GB788806A - Compositions comprising polyepoxides and silicon-containing compounds, and cured products prepared therefrom - Google Patents
Compositions comprising polyepoxides and silicon-containing compounds, and cured products prepared therefromInfo
- Publication number
- GB788806A GB788806A GB1229255A GB1229255A GB788806A GB 788806 A GB788806 A GB 788806A GB 1229255 A GB1229255 A GB 1229255A GB 1229255 A GB1229255 A GB 1229255A GB 788806 A GB788806 A GB 788806A
- Authority
- GB
- United Kingdom
- Prior art keywords
- silicon
- polyepoxide
- compounds
- heated
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Abstract
A composition, which may be heated to form resinous products, comprises a polyepoxide and and an organo-silicon compound having in the molecule at least one hydrogen atom reactive with the epoxy group. The polyepoxide may be saturated or unsaturated, aliphatic, cycloaliphatic, aromatic or heterocyclic and may be substituted with other radicals, e.g. halogens, hydroxyl or ether groups. They may be monomeric or polymeric. A large number of examples is given. The preferred substances are those prepared from epichlorhydrin and a dihydric phenol in an alkaline medium, and polymers of unsaturated epoxy compounds such as allyl glycidyl ether. In the organo-silicon compounds, the reactive hydrogen atoms may be in groups which are directly attached to silicon or to organic radicals which are attached to silicon. Such groups are OH, NH2, NHR, CONH2, CONHR, COOH, C CH and SH. The preferred compounds include silanols, siloxanols, hydroxyl-containing silanes containing two or more silicon atoms bonded together through divalent organic radicals, and partially esterified silicon-containing polyhydric alcohols; and many examples of these and other silicon compounds are given. Reaction between the two components is effected by heating to 50 DEG to 250 DEG C., generally at atmospheric pressure, with or without solvents. Accelerators such as tertiary amines, choline and BF3 dihydrate complexes may be added. The products contain free OH groups and range from viscous liquids to solids. They are soluble in various oils and solvents and are compatible with phenolaldehyde resins and with film-forming materials such as drying oils, cellulose esters and ethers, vinyl polymers and urea-formaldehyde resins. The products may be cured by reacting, at temperatures up to 350 DEG C., with alkaline compounds such as sodium and potassium hydroxides, phenoxides and methoxide, and amires; with acidic compounds, e.g. phthalic anhydride; with polyisocyanates; or methylol compounds, e.g. urea- or melamine resins. They may be used in adhesive or impregnating compositions, by dissolving in or mixing with solvents such as benzene, toluene, acetonitrile or crotonitrile, together with the curing agent. They may also be used for electrical pottings and castings. They may be reacted with monocarboxylic acids to form esters which are useful as plasticizers and coatings, or with polyethylenic monocarboxylic acids, or with polycarboxylic acids. In the examples the polyepoxide used is prepared by reacting bis-phenol with an excess of epichlorhydrin in alkaline medium and has a molecular weight of about 350 and an epoxy equivalency of 1.75. In (1) it is heated with diphenylsilanediol, and the reaction product is dissolved in an organic solvent, ureaformaldehyde resin is added, and cured films are prepared by baking the composition on tin panels. The reaction product is also dissolved in a mixture of "Cellosolve" (Registered Trade Mark) and xylene, a small amount of citric acid is added, and cured films are obtained by baking on a glass plate. Using lead 2-ethylhexoate as catalyst, the film is cured at room temperature. Related reaction products are produced by substituting ditolyl-, dixylyl-, phenyloctyl-, and di (trifluoromethylphenyl) silanediols for the one above; and increased reaction rates are obtained by the addition of 0.1 per cent choline. (2) The polyepoxide is heated with triphenylhydroxysilane, and a solution of the reaction product in a mixture of methyl "Cellosolve" and xylene containing ethylene diamine as catalyst is converted to cured films.. (3) The polyepoxide is heated with dimethyl-bis (p-phenylol) silane to give a product having the probable structure: <FORM:0788806/IV (a)/1> This is dissolved in a solvent as in (2) containing phthalic anhydride as curing agent, and converted to films. Dibutyl-, diphenyl- and dicyclohexyl-bis (p-phenylol) silane may be substituted for the one used. (4) The polyepoxide is heated with tetramethyl disiloxanediol-1,3, and the product treated as in (3). The siloxane diol may be submitted by tetraphenyldisiloxanediol-1,3, hexamethyltrisiloxanediol and tetramethoxydisiloxanediol. (5) A 50 per cent methyl "Cellosolve" solution of the reaction product of Example (1) is combined with a 10 per cent methyl ethyl ketone solution of a polyvinyl acetal resin to form solutions of varying proportions of resins which form baked and airdried films. (6) A vinyl chloride-acetate copolymer solution in methylethyl ketone and toluene is substituted for the acetal solution of the previous example. (7) A vinyl acetate homopolymer is substituted for the copolymer of the previous example. Specifications 737,142, 737,515, 737,614 and 760,309 are referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42691054A | 1954-04-30 | 1954-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB788806A true GB788806A (en) | 1958-01-08 |
Family
ID=23692702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1229255A Expired GB788806A (en) | 1954-04-30 | 1955-04-28 | Compositions comprising polyepoxides and silicon-containing compounds, and cured products prepared therefrom |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE537769A (en) |
CH (1) | CH385492A (en) |
FR (1) | FR1130032A (en) |
GB (1) | GB788806A (en) |
NL (2) | NL96555C (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2999836A (en) * | 1959-04-16 | 1961-09-12 | Du Pont | Reaction product of n-glycidyl-phthalimide and a dianhydride compound, process for preparing same, and modification thereof |
US3072594A (en) * | 1959-04-22 | 1963-01-08 | Walter J Saeman No Drawing | Silamine curing agents |
DE1218396B (en) * | 1960-09-01 | 1966-06-08 | Dow Corning | Process for making cellulose fabrics crease-resistant by means of epoxy compounds |
US4877822A (en) * | 1985-10-07 | 1989-10-31 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
US5006614A (en) * | 1988-07-05 | 1991-04-09 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer |
US5389727A (en) * | 1988-09-09 | 1995-02-14 | Kansai Paint Company, Limited | Resin compositions and a method of curing the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LU17818A1 (en) * | 1958-10-21 | 1900-01-01 | ||
NL258187A (en) * | 1959-11-21 | 1900-01-01 | ||
BE790533A (en) * | 1971-10-25 | 1973-04-25 | Ciba Geigy | HARDENABLE POLYEPOXIDE-POLYSILOXANES |
-
0
- BE BE537769D patent/BE537769A/xx unknown
- NL NL196867D patent/NL196867A/xx unknown
- NL NL96555D patent/NL96555C/xx active
-
1955
- 1955-04-28 GB GB1229255A patent/GB788806A/en not_active Expired
- 1955-04-28 CH CH1910755A patent/CH385492A/en unknown
- 1955-04-28 FR FR1130032D patent/FR1130032A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2999836A (en) * | 1959-04-16 | 1961-09-12 | Du Pont | Reaction product of n-glycidyl-phthalimide and a dianhydride compound, process for preparing same, and modification thereof |
US3072594A (en) * | 1959-04-22 | 1963-01-08 | Walter J Saeman No Drawing | Silamine curing agents |
DE1218396B (en) * | 1960-09-01 | 1966-06-08 | Dow Corning | Process for making cellulose fabrics crease-resistant by means of epoxy compounds |
US4877822A (en) * | 1985-10-07 | 1989-10-31 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
US5053445A (en) * | 1985-10-07 | 1991-10-01 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
US5006614A (en) * | 1988-07-05 | 1991-04-09 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer |
US5389727A (en) * | 1988-09-09 | 1995-02-14 | Kansai Paint Company, Limited | Resin compositions and a method of curing the same |
US5492968A (en) * | 1988-09-09 | 1996-02-20 | Kansai Paint Company Limited | Resin compositions and a method of curing the same |
Also Published As
Publication number | Publication date |
---|---|
NL96555C (en) | |
NL196867A (en) | |
BE537769A (en) | |
FR1130032A (en) | 1957-01-30 |
CH385492A (en) | 1964-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2924580A (en) | Divinyl benzene dioxide compositions | |
US2819245A (en) | Siloxane-epoxide resin reaction products | |
US5310843A (en) | Organopolysiloxane and method for the preparation thereof | |
US4283513A (en) | Siloxane-modified epoxy resin composition | |
JPS5855969B2 (en) | epoxy resin | |
US3150116A (en) | Silane modified epoxide resins | |
GB717291A (en) | Improvements in or relating to hardenable compositions and hard resinous products produced therefrom | |
US2890197A (en) | Composition comprising a diepoxide, a polycarboxylic acid and a polyhydric compound | |
JP3277256B2 (en) | Method for producing epoxide adduct | |
GB788806A (en) | Compositions comprising polyepoxides and silicon-containing compounds, and cured products prepared therefrom | |
GB2155480A (en) | Heat curable epoxy resin compositions and epoxy resin curing agents | |
JPS588766A (en) | Coating composition containing ultra violet ray absorbent | |
US7807012B2 (en) | Moldable compositions containing carbinol functional silicone resins or anhydride functional silicone resins | |
JP2008518049A (en) | Moldable composition containing carbinol functional silicone resin or anhydride functional silicone resin | |
US3395121A (en) | Curing epoxy resins with boron trichloride-tertiary amine complexes | |
US3242142A (en) | Process for curing epoxy resins | |
CA1064892A (en) | Curling agents for epoxide resins | |
KR100546716B1 (en) | Powder coating composition using low-temperature curable epoxy resin | |
US3519602A (en) | Epoxy resin compositions comprising an epoxy resin and n-secondary-alkyl polyalkylene diamine | |
US3428706A (en) | Compositions comprising acid-catalyzed and alkaline-catalyzed organopolysiloxanes | |
US3223577A (en) | Silylated polyepoxides | |
US3346515A (en) | Method of producing alternating ether-siloxane copolymers | |
US2500842A (en) | Aminotriazine-organosilicon composition | |
US3578632A (en) | Curing polyepoxides with mixed catalysts | |
US4196138A (en) | Dicarbonyl chelate salts |