GB2625221A - Composition for latex polymerization, latex for dip molding, and dip molded products manufactured therefrom - Google Patents
Composition for latex polymerization, latex for dip molding, and dip molded products manufactured therefrom Download PDFInfo
- Publication number
- GB2625221A GB2625221A GB2402936.5A GB202402936A GB2625221A GB 2625221 A GB2625221 A GB 2625221A GB 202402936 A GB202402936 A GB 202402936A GB 2625221 A GB2625221 A GB 2625221A
- Authority
- GB
- United Kingdom
- Prior art keywords
- weight
- parts
- latex
- acid
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004816 latex Substances 0.000 title claims abstract description 88
- 229920000126 latex Polymers 0.000 title claims abstract description 86
- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 238000000465 moulding Methods 0.000 title claims abstract description 40
- 238000006116 polymerization reaction Methods 0.000 title claims abstract description 39
- 239000000178 monomer Substances 0.000 claims abstract description 79
- 150000008040 ionic compounds Chemical class 0.000 claims abstract description 25
- 239000002253 acid Substances 0.000 claims abstract description 21
- 150000002825 nitriles Chemical class 0.000 claims abstract description 20
- 150000001993 dienes Chemical class 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 23
- 229920001577 copolymer Polymers 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 159000000000 sodium salts Chemical class 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000003995 emulsifying agent Substances 0.000 claims description 11
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 11
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 10
- -1 3-butyl Chemical group 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 8
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 8
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 8
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 claims description 8
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 8
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 7
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 claims description 7
- 239000003505 polymerization initiator Substances 0.000 claims description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 6
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 5
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 5
- DEFVIWRASFVYLL-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl)tetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)CCOCCOCCN(CC(O)=O)CC(O)=O DEFVIWRASFVYLL-UHFFFAOYSA-N 0.000 claims description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 5
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 5
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 5
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 5
- 235000017550 sodium carbonate Nutrition 0.000 claims description 5
- 235000002639 sodium chloride Nutrition 0.000 claims description 5
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 5
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 5
- 235000011152 sodium sulphate Nutrition 0.000 claims description 5
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 4
- 239000001110 calcium chloride Substances 0.000 claims description 4
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 4
- 239000002537 cosmetic Substances 0.000 claims description 4
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 4
- 235000019797 dipotassium phosphate Nutrition 0.000 claims description 4
- 229910000396 dipotassium phosphate Inorganic materials 0.000 claims description 4
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 4
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 235000012254 magnesium hydroxide Nutrition 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 4
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 4
- 239000011736 potassium bicarbonate Substances 0.000 claims description 4
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 4
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 4
- GJAWHXHKYYXBSV-UHFFFAOYSA-N quinolinic acid Chemical compound OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 claims description 4
- 235000010344 sodium nitrate Nutrition 0.000 claims description 4
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 claims description 3
- UTOVMEACOLCUCK-SNAWJCMRSA-N (e)-4-butoxy-4-oxobut-2-enoic acid Chemical compound CCCCOC(=O)\C=C\C(O)=O UTOVMEACOLCUCK-SNAWJCMRSA-N 0.000 claims description 3
- ZKXXLNRGNAUYHP-IHWYPQMZSA-N (z)-4-(2-hydroxypropoxy)-4-oxobut-2-enoic acid Chemical compound CC(O)COC(=O)\C=C/C(O)=O ZKXXLNRGNAUYHP-IHWYPQMZSA-N 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 claims description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N acrylaldehyde Natural products C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 claims description 3
- IMJGQTCMUZMLRZ-UHFFFAOYSA-N buta-1,3-dien-2-ylbenzene Chemical compound C=CC(=C)C1=CC=CC=C1 IMJGQTCMUZMLRZ-UHFFFAOYSA-N 0.000 claims description 3
- UTOVMEACOLCUCK-PLNGDYQASA-N butyl maleate Chemical compound CCCCOC(=O)\C=C/C(O)=O UTOVMEACOLCUCK-PLNGDYQASA-N 0.000 claims description 3
- 235000011148 calcium chloride Nutrition 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 239000001530 fumaric acid Substances 0.000 claims description 3
- 230000036541 health Effects 0.000 claims description 3
- 244000144972 livestock Species 0.000 claims description 3
- 235000011147 magnesium chloride Nutrition 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 3
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 3
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 235000011151 potassium sulphates Nutrition 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 3
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 claims description 3
- 239000004317 sodium nitrate Substances 0.000 claims description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 3
- BOGRNZQRTNVZCZ-AATRIKPKSA-N (3e)-3-methylpenta-1,3-diene Chemical compound C\C=C(/C)C=C BOGRNZQRTNVZCZ-AATRIKPKSA-N 0.000 claims description 2
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 claims description 2
- BOGRNZQRTNVZCZ-UHFFFAOYSA-N 1,2-dimethyl-butadiene Natural products CC=C(C)C=C BOGRNZQRTNVZCZ-UHFFFAOYSA-N 0.000 claims description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 claims description 2
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 claims description 2
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 2
- 239000000920 calcium hydroxide Substances 0.000 claims description 2
- 235000011116 calcium hydroxide Nutrition 0.000 claims description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 2
- 235000011132 calcium sulphate Nutrition 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 235000011181 potassium carbonates Nutrition 0.000 claims description 2
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- 235000007686 potassium Nutrition 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 19
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 5
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 235000015320 potassium carbonate Nutrition 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 3
- 235000019798 tripotassium phosphate Nutrition 0.000 description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 3
- 235000019801 trisodium phosphate Nutrition 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- QTYUSOHYEPOHLV-FNORWQNLSA-N 1,3-Octadiene Chemical compound CCCC\C=C\C=C QTYUSOHYEPOHLV-FNORWQNLSA-N 0.000 description 2
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- 206010020751 Hypersensitivity Diseases 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 210000001124 body fluid Anatomy 0.000 description 2
- 239000010839 body fluid Substances 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 229910000397 disodium phosphate Inorganic materials 0.000 description 2
- 235000019800 disodium phosphate Nutrition 0.000 description 2
- AUZONCFQVSMFAP-UHFFFAOYSA-N disulfiram Chemical compound CCN(CC)C(=S)SSC(=S)N(CC)CC AUZONCFQVSMFAP-UHFFFAOYSA-N 0.000 description 2
- 238000000157 electrochemical-induced impedance spectroscopy Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229920006173 natural rubber latex Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- DJEHXEMURTVAOE-UHFFFAOYSA-M potassium bisulfite Chemical compound [K+].OS([O-])=O DJEHXEMURTVAOE-UHFFFAOYSA-M 0.000 description 2
- 229940099427 potassium bisulfite Drugs 0.000 description 2
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 2
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- XVXNNFJCCZDKGU-UHFFFAOYSA-N 2,3-dibutylphenol;methanedithioic acid Chemical compound SC=S.CCCCC1=CC=CC(O)=C1CCCC XVXNNFJCCZDKGU-UHFFFAOYSA-N 0.000 description 1
- KAYQJQYEJMZJEF-UHFFFAOYSA-N 2,3-diethylphenol;methanedithioic acid Chemical compound SC=S.CCC1=CC=CC(O)=C1CC KAYQJQYEJMZJEF-UHFFFAOYSA-N 0.000 description 1
- GSFSVEDCYBDIGW-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)-6-chlorophenol Chemical compound OC1=C(Cl)C=CC=C1C1=NC2=CC=CC=C2S1 GSFSVEDCYBDIGW-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- TVWBTVJBDFTVOW-UHFFFAOYSA-N 2-methyl-1-(2-methylpropylperoxy)propane Chemical compound CC(C)COOCC(C)C TVWBTVJBDFTVOW-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- UGWOAPBVIGCNOV-UHFFFAOYSA-N 5-ethenyldec-5-ene Chemical compound CCCCC=C(C=C)CCCC UGWOAPBVIGCNOV-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 208000010201 Exanthema Diseases 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 244000004005 Nypa fruticans Species 0.000 description 1
- 235000005305 Nypa fruticans Nutrition 0.000 description 1
- 108091006629 SLC13A2 Proteins 0.000 description 1
- 241001193851 Zeta Species 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 208000030961 allergic reaction Diseases 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical class CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 229910052925 anhydrite Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001877 deodorizing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229940096818 dipentamethylenethiuram disulfide Drugs 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000012154 double-distilled water Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 201000005884 exanthem Diseases 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000000687 hydroquinonyl group Chemical class C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- NXPHCVPFHOVZBC-UHFFFAOYSA-N hydroxylamine;sulfuric acid Chemical compound ON.OS(O)(=O)=O NXPHCVPFHOVZBC-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000005722 itchiness Effects 0.000 description 1
- 238000002356 laser light scattering Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- ZWWQICJTBOCQLA-UHFFFAOYSA-N o-propan-2-yl (propan-2-yloxycarbothioyldisulfanyl)methanethioate Chemical compound CC(C)OC(=S)SSC(=S)OC(C)C ZWWQICJTBOCQLA-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- KNBRWWCHBRQLNY-UHFFFAOYSA-N piperidine-1-carbothioylsulfanyl piperidine-1-carbodithioate Chemical compound C1CCCCN1C(=S)SSC(=S)N1CCCCC1 KNBRWWCHBRQLNY-UHFFFAOYSA-N 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 206010037844 rash Diseases 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 description 1
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 229920006174 synthetic rubber latex Polymers 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
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- A61B34/00—Computer-aided surgery; Manipulators or robots specially adapted for use in surgery
- A61B34/10—Computer-aided planning, simulation or modelling of surgical operations
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F236/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated with nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/02—Direct processing of dispersions, e.g. latex, to articles
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/04—Surgical instruments, devices or methods, e.g. tourniquets for suturing wounds; Holders or packages for needles or suture materials
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/44—Detecting, measuring or recording for evaluating the integumentary system, e.g. skin, hair or nails
- A61B5/441—Skin evaluation, e.g. for skin disorder diagnosis
- A61B5/445—Evaluating skin irritation or skin trauma, e.g. rash, eczema, wound, bed sore
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
- A61B90/36—Image-producing devices or illumination devices not otherwise provided for
- A61B90/37—Surgical systems with images on a monitor during operation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/12—Polymerisation in non-solvents
- C08F2/16—Aqueous medium
- C08F2/22—Emulsion polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16H—HEALTHCARE INFORMATICS, i.e. INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR THE HANDLING OR PROCESSING OF MEDICAL OR HEALTHCARE DATA
- G16H20/00—ICT specially adapted for therapies or health-improving plans, e.g. for handling prescriptions, for steering therapy or for monitoring patient compliance
- G16H20/40—ICT specially adapted for therapies or health-improving plans, e.g. for handling prescriptions, for steering therapy or for monitoring patient compliance relating to mechanical, radiation or invasive therapies, e.g. surgery, laser therapy, dialysis or acupuncture
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- A61B2034/254—User interfaces for surgical systems being adapted depending on the stage of the surgical procedure
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Disclosed are: a composition for latex polymerization; latex for dip molding, polymerized therefrom; and dip molded products using same, wherein the composition comprises a conjugated diene monomer, an ethylenically unsaturated nitrile monomer, an ethylenically unsaturated acid monomer, and an ionic compound, and has the ionic conductivity of 275 μs/cm or more.
Description
[DESCRIPTION]
[Invention Title] COMPOSITION FOR LATEX POLYMERIZATION, LATEX FOR DIP MOLDING, AND
DIP MOLDED ARTICLE MANUFACTURED THEREFROM
[Technical field]
This specification relates to a composition for latex polymerization, a latex for dip molding polymerized using the same, and a dip molded article manufactured therefrom.
[Background Art]
Conventionally, dip molded articles such as gloves used for medical, food, inspection, and experimental purposes and condoms were manufactured using natural rubber latex as the main raw material. However, these natural rubber latex molded articles include proteins inside, causing problems such as rashes, itchiness, and colds due to contact allergic reactions in users. As a result, there is an increasing trend in the use of dip molded articles manufactured from synthetic rubber latex as the main raw material, which does not include any protein.
As the use of latex for dip molding increases, there is a need to improve quality, and recent attempts have been made to improve the durability, such as tensile strength and elongation, of a dip molded article manufactured from latex for dip molding. However, despite these attempts to improve mechanical properties, cases of personal accidents or failure to achieve the desired purpose continue to occur due to damage to a dip molded article This is because, when the molded article is actually used, its physical properties deteriorate when it comes in contact with slightly acidic body fluids such as human skin or sweat. Conventional mechanical properties, such as tensile strength and elongation, are measured in air at room temperature, and when these properties are excellent, the durability of the dip molded article before use can be guaranteed, but durability under actual use conditions is poor. Therefore, there is a need to develop technology for manufacturing a dip molded article with excellent durability under actual use conditions Accordingly, the demand for high-solids latex for dip molding that has excellent quality even in small quantities is also increasing. However, the conventional latex for dip molding has a problem in that when the solid content is increased through concentration, and the like, vi scosity increases rapidly above a certain content due to a decrease in particle stability.
In addition, latex for dip molding generally includes particulate polymers with an average particle diameter of around 800 A. A technology for manufacturing latex including high-quality, large-diameter polymer particles has been proposed by concentrating or enlarging the latex through chemical treatment, and the like, but there is a problem in that the stability of latex is rapidly reduced in the process.
[Disclosure]
[Technical Problem] The description in this specification provides a polymerization composition for preparing latex for dip molding that has excellent stability and has a large particle diameter, high solid content, and low viscosity characteristics, and a high-quality dip molded articl e using the latex for dip molding.
[Technical Solution] According to one aspect, a composition for latex polymerization, which includes: a conjugated diene-based monomer; an ethylenically unsaturated nitrile monomer; an ethylen cally unsaturated acid monomer; and an ionic compound and has an ionic conductivity of 275 ps/cm or more, is provided.
