GB2604725A

GB2604725A - Absorption modules

Info

Publication number: GB2604725A
Application number: GB2200480.8A
Authority: GB
Inventors: Charles Payne Nigel; Cheadle John
Original assignee: Quiescent Ltd
Current assignee: Quiescent Ltd
Priority date: 2021-01-14
Filing date: 2022-01-14
Publication date: 2022-09-14
Anticipated expiration: 2042-01-14
Also published as: GB202100469D0; GB2604725B

Abstract

An absorption module 20 comprising a containment 2 enclosing one or more regions of absorbing material 3, 4 in contact with one or more regions of insulating material 5. The absorbing material may be an EMI/RFI absorbing material. The regions of insulating material may comprise a stone such as granite. There may be two regions of absorbing material and a single insulating material region between them. The absorption material may be Shungite or may comprise irregular shaped or different sized particles in each region. The absorption module may provide a single point 9 for electrical and mechanical contact. The absorption module may comprise a Radio Frequency (RF) device 7 secured to a metal pin or bolt 6. A device e.g., an audio system, transformer, signal input/output, bridge rectifier, capacitor filter, shunt, mains unit or speaker system, comprising said absorption module.

Description

ABSORPTION MODULES

FIELD OF INVENTION

[0001] The present invention relates in general to absorption modules for improving the quality of digital and/or analogue outputs from electrical equipment and in particular to the quality of the audio outputs from audio equipment and systems and in particular digital audio equipment and systems.

BACKGROUND ART

[0002] In the field of electronics and electronic systems, and in particular equipment and systems for providing high fidelity sound output, signal quality from component to component through the system for final audio output is of vital importance. The design of the equipment or system and its individual components and sub-components can have a significant impact on the final audio quality. Historically the design of these components and systems has in part been directed at addressing a number of sources of interference that may degrade the quality of the digital or analogue signal.

[0003] One well known source of interference is electromagnetic interference (EMI), which is also referred to as radio-frequency interference (RFI) when in the radio frequency spectrum. EMURFI is a disturbance typically generated by an external source that affects an electrical circuit by electromagnetic induction, electrostatic coupling, or conduction. Thus, electromagnetic interference may be transmitted via conduction paths through a system or via airborne transmission between parts of a system. The source of this EMURFI may be other components of the circuit or electronic equipment or system and so may be generated internally within the system with one part of the system having a negative impact on another part. The disturbance may interrupt, obstruct, degrade, or limit the effective performance of the circuit or even stop it from functioning. In the case of a data path, such as a digital data path, these effects can range from an increase in error rate to a total loss of the data; with an increase in error rate comes poor quality signals and ultimately poor-quality audio outputs.

[0004] Another source of interference is vibration, which can take many forms but of particular concern are microphonic effects generated by the equipment and its components. Microphonics are unwanted electro-acoustic effects in electronic equipment caused by mechanical vibration. Within a piece of equipment or system the source of this microphonic interference can be individual components e.g., a transformer or even individual elements of printed circuits. For example, some capacitors and other sub-components exhibit an electrical response when stressed physically. Vibration related interference can be at any frequency and can propagate to other frequencies depending on the nature of interaction of the components with the original source of vibration.

Microphonic interference typically has a frequency response which is in the audible range. Microphonic interference may be transmitted through electrical circuits and components and can degrade the quality of digital signals and the ultimate audio output of a system, and this may easily be perceived by users through degraded sound quality.

[0005] Another source of undesirable mechanical vibration is through the contact of the equipment and system with the environment. Equipment will typically stand on a solid surface or is suspended from such a surface in a building. Ambient vibration from the surrounding environment may be transmitted into the equipment from its point contacts with its surroundings and such vibrations can negatively impact signal quality and ultimately the quality of the audio output.

[0006] Various approaches have been taken to deal with these undesirable sources of interference. With EMI/RFI interference manufacturers have sought to identify and use components that either have reduced levels of EMI/RFI generation and/or are less susceptible to the impact of EMI/RFI. In some instances, complex arrangements are invoked to mitigate these effects.

