GB8315754D0 - Electronic circuit assemblies - Google Patents

Electronic circuit assemblies

Info

Publication number
GB8315754D0
GB8315754D0 GB838315754A GB8315754A GB8315754D0 GB 8315754 D0 GB8315754 D0 GB 8315754D0 GB 838315754 A GB838315754 A GB 838315754A GB 8315754 A GB8315754 A GB 8315754A GB 8315754 D0 GB8315754 D0 GB 8315754D0
Authority
GB
United Kingdom
Prior art keywords
electronic circuit
circuit assemblies
assemblies
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB838315754A
Other versions
GB2126014A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB08315754A priority Critical patent/GB2126014A/en
Publication of GB8315754D0 publication Critical patent/GB8315754D0/en
Publication of GB2126014A publication Critical patent/GB2126014A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB08315754A 1982-08-14 1983-06-08 Heat sink for electronic circuit assemblies Withdrawn GB2126014A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08315754A GB2126014A (en) 1982-08-14 1983-06-08 Heat sink for electronic circuit assemblies

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8223435 1982-08-14
GB08315754A GB2126014A (en) 1982-08-14 1983-06-08 Heat sink for electronic circuit assemblies

Publications (2)

Publication Number Publication Date
GB8315754D0 true GB8315754D0 (en) 1983-07-13
GB2126014A GB2126014A (en) 1984-03-14

Family

ID=26283594

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08315754A Withdrawn GB2126014A (en) 1982-08-14 1983-06-08 Heat sink for electronic circuit assemblies

Country Status (1)

Country Link
GB (1) GB2126014A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2620587B1 (en) * 1987-09-16 1993-07-02 Telemecanique Electrique PRINTED CIRCUIT WITH THERMAL DRAIN
US5173839A (en) * 1990-12-10 1992-12-22 Grumman Aerospace Corporation Heat-dissipating method and device for led display

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1455001A (en) * 1973-01-08 1976-11-10 Redpoint Ltd Heat sink assembly
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components

Also Published As

Publication number Publication date
GB2126014A (en) 1984-03-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)