In one embodiment, the conjugated di ene-based monomer may be one or more selected from the group consisting of 1,3-butadiene, isoprene, 2,3-dimethy1-1,3-butadiene, 1,3-pentadiene, 1,3 -hexadiene, 2-phenyl-1,3-butadiene, 3 -methyl-1,3 -pentadi ene, 2 -chloro-1,3 -b utadiene, 3-b utyl-1,3 -octadi ene, and octadiene.
In one embodiment, the ethylenically unsaturated nitrile monomer may be one or more selected from the group consisting of acrylon trile methacrylonitrile, fumaronarile, chloronitrile, and a-cyano ethyl acrylonitrile.
In one embodiment, the ethylenically unsaturated acid monomer may be one or more selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, m al ei c anhydride, citraconi c anhydride, styrene sul foni c acid, monobutyl fumarate, monobutyl maleate, and mono-2-hydroxypropyl maleate.
In one embodiment, the ionic compound may be one or more selected from the group consisting of sodium chloride, potassium chloride, calcium chloride, magnesium chloride, sodium nitrate, potassium nitrate, calcium nitrate, magnesium nitrate, sodium sulfate, potassium sulfate, calcium sulfate, magnesium sulfate, sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, sodium bicarbonate, potassium bicarbonate, sodium carbonate, potassium carbonate, sodium bisulfite, potassium bisulfite, sodium pyrophosphate, potassium pyrophosphate, tri sodium phosphate, tripotassium phosphate, sodium monohydrogen phosphate, potassium monohydrogen phosphate, ethylenediaminetetraacetic acid or a sodium salt thereof, ethylene glycol tetraacetic acid or a sodium salt thereof, nitri I otri aceti c acid or a sodium salt thereof, i mi nodi aceti c acid or a sodium salt thereof, and quinolinic acid or a sodium salt thereof In one embodiment, the composition may include 30 to 90 parts by weight of the conjugated diene-based monomer, 1 to 55 parts by weight of the ethylenically unsaturated nitrile monomer, and 0.001 to 20 parts by weight of the ethylenically unsaturated acid monomer.
In one embodiment, the composition may further include water, an emulsifier, a polymerization initiator, and a molecular weight adjusting agent.
According to another aspect, a latex for dip molding, including a copolymer derived from the composition for latex polymerization is provided, wherein the copolymer has an average particle diameter of 1,000 to 3,000 A. In one embodiment, the latex may have a viscosity of 50 to 2,500 cps at 25 °C.
In one embodiment, a solid content of the latex may be 50 to 65% by weight.
According to another aspect, a dip molded article manufactured from the latex for dip molding described above is provided.
In one embodiment, the dip molded article may be surgical gloves, medical gloves, gloves for processing agricultural and livestock products, industrial gloves, condoms, cosmetic materials, catheters, or molded articles for health care.
[Advantageous Effects] According to one aspect, when polymerizing latex, the stability of the polymer is significantly improved, and thus the trade-offs of high solid content, large particle diameter, and low viscosity can be simultaneously satisfied.
The effects of one aspect of the present specification is not limited to the above-described effects, and it should be understood to include all effects that can be inferred from the configuration described in the detailed description or claims of the present specification [Modes of the Invention] Hereinafter, one aspect of the present specification will be described based on specific examples. However, the description of this specification may be implemented in several different forms, and thus is not limited to the embodiments described herein.
Throughout the specification, when a part is "connected" to another part, this includes not only the case where it is "directly connected' but also the case where it is "indirectly connected" with another member interposed therebetween, in addition, when a part is said to "include" a component, this means that other components may be further included, not excluded, unless specifically stated otherwise.
When a range of numerical values is recited herein, the values have the precision of the significant figures provided in accordance with the standard rules in chemistry for significant figures, unless a specific range is otherwise stated. For example, 10 includes the range of 5.0 to 14.9, and 10.0 includes the range of 9.50 to 10.49.
Composition for latex polymerization A composition for latex polymerization according to one aspect may include a conjugated diene-based monomer; an ethylenically unsaturated nitrile monomer; an ethylenically unsaturated acid monomer and an ionic compound, and have an ionic conductivity of 275 Rs/cm or more.
The composition for latex polymerization may be one in which the content of the ionic compound is adjusted to achieve the desired ionic conductivity, For example, the ionic conductivity of the composition may be 275 Rs/cm or more, for example, 275 ps/cm, 277.5 Rs/cm, 280 Rs/cm, 282.5 Rs/cm, 285 ps/cm, 287.5 ps/cm, 290 ps/cm, 292.5 Rs/cm, 295 ps/cm, 297.5 Rs/cm, 300 ps/cm, 302.5 ps/cm, 305 ps/cm, 307.5 Rs/cm, 310 ps/cm, 312.5 ps/cm, 315 ps/cm, 317.5 ps/cm, 320 ps/cm, 322.5 ps/cm, 325 ps/cm, 327.5 Rs/cm, 330 ps/cm, 332.5 Rs/cm, 335 ps/cm, 337.5 Rs/cm, 340 Rs/cm, 342.5 ps/cm, 345 Rs/cm, 347.5 ps/cm, 350 ps/cm, 352.5 Rs/cm, 355 ps/cm, 357.5 ps/cm, 360 Rs/cm, 362.5 Rs/cm, 365 ps/cm, 367.5 Rs/cm, 370 ps/cm, 372.5 Rs/cm, 375 Rs/cm, 377.5 Rs/cm, 380 ps/cm, 382.5 Rs/cm, 385 ps/cm, 387.5 ps/cm, 390 Rs/cm, 392.5 Its/cm, 395 Rs/cm, 397.5 ps/cm, 400 Rs/cm, a value in a range between two of these values, or one or more of these values. When the ionic conductivity of the composition for latex polymerization is less than the above range, the stability of the polymerized latex may decrease, and in particular, when concentrating the solid content by more than half viscosity may rapidly increase In addition, the ionic conductivity of the composition may be 10 ms/cm or less, 5 ms/cm or less, or 1 ms/cm or less, but is not limited thereto. When the ionic conductivity of the composition is excessively high, components unnecessary for polymerization may increase, and thus the stability of the latex may decrease.
The stability of latex may be improved by controlling the ionic conductivity during polymerization of latex including copolymers derived from conjugated di ene-based monomers, ethylenically unsaturated nitrile monomers, and ethylenically unsaturated acid monomers. Using this, low viscosity may be maintained even at a high solid content of 50% by weight or more. In addition, stability is maintained, and a copolymer with a large particle diameter of 1,000 A or more may be formed.
The conjugated diene-based monomer may be one or more selected from the group consisting of 1,3-butadiene, isoprene, 2,3-dimethy1-1,3-butadiene, 1,3-pentadiene, 1,3-h ex adi ene, 2-phenyl -1,3-butadiene, 3-methyl -1,3 -pentadi en e, 2-chl oro-1,3-butadiene, 3-butyl -1,3-octadiene, and octadiene. In the copolymer of latex for dip molding, the structure derived from the conjugated diene-based monomer may provide flexibility to a dip molded article The ethylenically unsaturated nitrile monomer may be one or more selected from the group consisting of acrylonitrile, methacrylonitrile, flimaronitrile, a-chloronitrile, and a-cyano ethyl acrylon'trile. In the copolymer of latex for dip molding, the structure derived from the ethylenically unsaturated nitrile monomer may improve the strength and chemical resistance of the dip molded article.