These solutions are expensive and usually result in an increase in cost for the individual components and overall system. Another approach has been to use added features such as RFI antennae, which absorb and dissipate the RFI before it is able to leave a component and cause interference. In a similar fashion, materials such as Shungite have been used as EMI absorption shields deployed next to components that are known to emit significant quantities of electromagnetic energy. In all cases the objective has been to dissipate airborne EMI and other forms of electromagnetic interference have not been adequately addressed.

[0007] In many systems, the source of the EMI/RFI is not adequately resolved, and systems engineers' resort to the use of electronic circuits designed to artificially correct and/or clean the final digital signal before it is used for sound generation. This approach is problematic because it is a process that is typically applied at the end of the process to a signal that has already been damaged through processing and is of low quality. Even if this approach is used at each signal processing stage, it is always dealing with a damaged output for the next stage. The task of any component in a system is to prepare an electrical signal or data stream that has the minimum and preferably no damage or diminishment of quality and which is clean, for onward transmission to the next component. Ideally, one would wish to prevent the damage and degradation in the first place. These techniques are also expensive and lead to higher equipment and systems costs.

[0008] In many approaches in the art the devices and modifications have no electrical contact with the equipment. They are typically highly symmetrical devices that are uniform in shape. These devices and approaches will often use electrical grounding and often multiple paths for electrical grounding which are problematic as they allow interference to be redirected back into the audio equipment, leading to further interference and ineffective isolation and dissipation of primary interference.

[0009] Another approach, particularly in relation to speaker vibration has been to utilize damping technologies, which further reduce unwanted speaker cabinet vibrations and may also reduce EMI/RF I interferences associated with this component. A recent example of this approach are the Apex Speaker Top Absorbers as manufactured and supplied by Quiescent Ltd. Ambient sources of vibration interference have typically been addressed by use of various equipment stands made of various materials or designed and engineered as dampening devices; a recent example of this approach are the Apex Couplers as manufactured by Quiescent Ltd. Similar approaches have been used in other components such as mains related components that incorporate multi-path acoustic labyrinth technology to dissipate vibration.

[0010] Despite these advances and methods of mitigating damaging interference in electronic systems especially digital and audio systems, there are no adequate solutions that address both electromagnetic and microphonic interference and so there is a need for new and alternative solutions that are effective and of low cost and complexity.

DISCLOSURE OF THE INVENTION

[0011] The present invention provides an alternative solution to the conventional approaches used in the art and enhances the performance of equipment prone to signal degradation through interference, especially high frequency interference.

[0012] The present invention is predicated on a new absorption module that may be used in many systems, separates, sub-systems and/or components and parts of an electrical system, especially an audio system to enhance the quality of the audio output. The absorption modules of the present invention have been found to address the problems associated with undesirable interference, both EMI/RFI and microphonic interference and in addition ambient vibration when adapted and utilized in the appropriate system separates, sub-systems and/or components, either internally or externally.

[0013] Thus, in accordance with the present invention there is provided an absorption module comprising a containment enclosing one or more regions of absorbing material in contact with one or more regions of insulating material.

[0014] In a preferred arrangement, there are at least two regions of absorbing material in contact with and separated by a single region of insulating 10 material.

[0015] In a preferred arrangement the absorbing material and the insulating material are in particulate form and most preferably irregular shaped particulates. Preferably these particulate materials are embedded within a matrix and preferably an organic matrix material. Examples of suitable organic matrix materials are a potting compound or similar polymeric matrix.

[0016] In a preferred arrangement the absorbing material and the insulating material are arranged as adjacent layers within the absorption 20 module.

[0017] The absorbing material may be any suitable absorbing and/or shielding material known in the art. Preferred absorbing materials are known EMI absorbing materials. Preferably, the EMI absorbing and/or shielding material is a mineral based material. Preferably the mineral based material comprises carbon, most preferably carbon in crystalline mineral form. Most preferably the EMI absorber is one or more forms of Shungite. In a preferred arrangement when there are two regions of absorbing material each region of absorbing material comprises particles of a different particle size and/or shape.

In a preferred arrangement when there are two regions of Shungite each region of Shungite comprises Shungite particles of a different particle size and/or shape.

