GB833688A - Improvements in and relating to electrical contact rectifiers - Google Patents

Improvements in and relating to electrical contact rectifiers

Info

Publication number
GB833688A
GB833688A GB39480/56A GB3948056A GB833688A GB 833688 A GB833688 A GB 833688A GB 39480/56 A GB39480/56 A GB 39480/56A GB 3948056 A GB3948056 A GB 3948056A GB 833688 A GB833688 A GB 833688A
Authority
GB
United Kingdom
Prior art keywords
mould
stack
cell
resin
selenium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB39480/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB833688A publication Critical patent/GB833688A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/073Apertured devices mounted on one or more rods passed through the apertures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Thermistors And Varistors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

833,688. Sealed plate rectifiers. GENERAL ELECTRIC CO. Dec. 28, 1956 [Dec. 30, 1955], No. 39480/56. Class 37. A method of potting a selenium rectifying cell in an organic casting material comprises the step of first coating the cell with a thin film of a silicone polymer. It is stated that this enables the cell when potted to retain the well known self-healing properties of unpotted cells. As shown, a rectifier is made by applying a layer of selenium on an aluminium baseplate and then spraying the selenium with a counter electrode material. The cells are stacked in the manner indicated in Fig. 2 with washers contacting the counter electrodes and with terminals 7 projecting from the stack along one side. The stack is then dipped into a silicone oil in emulsified form after which it is air dried for 30 minutes and then baked for 30 minutes at 100‹ C. The stack is then placed in a mould and this arrangement is then heated to 100‹ C. for not more than 2 hours. A prepared, suitable resin is poured into the mould at this stage. This resin which may be a polyester or an epoxy resin is prepared by first mixing with a filler material such that its temperature coefficient of expansion will be comparable with that of the cell. The filler may be silica flour, clay, talc, or certain carbonates. An anti-foaming agent is added to the mixture which is then heated to about 60‹ C. and de-aerated under vacuum. An amine or anhydride hardener is then added in the case of epoxy resins and a catalyst in the case of polyester resins and the mixture is again heated this time to about 55‹ C. It is now suitable for casting in the mould. The stack and moulded resin are then cured by heating for 2 hours at 100‹ C. and 4 hours at 80‹ C. after which time the potted rectifier may be removed from the mould. The invention is equally applicable to copper oxide rectifiers. The completed rectifier may be attached to mounting brackets.
GB39480/56A 1955-12-30 1956-12-28 Improvements in and relating to electrical contact rectifiers Expired GB833688A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US833688XA 1955-12-30 1955-12-30

Publications (1)

Publication Number Publication Date
GB833688A true GB833688A (en) 1960-04-27

Family

ID=22177863

Family Applications (1)

Application Number Title Priority Date Filing Date
GB39480/56A Expired GB833688A (en) 1955-12-30 1956-12-28 Improvements in and relating to electrical contact rectifiers

Country Status (1)

Country Link
GB (1) GB833688A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1254253B (en) * 1964-09-14 1967-11-16 Siemens Ag Process for the impregnation of selenium rectifier elements for protection against atmospheric influences

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1254253B (en) * 1964-09-14 1967-11-16 Siemens Ag Process for the impregnation of selenium rectifier elements for protection against atmospheric influences

Similar Documents

Publication Publication Date Title
GB1434459A (en) Encapsulation housing for electronic circuit boards or the like and method of encapsulation
US3069302A (en) Insulated conductors and processes for producing them
GB833688A (en) Improvements in and relating to electrical contact rectifiers
JPS6136710B2 (en)
US2883592A (en) Encapsulated selenium rectifiers
US4675985A (en) Method for manufacturing a semiconductor memory device having a high radiation resistance
US2896135A (en) Insulating material
US4010535A (en) Method of fabricating a voltage multiplier circuit assembly
JPH0737573A (en) Manufacture of lithium battery with terminal
US2688569A (en) Encapsulated coils and method of making same
JPH05190159A (en) Lithium battery equipped with terminal and manufacture thereof
US3745082A (en) Semiconductor surface protection material
SU671005A1 (en) Method of repairing winding
JPS5681907A (en) Resin mold coil
US583810A (en) Secondary battery
JPH0212681Y2 (en)
JPS5393819A (en) Photosensitive resin composition for coating hybrid integrated circuit
JPS54157203A (en) Manufacturing method of heat resisting wire for electric machine
Flaherty et al. Thermal aging studies of encapsulated motorette insulation systems
JPS6023495B2 (en) Chip type electrolytic capacitor
Nagao et al. Intrinsic AC breakdown of low-density polyethylene film in high temperature region
Vanwert et al. A new family of encapsulants: Rigid solventless silicone casting resins
JPS5521175A (en) Semiconductor device
US475335A (en) Manufacture of electrodes for secondary batteries
KR860001238B1 (en) Manufacturing of film condenser