The ethylenically unsaturated acid monomer may be one or more selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, maleic anhydride, citraconic anhydride, styrene sulfonic acid, monobutyl fumarate, monobutyl maleate, and mono-2-hydroxypropyl maleate. In the copolymer of latex for dip molding, the structure derived from the ethylenically unsaturated acid monomer forms a cross-linked structure and thus may improve the mechanical properties of the dip molded article.
The ionic compound may be one or more selected from the group consisting of sodium chloride (NaC1), potassium chloride (KC1), calcium chloride (CaC12), magnesium chloride (MgC12), sodium nitrate (NaNO3), potassium nitrate (KNO3), calcium nitrate (Ca(NO3)2), magnesium nitrate (Mg(NO3)2), sodium sulfate (Na2SO4), potassium sulfate (K2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), sodium hydroxide (NaOH), potassium hydroxide (KOH), calcium hydroxide (Ca(OH)2), magnesium hydroxide (Mg(OH)2), sodium bicarbonate (NaHCO3), potassium bicarbonate (KHCO3), sodium carbonate (Na2CO3), potassium carbonate (K2CO3), sodium bisulfite (NaHSO4), potassium bisulfite (KHSO4), sodium pyrophosphate (Na413202), potassium pyrophosphate (K4P202), trisodium phosphate (Na3PO4), tripotassium phosphate (K3PO4), sodium monohydrogen phosphate (Na2HPO4), potassium monohydrogen phosphate (K2HPO4), ethylenediaminetetraacetic acid (EDTA) or a sodium salt thereof, ethylene glycol tetraacetic acid (EGTA) or a sodium salt thereof, nitrilotriacetic acid (NTA) or a sodium salt thereof, iminodiacetic acid (IDA) or a sodium salt thereof, and quinolinic acid (QNA) or a sodium salt thereof The ionic compound may improve the stability of the copolymer while the reaction is in progress during the copolymerization of latex for dip molding and may suppress aggregation of the latex even after polymerization.
The composition may include 30 to 90 parts by weight of the conjugated diene-based monomer, 1 to 55 parts by weight of the ethylenically unsaturated nitrile monomer, and 0.001 to 20 parts by weight of the ethylenically unsaturated acid monomer.
For example, the conjugated diene-based monomer content of the composition may be 30 parts by weight, 32.5 parts by weight, 35 parts by weight, 37.5 parts by weight, 40 parts by weight, 42.5 parts by weight, 45 parts by weight, 47.5 parts by weight, 50 parts by weight, 52.5 parts by weight, 55 parts by weight, 57.5 parts by weight, 60 parts by weight, 62.5 parts by weight, 65 parts by weight, 67.5 parts by weight, 70 parts by weight, 72.5 parts by weight, 75 parts by weight, 77.5 parts by weight, 80 parts by weight, 82.5 parts by weight, 85 parts by weight, 87.5 parts by weight, 90 parts by weight, or a value in a range between two of these values. When the content of the conjugated diene-based monomer is less than 30 parts by weight, the dip molded article may be excessively hardened, resulting in a poor fit, and when the content is more than 90 parts by weight, the durability or chemical resistance of the dip molded article may be reduced.
The ethyl enically unsaturated nitrile monomer content of the composition may be 1 part by weight, 2.5 parts by weight, 5 parts by weight, 7.5 parts by weight, 10 parts by weight, 12.5 parts by weight, 15 parts by weight, 17.5 parts by weight, 20 parts by weight, 22.5 parts by weight, 25 parts by weight, 27.5 parts by weight, 30 parts by weight, 32.5 parts by weight, 35 parts by weight, 37.5 parts by weight, 40 parts by weight, 42.5 parts by weight, 45 parts by weight, 47.5 parts by weight, 50 parts by weight, 52.5 parts by weight, 55 parts by weight, or a value in a range between two of these values. When the content of the ethylenically unsaturated nitrile monomer is less than 1 part by weight, the chemical resistance or mechanical strength of the dip molded article may be reduced, and when the content exceeds 55 parts by weight, the elongation of the dip molded article may be reduced, and thus usability may be reduced.
The ethylenically unsaturated acid monomer content of the composition may be 0.001 parts by weight, 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, 6 parts by weight, 6.5 parts by weight, 7 parts by weight, 7.5 parts by weight, 8 parts by weight, 8.5 parts by weight, 9 parts by weight, 9.5 parts by weight, 10 parts by weight, 10.5 parts by weight, 11 parts by weight, 11.5 parts by weight, 12 parts by weight, 12.5 parts by weight, 13 parts by weight, 13.5 parts by weight, 14 parts by weight, 14.5 parts by weight, 15 parts by weight, 15.5 parts by weight, 16 parts by weight, 16.5 parts by weight, 17 parts by weight, 17.5 parts by weight, 18 parts by weight, 18.5 parts by weight, 19 parts by weight, 19.5 parts by weight, 20 parts by weight, or a value in a range between two of these values. When the content of the ethylenically unsaturated acid monomer is less than 0.001 parts by weight, the tensile strength of the dip molded article may decrease, and when the content exceeds 20 parts by weight, the dip molded article may harden excessively, resulting in a poor fit.
In this specification, "total monomers" means the sum of the conjugated diene-based monomer, the ethylenically unsaturated nitrile monomer, and the ethylenically unsaturated acid monomer, but the composition for latex polymerization may further include polymerizable monomers other than the above-described conjugated diene-based monomer, ethylenically unsaturated nitrile monomer, and ethylenically unsaturated acid monomer, as long as the durability test result does not exceed the above range, and at this time, the "total monomers" further includes the polymerizable monomers.
In a non-limiting example, the monomers included in the composition may be composed of the above-described conjugated di cue-based monomer, ethyl eni call y unsaturated nitrile monomer, and ethylenically unsaturated acid monomer. When copolymerizing the above three types of monomers, the stability of latex may be improved and the average particle diameter may be increased by controlling ionic conductivity through the above-described ionic compounds, but it may be difficult to realize these effects when additional monomers are added.
The ionic compound content may vary depending on a monomer composition ratio and the type of ionic compound. The ionic compound content may be 0.1 to 5 parts by weight, for example, 0.1 parts by weight, 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, or a value in a range between two of these values, based on 100 parts by weight of the total monomers under conditions that satisfy the above-described ionic conductivity. When the content is outside the above range, it may be difficult to satisfy the ionic conductivity condition, or even when the ionic conductivity is satisfied, a stability improvement effect may not be realized.
The composition for latex polymerization may further include water, an emulsifier, a polymerization initiator, and a molecular weight adjusting agent.
For example, the water content may be 75 to 150 parts by weight, for example, 75 parts by weight, 77.5 parts by weight, 80 parts by weight, 82.5 parts by weight, 85 parts by weight, 87.5 parts by weight, 90 parts by weight, 92.5 parts by weight, 95 parts by weight, 97.5 parts by weight, 100 parts by weight, 102.5 parts by weight, 105 parts by weight, 107.5 parts by weight, 110 parts by weight, 112.5 parts by weight, 115 parts by weight, 117.5 parts by weight, parts by weight, 122.5 parts by weight, 125 parts by weight, 127.5 parts by weight, 130 parts by weight, 132.5 parts by weight, 135 parts by weight, 137.5 parts by weight, 140 parts by weight, 142.5 parts by weight, 145 parts by weight, 147.5 parts by weight, 150 parts by weight, or a value in a range between two of these values, based on 100 parts by weight of the total monomers. When the content of water is less than 75 parts by weight, viscosity excessively increases during polymerization, making it difficult to manufacture molded articles, arid when the content is more than 150 parts by weight, the solid content may be excessively low. The water may have an ionic conductivity of 5 its/cm or less, 2.5 Rs/cm or less, or 1 its/cm or less. For example, the water may be ion-exchanged water, ultrapure water, or purified water. When water with high ionic conductivity is used it may contain impurities that adversely affect polymerization stability or latex stability.
The emulsifier may be an anionic surfactant, a nonionic surfactant, a cationic surfactant, or an amphoteric surfactant. For example, as the anionic surfactant, one or more selected from the group consisting of alkylbenzene sulfonates, aliphatic sulfonates, sulfuric acid ester salts of higher alcohols, a-olefin sulfonate salts, and alkyl ether sulfuric acid ester salts may be used, but are not limited thereto. The emulsifier may be used in an amount of 0.8 to 8 parts by weight based on 100 parts by weight of the total monomers. Depending on the content of the emulsifier, the ionic compound content may vary to achieve the above- 1.5 described ionic conductivity.
The polymerization initiator may be a radical initiator. The radical initiator may be, for example, one or more of an inorganic peroxide selected from the group consisting of sodium persulfate, potassium persulfate, ammonium persulfate, potassium perphosphate, and hydrogen peroxide; an organic peroxide selected from the group consisting of t-butyl peroxide, cumene hydroperoxide, p-menthane hydroperoxide, di-t-butyl peroxide, t-butylcumyl peroxide, acetyl peroxide, isobutyl peroxide, octanoyl peroxide, dibenzoyl peroxide, 3,5,5-trimethylhexanol peroxide, and t-butylperoxyisobutyrate; and an azo-based initiator selected from the group consisting of azobisisobutyronitrile, azobis-2,4-dimethylvaleronitrile, azobiscyclohexanecarboni trite, and methyl azobisi sobutyric acid (butyric acid), but is not limited thereto. The polymerization initiator may be used in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the total monomers.
The molecular weight adjusting agent may be mercaptans such as an a-methylstyrene dimer, t-dodecyl mercaptan, n-dodecyl mercaptan, and octyl mercaptan; halogenated hydrocarbons such as carbon tetrachloride, methylene chloride, and methylene bromide; and sulfur-containing compounds such as tetraethylthiuram disulfide, dipentamethylenethiuram disulfide, and diisopropyl xanthogen disulfide, but is not limited thereto. The molecular weight adjusting agent content may be 0.1 to 1 part by weight based on 100 parts by weight of the total monomers of the copolymer latex. For example, the molecular weight adjusting agent may be 0.1 parts by weight, 0.15 parts by weight, 0.2 parts by weight, 0.25 parts by weight, 0.3 parts by weight, 0.35 parts by weight, 0.4 parts by weight, 0.45 parts by weight, 0.5 parts by weight, 0.55 parts by weight, 0.6 parts by weight, 0.65 parts by weight, 0.7 parts by weight, 0.75 parts by weight, 0.8 parts by weight, 0.85 parts by weight, 0.9 parts by weight, 0.95 parts by weight, 1 part by weight, or a value in a range between two of these values.
When the content of the molecular weight adjusting agent is less than 0.1 part by weight, a gel may be formed, and thus latex stability may be reduced, and when the content is more than 1 part by weight, tensile strength may be poor, stress retention may be reduced, and durability in actual use may be reduced.
Latex for dip molding The latex for dip molding according to another aspect is a latex for dip molding including a copolymer derived from the composition for latex polymerization described above, and an average particle diameter of the copolymer may be 1,000 to 3,000 A, for example, 1,000 A, 1,050 A, 1,100 A, 1,150 A, 1,200 A, 1,250 A, 1,300 A, 1,350 A, 1,400 A. 1,450 A, 1,500 A, 1,550 A, 1,600 A, 1,650 A, 1,700 A, 1,750 A, 1,800 A, 1,850 A, 1,900 A. 1,950 A, 2,000 A, 2,050 A, 2,100 A, 2,150 A, 2,200 A, 2,250 A, 2,300 A, 2,350 A, 2,400 A. 2,450 A, 2,500 A, 2,550 A, 2,600 A, 2,650 A, 2,700 A, 2,750 A, 2,800 A, 2,850 A, 2,900 A, 2,950 A, 3,000 A, or a value in a range between two of these values. The latex for dip molding is polymerized while controlling ionic conductivity, thereby minimizing the decrease in stability and enlarging the copolymer particle diameter. In addition, the latex may have better stability due to its low oligomer content.
The latex for dip molding may have a zeta potential (absolute value) of 60 mV or more, 62.5 mV or more, 65 mV or more, 67.5 mV or more, or 70 mV or more Latex that satisfies these conditions has excellent stability and thus may suppress an increase in viscosity even when concentrated with a high solid content of 50% by weight or more.
The viscosity of the latex for dip molding at 25 °C may be 50 to 2,500 cps, for example, 50 cps, 75 cps, 100 cps, 125 cps, 150 cps, 175 cps, 200 cps, 225 cps, 250 cps, 275 cps, 300 cps, 325 cps, 350 cps, 375 cps, 400 cps, 425 cps, 450 cps, 475 cps, 500 cps, 525 cps, 550 cps, 575 cps, 600 cps, 625 cps, 650 cps, 675 cps, 700 cps, 725 cps, 750 cps, 775 cps, 800 cps, 825 cps, 850 cps, 875 cps, 900 cps, 925 cps, 950 cps, 975 cps, 1,000 cps, 1,100 cps, 1,200 cps, 1,300 cps, 1,400 cps, 1,500 cps, 1,600 cps, 1,700 cps, 1,800 cps, 1,900 cps, 2,000 cps, 2,100 cps, 2,200 cps, 2,300 cps, 2,400 cps, 2,500 cps, or a value in a range between two of these values. Latex with a viscosity outside the above range may be practically impossible to manufacture or may be difficult to dip mold The solid content of the latex for dip molding may be 50 to 65% by weight, for example, 50% by weight, 52.5% by weight, 55% by weight, 57.5% by weight, 60% by weight, 62.5% by weight, 65% by weight, or a value in a range between two of these values. When the solid content is outside the above range, the effect of improving stability described above may be unnecessary or aggregation of latex may occur.