[0018] The Shungite used in the present invention may be of any form of Shungite classified by carbon content. Shungite is typically classified as Shungite-1 having a carbon content in the range 98-100 weight percent, Shungite-2 having a carbon content in the range 35 to 80 weight percent, Shungite-3 having a carbon content in the range 20-35 weight percent carbon, Shungite-4 having a carbon content in the range 10-20 weight percent and Shungite-5 having a carbon content of less than 10 percent by weight. In a further classification, Shungite is subdivided into bright, semi-bright, semi-dull and dull on the basis of their luster (the terms lustrous and matte are also used for bright and dull). It is preferred that the Shungite used in the present invention is either Shungite 1 or Shungite 2 and mixtures thereof. Most preferably the Shungite is Shungite-1.

[0019] When there are two regions or layers of absorbing material in the absorption module each region of material may comprise a single absorption material or mixture of absorption materials. The absorption material may be present in the form of particles of the same or different average particle size and may consist of two different absorption materials of the same or different particle size. Preferably, the absorption material is present in two particle sizes and most preferably two particle sizes of the same material. Preferably the smaller particle sized absorption material is from 2 to 8 mm in diameter and the larger particle sized absorption material is from 5 to 15 mm in diameter, with these sizes being averages for what are irregular shaped particles. When there are two regions or layers of Shungite in the absorption module each region of Shungite may comprise a single class of Shungite or mixture of classes, and each region or layer may comprise different classes of Shungite and mixtures thereof. Preferably the smaller particle sized Shungite is from 2 to 8 mm in diameter and the larger particle Shungite is from 5 to 15 mm in diameter, with these sizes being averages for what are irregular shaped particles. It is preferred that the absorption materials are irregular in shape and when used in the absorption modules of the present invention preferably provide a multi-path absorption matrix for the absorption of high frequency interference such as interferences with a frequency that is above the normal audio range for audio equipment. This may be high frequency EMI/RFI and/or other electrical and mechanical interference. The irregular nature of the absorption material regions in the absorption module provides an absorption labyrinth with labyrinthine paths for interference dissipation and grounding. The absorption modules of the present invention through this arrangement can effectively nullify the impact of electromagnetic and mechanical interference whilst not interfering with or degrading at any significant level, or at all, the audio frequency range of any device or system generating the audio signal, thus providing a high-quality audio output.

[0020] The insulating material may be any suitable non-electrically conductive material. It is preferred that the insulating material is a mineral material. Most preferably the insulating material is a form of stone. Preferably, the insulating material is sandstone, limestone or granite or mixtures thereof and most preferably is granite. It is preferred that the mineral insulating material is of irregular shaped particles. Preferably the mineral insulating material particles are from 2 to 5 mm in size.

[0021] It is preferred that the absorption module of the present invention comprises a single point of external electrical and mechanical contact and optionally connection with the equipment to which it is being used to capture and dissipate interference in that equipment. It is preferred that there is no separate means of grounding between the absorption module and the equipment to which it is attached or in contact with.

[0022] The absorption module may be used as a single addition to a system or may be used in combination with one or more additional modules within a system. In the present invention a system is defined as a collection of one or more separates designed to perform a function. In a preferred arrangement the absorption module is deployed on systems used for digital or analogue audio and/or visual experiences (home cinema, 2-channel, or multichannel audio).

[0023] In the context of an audio system a separate is a single item in a system that is a self-contained set of sub-systems. In a typical audio or home-s cinema system, separates include but are not limited to digital streamer, SACD/CD transport, Digital-to-Analogue Converter (DAC), turntable, Blu-ray or 4k player, AN processor, preamplifier, power amplifier(s) and loudspeakers. A sub-system is a part of a separate that performs a function in order for the separate to meet its objective. A sub-system includes but is not limited to transformer, D.C. filter circuit, bridge rectification, amplification circuit, motor, speaker driver, low-pass and high-pass filter, processor, memory, SSD storage devices, CD mechanism, DAC circuit. A component is a part of a sub-system and can include transistors, voltage regulators, capacitors, resistors, inductors, and other Integrated Circuits (ICs). The absorption module of the present invention may be used in a system at the separates, sub-system or component level or any combination of these levels. If the absorption is used at multiple points within a level or at multiple levels within a system, the improvement in audio and video experience is enhanced. In a preferred arrangement, the absorption module is deployed at the earliest point of a system e.g., separates so that the output from that part of the system is of the highest possible quality before it is processed by subsequent separates. In a similar fashion within the sub-system architecture deployment may be optimum if the correct sub-system or all key sub-system items have the absorption module deployed. If it is determined that a specific component is a source of interference such as EMI/RFI and/or microphonic interference, then the absorption module may be deployed at the component level. In principle if there are multiple sources of interference such as EMI/RF I within a system the deployment of the absorption module at each of these sources will be beneficial to further processing of digital or analogue signals and the ultimate quality of the audio and video output.

[0024] In arrangements of the present invention, the absorption module is adapted to have a single point of connection to external equipment adapted to be secured to a sub-system or component of an audio or video system. Typically, this adaption may take the form of means of attachment of the absorption module to the component or sub-system that may utilize attachment functionality already present in or on the component or sub-system, with the absorption module being adapted to accommodate this. In one preferred arrangement, the absorption module comprises either a male or female component of a bolt arrangement that may cooperate with the corresponding male or female arrangement associated with a component or sub-system. As an example, a transformer may be secured to the separate's chassis by means of an M6 hardened steel bolt in which case the absorption module comprises an M6 hardened steel female nut arrangement that can be bolted directly onto the bolt securing the module to the transformer. The attachment means of the absorption module may be located on the surface of the module, with the containment of the module or preferably is arranged to pass into the module and through one or more of the internal regions or layers. In a preferred arrangement the attachment means passes through and transverses all the regions or layers within the module. Thus, in the case of a nut and bolt arrangement the nut may extend through the module as an elongated steel nut traversing all regions or layers. When the attachment means is a bolt, the head of the bolt is in effect the module as a significant portion of the bolt will extend through and traverse the internal regions or layers. In both these arrangements, there is a steel metal pin that transverses all the regions or layers within the module, in effect connecting them to each other and to the sub-system or component to which the module is secured. This arrangement may be supplemented with one or more internal metal pins that transverse the internal layers. In this arrangement, it is preferred that the absorption material layers comprise absorption material of different particle size and that the layer comprising absorption material of larger particle size is proximate to the component or sub-system attachment.

[0025] In other arrangements, the absorption module is adapted to provide contact support to a separate of the system but is not adapted to be physically attached and secured to it. This arrangement is appropriate when the absorption module is to be used as a coupler or damping device for separates in a system. Preferably, this is through a single point of external contact with the separate. In this arrangement, the nut or bolt is replaced by a metal pin that transverses the internal layers of the absorption module which is exposed at its upper surface and protrudes therefrom. Preferably, the exposed end of the pin is a sharpened point, and it is this sharpened point that will be in electrical contact with the chassis of the separate of the system being supported by the absorption module. The tip of the coupler is made from hardened steel making an electrical contact with the component chassis. In practice there will be more than one absorption module used to support any given component; typically, this will be three or four absorption modules being used as couplers or damping supports. In this arrangement it is preferred that the absorption layers comprise absorption material of different particle size and that the layer comprising material of larger particle size is proximate to the contact point with the separate. The absorption module may be associated with any mains power source and/or associated shunt for the system and is preferably deployed at the power source for each separate of the system. Thus, the absorption module may be used with a mains cable where the cable passes through the module. The absorption module may be associated with speaker connection systems and interconnections. Thus, the absorption module may be used with speaker connection systems and interconnections and may be arranged such that any such systems and interconnections comprise an absorption module with interconnection cable passing through the module. It is also envisaged that the absorption module of the present invention may be adapted to provide grounding to an audio speaker via external contact to the speaker and/or via contact or connection to an internal component or sub-system within the speaker.

[0026] In other arrangements for use as speaker top absorbers there is no attachment means or exposed pin arrangement. In this arrangement there may be one or more internal pins that traverse all the regions or layers.

[0027] The containment for the absorption module may be of any suitable insulating or non-insulating material. The containment may be manufactured from aluminium, or plastic. Aluminium containments may be machined from a solid block of high-grade aluminium. The containment may be 3D printed. It is preferred that the containment is manufactured such that there are no parallel internal surfaces to the containment.

[0028] In a preferred arrangement, all the absorption modules of the present invention also comprise an internal Radio Frequency (RF) device which is secured to the internal surface of a metal pin or bolt located within the absorption layer remote from the point of contact of the absorption module with the component or sub-component of the system. This RF device allows for high-frequency waves to see a low load impedance and to be effectively scattered inside this absorption layer and the structure, minimizing any re-radiation back into the component or sub-component.

[0029] The absorption module of the present invention may be used with each and all parts of a system. In some arrangements, this may consist of use as a coupling to one or more internal sub-systems and in addition as an external support coupler or damping device. The more parts of the system that utilize the absorption module of the present invention the greater the improvement of audio and video output. Ideally, the absorption module should be used with each sub-system and preferably with all internal components, especially those such as, but not limited to, transformers, which are known to be a particularly high source of interference.

[0030] Thus, the absorption module may be used with each and every internal sub-system of an amplifier, including peak speaker, capacitor and rectifier bridge, signal input and output, transformer and mains and shunt. The absorption module may be used with each and every internal sub-system of other separates such as balanced power units, DAC, digital streamers, and preamplifiers.

[0031] Thus, the present invention further provides for an audio or video system comprising two or more separates wherein at least one of the separates or its sub-systems or components comprises one or more absorption modules.

[0032] It should be understood the absorption module may be used with other technologies such as mobile, visual e.g., TV, etc. and may be adapted to improve signals that suffer from interference such as EMI/RF I, microphonic interference and/or ambient vibration or any combination of these interferences that could degrade the integrity of a data signal.

[0033] Various objects features and advantages of the present invention will become apparent to those skilled in the art upon reading the following detailed description, when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of an absorption module according to the present invention adapted for use with a transformer, FIG. 2 is a schematic sectional view of an absorption module according to the present invention adapted for use as a separates support, and FIG. 3 is an audio system arranged with absorption modules according to the present invention.

DETAILED DESCRIPTION

[0034] With reference to Figure 1, an absorption module (1) consists of a containment (2) within which is located two regions of absorbing material (3, 4) separated by a region of insulating material (5). An internally threaded steel pin (6), which is exposed at the surface of the containment (2) passes through the top absorbing material region (3), through the insulating region (5) and into the bottom absorbing material region (4). In this example the absorbing material regions consist of irregular shaped particulate Shungite-1, with region (3) having a smaller particle size compared to region (4). The region (5) of insulating material consists of particulate granite. The particulate materials of each region (3, 4 and 5) are encased within a matrix of potting material, which is also used to close the opening (8) of the containment (2). This absorption module (1) may be secured to a separate or a sub-system part through attachment to the steel pin. Also indicated is an RFI antenna (7), which is attached to the end of the pin (6), which is exposed within the absorbing material region (4).

[0035] With reference to Figure 2, an absorption module (20) consists of a containment (2) within which is located two regions of absorbing material (3, 4) separated by a region of insulating material (5). An internally steel pin (6), which is exposed at the surface of the containment (2) passes through the top absorbing material region (3), through the insulating region (5) and into the bottom absorbing material region (4). The pin (6) is exposed at the surface of the containment (2) in the form of sharp point (9), which may make electrical contact with the chassis of a separate. The regions of absorbing material comprise irregular shaped particulate Shungite-1, with region (3) having a smaller particle size compared to region (4). The region (5) of insulating material consists of particulate granite. The particulate materials of each region (3, 4 and 5) are encased within a matrix of potting material, which is also used to close the opening (8) of the containment (2). This absorption module (1) may be secured to a separate or a sub-system part through attachment to the steel pin.

Also indicated is an RFI antenna (7), which is attached to the end of the pin (6), which is exposed within EMI region (4).

[0036] With reference to Figure 3, a typical digital audio system (30) is illustrated. This system comprises four separates including a digital streamer (31), a pre-amplifier (32), a power amplifier (33) and a set of speakers (34, 34').

Each of these separates has three couplers (35) supporting it. Each of these separates also has a mains power unit (36) with associated shunt (37). The speakers (34,34) are connected to the power amplifier (33) via a pair of speaker connector systems (38, 38'). This system (30) may be modified with the absorption modules of the present invention in many ways. The couplers (35) may be absorption modules according to the invention. Each of the separates (31, 32, 33 and 34) may incorporate one or more absorption modules within their Sub-systems. Each of the mains power units (36) and associated shunts (37) may be arranged as modified absorption modules or may incorporate an absorption module. The speaker connection systems (38, 38'), may also incorporate an absorption module.

[0037] It will be understood by those skilled in the art that while the present invention has been described in terms of a preferred arrangement thereof, numerous modifications, additions and changes can be made thereto without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

CLAIMS1. An absorption module comprising a containment enclosing one or more regions of absorbing material in contact with one or more regions of insulating material.
2. An absorption module as claimed in claim 1, wherein the absorbing material is a mineral based material.
3. An absorption module as claimed in claim 1, wherein the absorbing material is an EMI/RFI and mechanical interference absorbing material.
4. An absorption module as claimed in any one of claim 1 to 3, wherein there are two regions of absorbing material.
5. An absorption module as claimed in claim 4, wherein there is a single insulating material region between the two regions of absorbing material.
6. An absorption module as claimed in claims 1 to 5, wherein the absorption material is one or more forms of Shungite.
7. An absorption module as claimed in any one of the preceding claims, wherein the absorbing material comprises irregular shaped particles.
8. An absorption module as claimed in claim 4, wherein the absorbing material regions comprise absorbing material of different particle size in each region.
9. An absorption module as claimed in any one of the preceding claims adapted to provide a single point for electrical and mechanical contact and optionally connection to equipment having electromagnetic and mechanical 35 interference.
10. An absorption module as claimed in any one of the preceding claims comprising a multi-path absorption matrix for the absorption of high frequency 5 interference.
11. An absorption module as claimed in any one of the preceding claims comprising an absorption labyrinth with labyrinthine paths for interference dissipation and grounding.
12. An absorption module as claimed in any one of the preceding claims, wherein the insulating material is a mineral material.
13. An absorption module as claimed in claim 13, wherein the insulating material is a form of stone.
14. An absorption module as claimed in claim 14, wherein the insulating material is granite.
15. An absorption module as claimed in any one of the preceding claims, adapted to be secured to or in contact with a separate, sub-system or component of an audio system.
16. An absorption module as claimed in claim 10, wherein the single point of contact of the absorption module is located on the surface of the module or within the containment of the module.
17. An absorption module as claimed in claim 17, wherein the single point of contact is arranged to pass into the module and through one or more of the internal regions or layers.
18. An absorption module as claimed in claim 17, wherein the single point of contact passes through and transverses all of the absorbing material regions or layers and insulating material regions or layers within the module.
19. An absorption module as claimed in claim 8, wherein the absorbing material layer comprising larger particle size is proximate to the attachment to the separate, sub-system or component.
20. An absorption module as claimed in claim 1, adapted to provide 10 grounding to an audio speaker via external contact to the speaker and/or via contact or connection to an internal component or sub-system within the speaker.
21. An absorption module as claimed in claim 1, wherein the containment comprises no parallel internal surfaces.
22. An absorption module as claimed in claim 1, wherein the module further comprises an internal Radio Frequency (RF) device, which is secured to the internal surface of a metal pin or bolt.
23. A transformer or signal input/output or bridge rectifier or capacitor filter or mains unit and shunt or speaker connection system comprising an absorption module as claimed in claim 1.
24. A mains unit arranged as an absorption module.
25. A system separate comprising one or more absorption modules according to claim 1.
26. A power amplifier or balanced power unit or a DAC unit or digital streamer or a pre-amplifier comprising a transformer and/or a signal input output, and/or a bridge rectifier, and/or a capacitor filter, and or a mains unit and/or a peak speaker with any one or more of these comprising one or more absorption modules according to claim 1.
27. An audio system comprising two or more separates and Sub-systems wherein at least one of the separates and Sub-systems comprises one or more absorption modules according to claim 1.