GB2597427B - Co-packaged optics and transceiver - Google Patents

Co-packaged optics and transceiver Download PDF

Info

Publication number
GB2597427B
GB2597427B GB2116930.5A GB202116930A GB2597427B GB 2597427 B GB2597427 B GB 2597427B GB 202116930 A GB202116930 A GB 202116930A GB 2597427 B GB2597427 B GB 2597427B
Authority
GB
United Kingdom
Prior art keywords
transceiver
optics
packaged
packaged optics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2116930.5A
Other versions
GB202116930D0 (en
GB2597427A (en
Inventor
Arlo Nelson David
Lee Seungjae
Sawyer Brett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rockley Photonics Ltd
Original Assignee
Rockley Photonics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/393,763 external-priority patent/US10872854B2/en
Application filed by Rockley Photonics Ltd filed Critical Rockley Photonics Ltd
Publication of GB202116930D0 publication Critical patent/GB202116930D0/en
Publication of GB2597427A publication Critical patent/GB2597427A/en
Application granted granted Critical
Publication of GB2597427B publication Critical patent/GB2597427B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
GB2116930.5A 2019-04-24 2020-04-24 Co-packaged optics and transceiver Active GB2597427B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16/393,763 US10872854B2 (en) 2018-04-25 2019-04-24 Electro-optical package and method of fabrication
US202062967965P 2020-01-30 2020-01-30
US16/824,609 US10962728B2 (en) 2018-04-25 2020-03-19 Co-packaged optics and transceiver
PCT/EP2020/061482 WO2020216916A1 (en) 2019-04-24 2020-04-24 Co-packaged optics and transceiver

Publications (3)

Publication Number Publication Date
GB202116930D0 GB202116930D0 (en) 2022-01-05
GB2597427A GB2597427A (en) 2022-01-26
GB2597427B true GB2597427B (en) 2023-06-28

Family

ID=72941059

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2116930.5A Active GB2597427B (en) 2019-04-24 2020-04-24 Co-packaged optics and transceiver

Country Status (3)

Country Link
CN (1) CN113994470A (en)
GB (1) GB2597427B (en)
WO (1) WO2020216916A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220200183A1 (en) * 2020-12-23 2022-06-23 Intel Corporation Micro socket electrical couplings for dies
US11762155B2 (en) * 2021-08-25 2023-09-19 Cisco Technology, Inc. Photonics packaging platform

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050285214A1 (en) * 2004-06-25 2005-12-29 Krishnamoorthy Ashok V Integrated circuit chip that supports through-chip electromagnetic communication
US20140064659A1 (en) * 2012-08-28 2014-03-06 Acacia Communications Inc. Electronic and optical co-packaging of coherent transceiver
WO2016061312A1 (en) * 2014-10-17 2016-04-21 Cisco Technology Inc. Opto-electrical chip and ic system having a printed circuit
DE202018101250U1 (en) * 2017-04-14 2018-06-22 Google Llc Integration of high-rate silicon photonics IC

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050285214A1 (en) * 2004-06-25 2005-12-29 Krishnamoorthy Ashok V Integrated circuit chip that supports through-chip electromagnetic communication
US20140064659A1 (en) * 2012-08-28 2014-03-06 Acacia Communications Inc. Electronic and optical co-packaging of coherent transceiver
WO2016061312A1 (en) * 2014-10-17 2016-04-21 Cisco Technology Inc. Opto-electrical chip and ic system having a printed circuit
DE202018101250U1 (en) * 2017-04-14 2018-06-22 Google Llc Integration of high-rate silicon photonics IC

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JAMES P HOFMEISTER ET AL: "Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST", 2008 IEEE AEROSPACE CONFERENCE; 1-8 MARCH 2008; BIG SKY; MT, USA, IEEE, PISCATAWAY, NJ, USA, 1 March 2008 (2008-03-01), pages 1-11, XP031256494, ISBN: 978-1-4244-1487-1 chapter 4. figures 15, 16 *

Also Published As

Publication number Publication date
GB202116930D0 (en) 2022-01-05
WO2020216916A1 (en) 2020-10-29
GB2597427A (en) 2022-01-26
CN113994470A (en) 2022-01-28

Similar Documents

Publication Publication Date Title
IL290397A (en) Ultra-wide field-of-view flat optics
ZA202101503B (en) Mirror
CA208970S (en) Mirror
EP3704813A4 (en) Optical packaging and designs for optical transceivers
SG11202013228XA (en) Metasurfaces for laser speckle reduction
EP3634343A4 (en) Light incontinence pad
GB2597427B (en) Co-packaged optics and transceiver
CA192919S (en) Beam
SG11202107475PA (en) Ophthalmological lens
CA210011S (en) Mirror
EP3934031A4 (en) Laser device
CA188813S (en) Light
CA188630S (en) Light
EP4074453A4 (en) Laser device
GB201910732D0 (en) Telescopes
EP3699652A4 (en) Wavelength converter
GB201809899D0 (en) Luminares and optical elements for use therein
CA195596S (en) Combined flashlight and laser device
CA226153S (en) Mirror
CA203842S (en) Mirror
GB2601981B (en) Light gold
CA208704S (en) Transceiver unit
CA190734S (en) Transceiver unit
GB202115742D0 (en) Laser
GB2585330B (en) Light fitting

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20220901 AND 20220907

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20230511 AND 20230517