The characteristics of the latex for dip molding may be measured at pH 8.0 to 10.0, for example, pH 8.0, 8.1, 8.2, 8.3, 8.4, 8.5, 8.6, 8.7, 8.8, 8.9, 9.0, 9.1, 9.2, 9.3, 9.4, 9.5, 9.6, 9.7, 9.8, 9.9, 10.0. When adjusting the pH of latex through additives, the solid content and average particle diameter may change, but the latex for dip molding may simultaneously meet the above-described average particle diameter, solid content, and viscosity requirements in the above pH range.
The latex for dip molding may further include one or more additives selected from the group consisting of chelating agents, dispersants, pH adjusters, deoxidizers, particle diameter adjusters, anti-aging agents, and oxygen trapping agents As these additives, compositions known in the art can be used, and as long as they satisfy the above-described ionic conductivity range, descriptions of the type, function, and addition amount will be omitted. These additives may be added before or after polymerization of the copolymer.
The latex for dip molding satisfies low viscosity, high solid content, and large particle diameter at the same time, so the latex itself may have excellent stability. Therefore, it is possible to prevent the quality of a dip molded article from deteriorating even when external shock is applied or when stored for a long period of time.
Method of preparing latex for dip molding The method of preparing a latex for dip molding includes: (a) adding an emulsifier and water to a monomer mixture including a conjugated diene-based monomer, an ethylenically unsaturated nitrite monomer, and an ethylenically unsaturated acid monomer; (b) adjusting ionic conductivity by adding an ionic compound; and (c) preparing a latex for dip molding by adding a polymerization initiator, wherein in step (b), the ionic compound may be added so that ionic conductivity is 275 Rs/cm or more.
Step (a) is a step of preparing a monomer mixture including a conjugated diene-based monomer, an ethylenically unsaturated nitrile monomer, and an ethylen cally unsaturated acid monomer, which are monomers constituting a carboxylic acid-modified nitrile-based copolymer, and adding the mixture to emulsified water, and may performed under a nitrogen atmosphere.
In step (a) or (b), a molecular weight adjusting agent or an emulsifier may be further added These are the same as described above.
Step (b) is a step of preparing the composition for latex polymerization described above by adding an ionic compound, and may realize the above-mentioned stability improvement effect by controlling ionic conductivity after adding all the components necessary for polymerization The polymerization in step (c) may be performed at 10 to 90 °C, for example, 10°C, 15 °C, 20°C, 25 °C, 30°C, 35 °C, 40 °C, 45 °C, 50 °C, 55 °C, 60°C, 65 °C, 70°C, 75 °C, 80 IS °C, 85°C, 90°C, or a temperature between two of these temperatures.
When a conversion rate of the polymerization reaction is 90% or more, the polymerization may be stopped by adding a polymerization terminator. For example, the polymerization terminator may be added when a conversion rate of the polymerization reaction is 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 99.9%, or a value between two of these values.
The polymerization terminator may be one selected from the group consisting of hydroxyl amine, hydroxy amine sulfate, diethyl hydroxy amine, hydroxy amine sulfonic acid and alkali metal ions thereof, sodium dimethyldithiocarbamate, hydroquinone derivatives, aromatic hydroxy dithio carboxylic acids such as hydroxy diethyl benzene dithio carboxylic acid, hydroxy dibutyl benzene dithio carboxylic acid, and the like, and a combination of two or more thereof The content of the polymerization terminator may be 0.02 to 1.5 parts by weight based on 100 parts by weight of the monomer mixture Other raw materials and contents used in the above preparation method are as described above.
Dip molded article A dip molded article according to another aspect may be manufactured using the latex for dip molding described above.
The dip molded article may be manufactured by adding 0.1 to 1 part by weight of zinc oxide, 1 to 2 parts by weight of sulfur, and 0.3 to 1.5 parts by weight of a vulcanization accelerator to the latex for dip molding described above, based on 100 parts by weight of the copolymer, and then dip molding the mixture.
The zinc oxide may form a cross-linked structure by forming an ionic bond with a structure derived from the ethylenically unsaturated acid. In addition, when the ionic conductivity range described above is satisfied using an ionic compound, durability may be enhanced by improving the ionic bond strength. The content of the zinc oxide may be, for example, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight, 0.6 parts by weight, 0.7 parts by weight, 0.8 parts by weight, 0.9 parts by weight, or 1 part by weight. When the content of the zinc oxide is excessively small, durability in actual use may be reduced, and when the content is excessively large, tensile strength may be reduced.
The sulfur may react with a structure derived from the conjugated d ene-based monomer to form a cross-linked structure. When the ionic conductivity range described above is satisfied using the ionic compound, molded article shrinkage due to syneresis during vulcanization may be suppressed. The content of the sulfur may be, for example, 1 part by weight, 1.1 parts by weight, 1.2 parts by weight, 1.3 parts by weight, 1.4 parts by weight, 1.5 parts by weight, 1.6 parts by weight, 1.7 parts by weight, 1.8 parts by weight, 1.9 parts by weight, or 2.0 parts by weight. When the content of the sulfur is less than 1 part by weight, mechanical properties such as tensile strength and durability in actual use may be reduced, and when the content is more than 2 parts by weight, an allergic reaction may occur in users. The dip molded article may be dip molded after adjusting the solid content by adding an aqueous potassium hydroxide solution to the latex for dip molding, but is not limited thereto.
The tensile strength of the dip molded article may be 3 MPa or more, 5 MPa or more, 7 MPa or more, 9 NIPa or more, 11 MPa or more, 13 MPa or more, 15 MPa or more, 201\fPa or more, 25 MPa or more, 30 MPa or more, or 35 MPa or more, but is not limited thereto. The higher the tensile strength, the better the durability during storage, but other mechanical properties such as elongation may decrease.
The elongation of the dip molded article may be 600% or more, 650% or more, 700% or more, 750% or more, 800% or more, 850% or more, or 900% or more, but is not limited thereto. The higher the elongation, the better the fit, but there may be a trade-off with other mechanical properties The dip molded article may have a durability test result of 60 minutes or more, a tensile strength of 10 MPa or more, and an elongation of 600% or more. By controlling ionic conductivity during polymerization, a high-quality dip molded article may be manufactured by maintaining minimum tensile strength and elongation and at the same time having excellent durability in actual use as confirmed by durability tests.
[Durability test method] The following process was repeated to measure the time at which the molded product broke: a dip molded article with a width of 30 mm, a length of 135 mm, and a thickness of 0.06 to 0.08 mm is stretched 20% longitudinally, immersed in a pH 4.0 to 4.3 solution at 35 °C, and stretched for 10 seconds to achieve a longitudinal elongation of 50%, and after being fixed for 2 seconds, relaxed for 10 seconds so that the longitudinal elongation is 20% The durability test method is to check whether the specimen is broken by repeating stretching and relaxation in a solution of pH 4.0 to 4.3 at 35 °C, which is similar to skin and body fluids that are likely to come into contact with the dip molded article in actual use, for example, when the molded article is a glove, the durability of the dip molded article under actual use conditions may be measured by simulating a situation in which the molded article repeats stretching and relaxation according to the movement of the finger.
The dip molded article may be surgical gloves, medical gloves, gloves for processing agricultural and livestock products, industrial gloves, condoms, cosmetic materials, catheters, or molded articles for health care.
For example, the dip molded article may be surgical gloves or other medical gloves, industrial gloves such as gloves for handling chemicals, or cosmetic materials such as puffs, but is not limited thereto.
Hereinafter, examples of the present specification will be described in more detail. However, the following experimental results describe only representative experimental results among the examples, and the scope and content of the present invention may not be Interpreted as being reduced or limited by the examples Each effect of various implementations of the present invention not explicitly presented below will be specifically described in the corresponding section. Unless otherwise stated, each test may be performed at 20 °C and 1 atm.
Examples and Comparative Examples A 1 L high-pressure reactor equipped with a stirrer, thermometer, cooler, and nitrogen gas inlet and equipped to continuously introduce each component such as a monomer, an emulsifier, and a polymerization initiator was prepared. Ion-exchanged water with a conductivity of 1 Rs/cm or less was prepared. After the atmosphere in the reactor was replaced with nitrogen, a monomer mixture of 74 parts by weight of isoprene (IPM), 24 parts by weight of acrylonitrile (AN), and 2 parts by weight of methacrylic acid (MAA) was input. Then, based on 100 parts by weight of the monomer mixture, an ionic compound (IC), 0.5 parts by weight of t-dodecyl mercaptan as a molecular weight adjusting agent, 2 parts by weight of sodium alkylbenzenesulfonate as an emulsifier, and 120 parts by weight of on-exchanged water were input to the reactor. The ionic conductivity of the reactants was measured, and an ionic compound was input until the desired ionic conductivity was reached to prepare a composition for latex polymerization. After raising the temperature of the reactor to about 25 °C, 0.3 parts by weight of potassium persulfate was input. The types of ionic compounds used in each Example and Comparative Example and the ionic conductivity of the composition for latex polymerization are shown in Table 1 below.
When a conversion rate reached about 95%, 0.9 parts by weight of sodium hydroxide was input to stop the polymerization reaction. Thereafter, unreacted monomers and the like were removed through a deodorizing process, and ammonia water, antioxidants, antifoaming agents, and the like were added to obtain a carboxylic acid-modified nitrile-based copolymer latex of pH 8.5 (however, pH 9.6 in Example 6 and Comparative Example 6). The zeta potential, average particle diameter, solid content, and viscosity of the latex were measured and shown in Table 1 below.
In Comparative Example 7, no ionic compound was added to achieve the desired ionic conductivity, and 0.05 parts by weight of a molecular weight adjusting agent and 0.1 parts by weight of an emulsifier were input, but polymerization was not possible
[Table 1]
Classification IC Ionic Zeta Average Solid content 25 °C conductivity potential particle (% by viscosity (Ls/cm) (mV) diameter weight) (cps) (A) Example 1 K2CO3 297.3 -74.7 1,160 53.2 230 Example 2 Na2CO3 332.5 -81.2 1,200 54.5 420 Example 3 K2SO4 298.5 -75.2 1,010 50.3 110 Example 4 Na2SO4 292.5 -72 1,330 50.1 150 Example 5 Na2HPO4 293 -71.3 1,520 54.9 250 Example 6 EGTA 292.8 -73.1 1.950 57.7 150 Example 7 EDTA 311.2 -78.4 1,130 52.5 170 Example 8 NTA 296.5 -75.3 1,160 53.3 220 Example 9 DTPA 325.7 -79.3 1,080 50.4 95 Example 10 IDA 293.2 -75.9 1,210 54.7 480 Comparative K2CO3 274 -59.8 880 33.1 315
Example 1
Comparative K2CO3 269 -59.3 880 54.9 5,300
Example 2
Comparative EDTA 262 -59.7 1,180 55.5 8,800
Example 3
Comparative 243 -54 920 49.2 105
Example 4
Comparative - 232.6 -53.9 970 55.6 >10,000
Example 5
Comparative 239.8 -54.1 990 57.3 >10,000
Example 6
Comparative 184.2
Example 7
-Ionic conductivity (us/cm): Ionic conductivity was determined by the Nyquist method after measuring resistance using electrochemical impedance spectroscopy (EIS) using a two-electrode method. Resistance was measured under the conditions of a frequency of 60 Hz to 1 kHz, a current of 10.0 mV, and a voltage range of +10 V Ionic conductivity was measured after correction with a standard solution in the expected range A graphite electrode was used as an electrode. For ionic conductivity, the corrected value based on 25 °C was used.
- Zeta potential (mV): Zeta potential at 25 °C was measured using a Malvern Zetas zer instrument.
- Average particle diameter (A): It was measured by dynamic laser light scattering using Nanotrac 150.
-25 °C viscosity (cps): It was measured using a Brookfield viscometer using spindle 62 at a spindle speed of 100 rpm.
Referring to Table I, in the case of the examples where the ionic conductivity of the composition for latex polymerization was relatively high, the zeta potential, which indicates the electrical stability of the latex particles, was measured to be relatively large. As a result, it is judged that it is possible to have low viscosity while achieving a large particle diameter of 1,000 A or more and a high solid content of 50% by weight or more. On the other hand, the zeta potential of the latex of the comparative examples polymerized under conditions of low ionic conductivity was measured to be relatively small. Therefore, due to lack of stability, it was difficult to achieve a large particle diameter, high solid content, and low viscosity at the same time. Particularly, the latex of the comparative examples with a small particle diameter had a problem in that viscosity rapidly increased when the solid content was increased through concentration. In addition, when polymerization is performed while controlling ionic conductivity, the production of low molecular weight oligomers is expected to decrease, thereby increasing the stability of latex.
Experimental Examples To 100 parts by weight of the latex of the examples and comparative examples, 1.8 parts by weight of sulfur (S), 0.7 parts by weight of zinc oxide (ZnO) and 1.2 parts by weight of zinc dibutyldithiocarbamate (ZDBC) as a vulcanization accelerator were added.
Thereafter, an aqueous 4% potassium hydroxide solution and double distilled water were added to prepare a composition for dip molding with a solid content concentration of 20% and a pH of 10.0. Rectangular specimens with a width of 30 mm, a length of 135 mm, and a thickness of 0.06 to 0.08 mm were prepared with the dip molding composition, and physical properties were measured and shown in Table 2 below.
[Table 2]
Classification Tensile strength Elongation (1/0) S/R (%) Durability (min) (MPa) Example 4 26.8 729 34.1 >180 Example 5 34.2 722 31.4 >180 Example 6 35.7 660 38.8 >180 Comparative 28.9 575 27.0 153
Example 1
Comparative 25.7 608 28.4 164
Example 4
- Tensile strength and elongation: Using a universal testing machine (UTM), a dumbbell-shaped specimen was stretched at a rate of 500 mm/min, and the tensile load and elongation applied when fracture of the specimen occurred were measured - Stress retention (SIR): Using a universal testing machine, the specimen was stretched to 100% elongation at a rate of 500 mm/min, and then the initial tensile load (GO) was measured, the tensile load (.76) after 6 minutes was measured, and the stress retention was calculated according to the following equation.
er6 Co 00 -Durability: A solution of pH 4 was prepared using citric acid and maintained at 35 °C. A rectangular specimen was input into the solution while being stretched 20% in the longitudinal direction. The specimen was stretched to an elongation of 50% for 10 seconds, fixed for 2 seconds, and then relaxed to an elongation of 20% for 10 seconds, and the time at which the specimen was broken was measured.
Referring to Table 2, the specimens manufactured using the latex of the Examples were superior to the Comparative Examples in both mechanical strength and durability. In particular, when comparing Example 4 and Comparative Example 4, which had similar solid contents, the specimen of Example 4, which had relatively large average particles, had excellent mechanical strength and durability. This is believed to be because shrinkage of the film occurred in Comparative Example 4, which had a small average particle diameter, when manufacturing specimens through dip molding.
The description of the present specification described above is for illustrative purposes, and it should be understood that those of ordinary skill in the art to which one aspect of the present specification belongs can easily modify it into other specific forms without changing the technical idea or essential features described in this specification. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed form, and likewise components described as distributed may be implemented in a combined form.
The scope of the present specification is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present specification
Claims (1)
- [CLAIMS] [Claim 1] A composition for latex polymerization comprising--a conjugated diene-based monomer; an ethylenically unsaturated nitrile monomer; an ethylenically unsaturated acid monomer and an ionic compound, wherein an ionic conductivity is 275 Rs/cm or more [Claim 2] The composition of claim 1, wherein the conjugated diene-based monomer is one or more selected from the group consisting of 1,3-butadiene, isoprene, 2.3-dimethy1-1,3-butadiene, 1,3-pentadiene, 1,3 -hexadiene, 2-phenyl -1,3 -butadiene, 3 -methyl-1,3 -pentadiene, 2-chi oro-I,3 -butadi ene, 3-butyl -1,3 -octadi ene, and octadi en e.[Claim 3] The composition of claim 1, wherein the ethylenically unsaturated nitrile monomer is one or more selected from the group consisting of acrylonitrile, methacrylon trile, fumaron trile, a-chloronitrile, and a-cyano ethyl acrylon trile.[Claim 4] The composition of claim 1, wherein the ethylenically unsaturated acid monomer is one or more selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, maleic anhydride, citraconic anhydride, styrene sulfonic acid, monobutyl fumarate, monobutyl maleate, and mono-2-hydroxypropyl maleate.[Claim 5] The composition of claim 1, wherein the ionic compound is one or more selected from the group consisting of sodium chloride, potassium chloride, calcium chloride, magnesium chloride, sodium nitrate, potassium nitrate, calcium nitrate, magnesium nitrate, sodium sulfate, potassium sulfate, calcium sulfate, magnesium sulfate, sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, sodium bicarbonate, potassium bicarbonate, sodium carbonate, potassium carbonate, sodium bisulfite, potassium bi sulfite, sodium pyrophosphate, potassium pyrophosphate, trisod um phosphate, tripotass um phosphate, sodium monohydrogen phosphate, potassium monohydrogen phosphate, ethylenediaminetetraacetic acid or a sodium salt thereof, ethylene glycol tetraacetic acid or a sodium salt thereof nitrilotriacetic acid or a sodium salt thereof, iminodi acetic acid or a sodium salt thereof, and quinolinic acid or a sodium salt thereof.[Claim 6] The composition of claim 1, wherein the composition includes 30 to 90 parts by weight of the conjugated diene-based monomer, I to 55 parts by weight of the ethylenically unsaturated nitrile monomer, and 0.001 to 20 parts by weight of the ethylenically unsaturated acid monomer.[Claim 7] The composition of claim 1, further comprising water, an emulsifier, a polymerization initiator, and a molecular weight adjusting agent.[Claim 8] A latex for dip molding comprising a copolymer derived from the composition for latex polymerization of claim 1, wherein the copolymer has an average particle diameter of 1,000 to 3,000 A. [Claim 9] The latex of claim 8, wherein the latex has a viscosity of 50 to 2,500 cps at 25 °C.[Claim 10] The latex of claim 8, wherein a solid content of the latex is 50 to 65% by weight. [Claim 11] A dip molded article manufactured from the latex for dip molding of any one of claims 8 to 10.[Claim 12] The dip molded article of claim 11, wherein the dip molded article is surgical gloves, medical gloves, gloves for processing agricultural and livestock products, industrial gloves, condoms, cosmetic materials, catheters, or molded articles for health care.
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| PCT/KR2022/013397 WO2023043115A1 (en) | 2021-09-15 | 2022-09-06 | Composition for latex polymerization, latex for dip molding, and dip molded products manufactured therefrom |
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| KR20210041478A (en) * | 2019-10-07 | 2021-04-15 | 주식회사 엘지화학 | Method for preparing carboxylic acid modified-nitrile based copolymer latex |
| KR102287668B1 (en) * | 2020-02-17 | 2021-08-10 | 금호석유화학 주식회사 | Latex composition for dip molding and dip molded article prepared therefrom |
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| JP3199614U (en) * | 2015-06-19 | 2015-09-03 | 一般財団法人竹田健康財団 | Surgical instrument management system |
| US10452813B2 (en) * | 2016-11-17 | 2019-10-22 | Terarecon, Inc. | Medical image identification and interpretation |
| KR101884609B1 (en) * | 2017-05-08 | 2018-08-02 | (주)헬스허브 | System for diagnosing disease through modularized reinforcement learning |
| KR102099214B1 (en) | 2018-01-29 | 2020-04-09 | 건양대학교 산학협력단 | Artificial intelligence diseases diagnostic system through biological information and video information cooperation |
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| KR100214291B1 (en) * | 1996-04-03 | 1999-08-02 | 성재갑 | Nitrile rubber latex composites |
| US6458883B1 (en) * | 1999-01-14 | 2002-10-01 | Jsr Corporation | Conductive rubber composition and manufacturing method and conductive rubber member thereof |
| KR20020039855A (en) * | 2000-11-22 | 2002-05-30 | 성재갑 | Method for preparing latex having superior stability |
| KR20170098852A (en) * | 2014-12-25 | 2017-08-30 | 니폰 제온 가부시키가이샤 | Latex composition for dip molding and dip-molded article |
| KR20210041478A (en) * | 2019-10-07 | 2021-04-15 | 주식회사 엘지화학 | Method for preparing carboxylic acid modified-nitrile based copolymer latex |
| KR102287668B1 (en) * | 2020-02-17 | 2021-08-10 | 금호석유화학 주식회사 | Latex composition for dip molding and dip molded article prepared therefrom |
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| GB202402936D0 (en) | 2024-04-17 |
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