPORT IN THE AUTOMATIC ASSEMBLY OF SEMICONDUCTOR DEVICES. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8504314D0 true GB8504314D0 (en) | 1985-03-20 |
| GB2154489A GB2154489A (en) | 1985-09-11 |
Family
ID=11160907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08504314A Withdrawn GB2154489A (en) | 1984-02-23 | 1985-02-20 | Soldering semi-conductor material chips to a metal strip |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS60195947A (en) |
| KR (1) | KR850006778A (en) |
| FR (1) | FR2560438A1 (en) |
| GB (1) | GB2154489A (en) |
| IT (1) | IT1213144B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL112296C (en) * | 1955-05-23 | |||
| US3530231A (en) * | 1969-01-15 | 1970-09-22 | Ibm | Bonding high density interconnection lines |
| GB1485051A (en) * | 1974-01-04 | 1977-09-08 | Fulmer Res Inst Ltd | Diffusion bonding of aluminium alloy parts |
| GB1457806A (en) * | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
| US3925808A (en) * | 1974-08-08 | 1975-12-09 | Westinghouse Electric Corp | Silicon semiconductor device with stress-free electrodes |
| US3956821A (en) * | 1975-04-28 | 1976-05-18 | Fairchild Camera And Instrument Corporation | Method of attaching semiconductor die to package substrates |
| GB2021027A (en) * | 1978-03-23 | 1979-11-28 | Gen Electric Co Ltd | Making solder joints on printed wiring beards |
| EP0067993A1 (en) * | 1980-12-30 | 1983-01-05 | Mostek Corporation | Die attachment exhibiting enhanced quality and reliability |
-
1984
- 1984-02-23 IT IT8419749A patent/IT1213144B/en active
-
1985
- 1985-02-15 FR FR8502169A patent/FR2560438A1/en not_active Withdrawn
- 1985-02-20 GB GB08504314A patent/GB2154489A/en not_active Withdrawn
- 1985-02-21 KR KR1019850001085A patent/KR850006778A/en not_active Application Discontinuation
- 1985-02-22 JP JP60033018A patent/JPS60195947A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT8419749A0 (en) | 1984-02-23 |
| JPS60195947A (en) | 1985-10-04 |
| KR850006778A (en) | 1985-10-16 |
| GB2154489A (en) | 1985-09-11 |
| FR2560438A1 (en) | 1985-08-30 |
| IT1213144B (en) | 1989-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2164213B (en) | Structure for connecting leadless chip carrier | |
| EP0189791A3 (en) | Solder interconnection structure for joining semiconductor devices to substrates, and process for making | |
| DE3275789D1 (en) | Substrate for mounting integrated circuit chips | |
| GB8412674D0 (en) | Integrated circuit chip carrier | |
| EP0085914A3 (en) | Method for the direct bonding of metal pieces to oxide-ceramic substrates | |
| GB8714910D0 (en) | Semiconductor integrated circuit | |
| GB8522870D0 (en) | Mounting chip type circuit elements | |
| EP0182651A3 (en) | Semiconductor substrate | |
| GB8423293D0 (en) | Application of solder to workpieces | |
| GB8510173D0 (en) | Aluminium alloy substrates | |
| GB2158992B (en) | Diffusion of impurities into semiconductor substrates | |
| GB2156584B (en) | Semiconductor laser chip | |
| EP0176226A3 (en) | Semiconductor circuit | |
| GB8609149D0 (en) | Solder plating process & semiconductor | |
| GB2103980B (en) | Soldering components to a substrate | |
| GB8515441D0 (en) | Soldering compositions | |
| GB8514012D0 (en) | Mounting chips on substrate | |
| DE3278896D1 (en) | Method for connecting a semiconductor chip to a substrate and such connection | |
| GB8504314D0 (en) | Soldering semiconductor chips to metal substrates | |
| SG89288G (en) | Improvements in or relating to methods of soldering semiconductor chips on supports of non-noble metal | |
| GB2156153B (en) | Alignment process for semiconductor chips | |
| DE3277890D1 (en) | Substrate for semiconductor chips | |
| GB8523237D0 (en) | Dip-type cooler | |
| BG37207A1 (en) | Method for joining silicon chips to metal base | |
| JPS57139992A (en) | Method of supplying solder to ic bonding substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |