GB8320246D0 - Heat transfer means - Google Patents

Heat transfer means

Info

Publication number
GB8320246D0
GB8320246D0 GB8320246A GB8320246A GB8320246D0 GB 8320246 D0 GB8320246 D0 GB 8320246D0 GB 8320246 A GB8320246 A GB 8320246A GB 8320246 A GB8320246 A GB 8320246A GB 8320246 D0 GB8320246 D0 GB 8320246D0
Authority
GB
United Kingdom
Prior art keywords
heat transfer
transfer means
heat
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8320246A
Other versions
GB2124742B (en
GB2124742A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Publication of GB8320246D0 publication Critical patent/GB8320246D0/en
Publication of GB2124742A publication Critical patent/GB2124742A/en
Application granted granted Critical
Publication of GB2124742B publication Critical patent/GB2124742B/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8320246A 1982-07-30 1983-07-27 Promoting nucleate boiling in heat exchangers Expired GB2124742B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8222129 1982-07-30

Publications (3)

Publication Number Publication Date
GB8320246D0 true GB8320246D0 (en) 1983-09-01
GB2124742A GB2124742A (en) 1984-02-22
GB2124742B GB2124742B (en) 1986-02-19

Family

ID=10532039

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8320246A Expired GB2124742B (en) 1982-07-30 1983-07-27 Promoting nucleate boiling in heat exchangers

Country Status (2)

Country Link
DE (1) DE3327125A1 (en)
GB (1) GB2124742B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
DE69031883T2 (en) * 1989-06-08 1998-08-27 Furukawa Electric Co Ltd Cooling device with electrically insulated heat pipe for semiconductors
DE19722360A1 (en) * 1997-05-28 1998-12-03 Bayer Ag Method and device for improving heat transfer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation

Also Published As

Publication number Publication date
GB2124742B (en) 1986-02-19
DE3327125A1 (en) 1984-02-02
GB2124742A (en) 1984-02-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000727