GB849549A - Improvements in or relating to methods of forming p-n junctions in semiconductors - Google Patents
Improvements in or relating to methods of forming p-n junctions in semiconductorsInfo
- Publication number
- GB849549A GB849549A GB25846/57A GB2584657A GB849549A GB 849549 A GB849549 A GB 849549A GB 25846/57 A GB25846/57 A GB 25846/57A GB 2584657 A GB2584657 A GB 2584657A GB 849549 A GB849549 A GB 849549A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wire
- region
- contact
- semi
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- KAPYVWKEUSXLKC-UHFFFAOYSA-N [Sb].[Au] Chemical compound [Sb].[Au] KAPYVWKEUSXLKC-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000009529 body temperature measurement Methods 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL107716D NL107716C (enrdf_load_stackoverflow) | 1957-08-15 | ||
| NL230537D NL230537A (enrdf_load_stackoverflow) | 1957-08-15 | ||
| GB25846/57A GB849549A (en) | 1957-08-15 | 1957-08-15 | Improvements in or relating to methods of forming p-n junctions in semiconductors |
| FR1211516D FR1211516A (fr) | 1957-08-15 | 1958-08-08 | Perfectionnements aux procédés de réalisation de jonctions p-n dans les semiconducteurs |
| DEG25115A DE1176758B (de) | 1957-08-15 | 1958-08-14 | Verfahren zum Einlegieren eines pn-UEberganges in einen Halbleiterkoerper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB25846/57A GB849549A (en) | 1957-08-15 | 1957-08-15 | Improvements in or relating to methods of forming p-n junctions in semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB849549A true GB849549A (en) | 1960-09-28 |
Family
ID=10234293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB25846/57A Expired GB849549A (en) | 1957-08-15 | 1957-08-15 | Improvements in or relating to methods of forming p-n junctions in semiconductors |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1176758B (enrdf_load_stackoverflow) |
| FR (1) | FR1211516A (enrdf_load_stackoverflow) |
| GB (1) | GB849549A (enrdf_load_stackoverflow) |
| NL (2) | NL107716C (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL175652B (nl) * | 1952-02-07 | Krings Josef | Glijschoen voor een spaninrichting van een greppelbouwinrichting. |
-
0
- NL NL230537D patent/NL230537A/xx unknown
- NL NL107716D patent/NL107716C/xx active
-
1957
- 1957-08-15 GB GB25846/57A patent/GB849549A/en not_active Expired
-
1958
- 1958-08-08 FR FR1211516D patent/FR1211516A/fr not_active Expired
- 1958-08-14 DE DEG25115A patent/DE1176758B/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL107716C (enrdf_load_stackoverflow) | 1900-01-01 |
| NL230537A (enrdf_load_stackoverflow) | 1900-01-01 |
| DE1176758B (de) | 1964-08-27 |
| FR1211516A (fr) | 1960-03-16 |
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