GB2616123B - Computer system and method for manufacturing a computer system - Google Patents

Computer system and method for manufacturing a computer system Download PDF

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Publication number
GB2616123B
GB2616123B GB2301215.6A GB202301215A GB2616123B GB 2616123 B GB2616123 B GB 2616123B GB 202301215 A GB202301215 A GB 202301215A GB 2616123 B GB2616123 B GB 2616123B
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GB
United Kingdom
Prior art keywords
computer system
manufacturing
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2301215.6A
Other versions
GB2616123A (en
GB202301215D0 (en
Inventor
Neukam Wilhelm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Client Computing Ltd
Original Assignee
Fujitsu Client Computing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Client Computing Ltd filed Critical Fujitsu Client Computing Ltd
Publication of GB202301215D0 publication Critical patent/GB202301215D0/en
Publication of GB2616123A publication Critical patent/GB2616123A/en
Application granted granted Critical
Publication of GB2616123B publication Critical patent/GB2616123B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2301215.6A 2022-02-04 2023-01-27 Computer system and method for manufacturing a computer system Active GB2616123B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102022102709.0A DE102022102709A1 (en) 2022-02-04 2022-02-04 Computer system and method of manufacturing a computer system

Publications (3)

Publication Number Publication Date
GB202301215D0 GB202301215D0 (en) 2023-03-15
GB2616123A GB2616123A (en) 2023-08-30
GB2616123B true GB2616123B (en) 2024-04-24

Family

ID=85476480

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2301215.6A Active GB2616123B (en) 2022-02-04 2023-01-27 Computer system and method for manufacturing a computer system

Country Status (4)

Country Link
JP (1) JP7506337B2 (en)
DE (1) DE102022102709A1 (en)
FR (1) FR3132578A1 (en)
GB (1) GB2616123B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
US20070279866A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation assembly
US20140022733A1 (en) * 2012-07-19 2014-01-23 Samsung Electronics Co., Ltd. Storage Device
WO2017116536A1 (en) * 2015-12-31 2017-07-06 Echostar Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US20200359525A1 (en) * 2018-01-12 2020-11-12 Nec Platforms, Ltd. Heat dissipation structure and heat dissipation method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710683B2 (en) 2006-03-24 2011-06-29 株式会社デンソー Heat dissipation device
JP2014036033A (en) 2012-08-07 2014-02-24 Hitachi Automotive Systems Ltd Semiconductor device
JP6303546B2 (en) 2014-01-30 2018-04-04 日本精工株式会社 Electronic control unit and electric power steering device
WO2016164417A1 (en) 2015-04-10 2016-10-13 Phoenix Contact Development and Manufacturing, Inc. Enclosure with multiple heat dissipating surfaces
JP7262215B2 (en) 2018-12-14 2023-04-21 新電元工業株式会社 electronic device
DE102019103071A1 (en) 2019-02-07 2020-08-13 Fujitsu Client Computing Limited COMPUTER SYSTEM AND THERMAL BODY
US11262815B2 (en) 2019-11-01 2022-03-01 Hewlett Packard Enterprise Development Lp Heat sink system with broad compatibility capacity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
US20070279866A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation assembly
US20140022733A1 (en) * 2012-07-19 2014-01-23 Samsung Electronics Co., Ltd. Storage Device
WO2017116536A1 (en) * 2015-12-31 2017-07-06 Echostar Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US20200359525A1 (en) * 2018-01-12 2020-11-12 Nec Platforms, Ltd. Heat dissipation structure and heat dissipation method

Also Published As

Publication number Publication date
JP2023114450A (en) 2023-08-17
GB2616123A (en) 2023-08-30
DE102022102709A1 (en) 2023-08-10
JP7506337B2 (en) 2024-06-26
GB202301215D0 (en) 2023-03-15
FR3132578A1 (en) 2023-08-11

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