GB8502915D0 - Semiconductor memory device - Google Patents
Semiconductor memory deviceInfo
- Publication number
- GB8502915D0 GB8502915D0 GB8502915A GB8502915A GB8502915D0 GB 8502915 D0 GB8502915 D0 GB 8502915D0 GB 8502915 A GB8502915 A GB 8502915A GB 8502915 A GB8502915 A GB 8502915A GB 8502915 D0 GB8502915 D0 GB 8502915D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5382—Adaptable interconnections, e.g. for engineering changes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8502915A GB2170657B (en) | 1985-02-05 | 1985-02-05 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8502915A GB2170657B (en) | 1985-02-05 | 1985-02-05 | Semiconductor memory device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8502915D0 true GB8502915D0 (en) | 1985-03-06 |
GB2170657A GB2170657A (en) | 1986-08-06 |
GB2170657B GB2170657B (en) | 1988-01-27 |
Family
ID=10573987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8502915A Expired GB2170657B (en) | 1985-02-05 | 1985-02-05 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2170657B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8811935D0 (en) * | 1988-05-20 | 1988-06-22 | Time & Data Systems Internatio | Card/badge for carrying data & reader therefor |
FR2645320B1 (en) * | 1989-03-31 | 1993-09-03 | Gen Electric Cgr | COMPACT MEMORY MODULE FOR DATA MEMORY CARD OF AN IMAGE PROCESSOR |
US5051994A (en) * | 1989-04-28 | 1991-09-24 | International Business Machines Corporation | Computer memory module |
SG52794A1 (en) * | 1990-04-26 | 1998-09-28 | Hitachi Ltd | Semiconductor device and method for manufacturing same |
US5414637A (en) * | 1992-06-24 | 1995-05-09 | International Business Machines Corporation | Intra-module spare routing for high density electronic packages |
DE4220878C1 (en) * | 1992-06-25 | 1993-11-11 | Siemens Ag | Method for producing an integrated semiconductor memory with a predetermined storage capacity |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3611317A (en) * | 1970-02-02 | 1971-10-05 | Bell Telephone Labor Inc | Nested chip arrangement for integrated circuit memories |
JPS57207356A (en) * | 1981-06-15 | 1982-12-20 | Fujitsu Ltd | Semiconductor device |
GB2126013A (en) * | 1982-08-18 | 1984-03-14 | Bowthorpe Holdings Plc | Microprocessor system |
-
1985
- 1985-02-05 GB GB8502915A patent/GB2170657B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2170657A (en) | 1986-08-06 |
GB2170657B (en) | 1988-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |