GB2588529A - Sealing device - Google Patents

Sealing device Download PDF

Info

Publication number
GB2588529A
GB2588529A GB2018266.3A GB202018266A GB2588529A GB 2588529 A GB2588529 A GB 2588529A GB 202018266 A GB202018266 A GB 202018266A GB 2588529 A GB2588529 A GB 2588529A
Authority
GB
United Kingdom
Prior art keywords
sealing member
sealing device
passage
sealing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB2018266.3A
Other versions
GB202018266D0 (en
Inventor
Clements Ben
Clements Trevor
Dicken Steven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Emerson and Renwick Ltd
Original Assignee
Emerson and Renwick Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson and Renwick Ltd filed Critical Emerson and Renwick Ltd
Publication of GB202018266D0 publication Critical patent/GB202018266D0/en
Publication of GB2588529A publication Critical patent/GB2588529A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

There is provided a sealing device for a substrate processing apparatus, the sealing device comprising: an outer body at least partially defining a passage for the transfer of a substrate therethrough, a sealing member configured to selectively obstruct the passage so as to form a substantially gas-tight seal in response to an input, wherein the sealing member is a substantially continuous loop peripherally surrounding the passage or surrounded by the passage.

Claims (15)

CLAIMS:
1. A sealing device for a substrate processing apparatus, the sealing device comprising: an outer body at least partially defining a passage for the transfer of a substrate therethrough, a sealing member configured to selectively obstruct the passage so as to form a substantially gas-tight seal in response to an input, wherein the sealing member is a substantially continuous loop peripherally surrounding the passage or surrounded by the passage.
2. A sealing device according to claim 1 , further comprising an inner body peripherally surrounded by the outer body, the inner body being spaced apart from the outer body so as to define the passage therebetween.
3. A sealing device according to any preceding claim, wherein the sealing member is expandable between an unsealed configuration in which passage of gas through the passage is permitted and a sealed configuration in which passage of gas through the passage is substantially prevented.
4. A sealing device according to claim 3, wherein the sealing member comprises a resiliently deformable material.
5. A sealing device according to claim 3 or 4, wherein the sealing member comprises a hollow interior configured to receive a pressurised fluid.
6. A sealing device according to claim 5, wherein the sealing member comprises a sealing member port configured to place the interior of the sealing device in fluid communication with a pressure regulating system.
7. A sealing device according to any preceding claim, wherein the outer body comprises a groove configured to receive the sealing member.
8. A sealing device according to any preceding claim wherein the sealing member is supported by the outer body.
9. A sealing device according to any preceding claim, wherein the sealing member is a first sealing member and the sealing device further comprises a second sealing member.
10. A sealing device according to claim 9, wherein an intermediate zone is defined between the first sealing member and the second sealing member, the sealing device comprising an intermediate port in fluid communication with the intermediate zone and a pressure regulating system.
11. A substrate processing apparatus comprising a first chamber and a second chamber separated by a wall, wherein the wall comprises a sealing device according to any preceding claim.
12. A substrate processing apparatus according to claim 11 , wherein sealing device is a first sealing device and the wall further comprises a second sealing device.
13. A method of forming a seal between a first chamber and a second chamber in a substrate processing apparatus, the method comprising: providing a sealing device including a passage in a wall of the substrate processing apparatus separating the first chamber and the second chamber; arranging a sealing member within the passage in a substantially continuous loop; actuating the sealing member so as to obstruct the passage to form a substantially gas-tight seal.
14. A method of forming a seal according to claim 13, wherein the method further comprises: forming the sealing member from a resilient material, providing the sealing member with a hollow interior, and adjusting the pressure of a fluid contained in the interior of the sealing member so that it is higher than the pressure of the environment to the exterior of the sealing member.
15. A method of operating a substrate processing apparatus comprising forming a seal according to claim 13 or 14.
GB2018266.3A 2018-04-23 2019-04-23 Sealing device Withdrawn GB2588529A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1806585.4A GB2573110A (en) 2018-04-23 2018-04-23 Load Lock
PCT/GB2019/051134 WO2019207295A1 (en) 2018-04-23 2019-04-23 Sealing device

Publications (2)

Publication Number Publication Date
GB202018266D0 GB202018266D0 (en) 2021-01-06
GB2588529A true GB2588529A (en) 2021-04-28

Family

ID=62236089

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1806585.4A Withdrawn GB2573110A (en) 2018-04-23 2018-04-23 Load Lock
GB2018266.3A Withdrawn GB2588529A (en) 2018-04-23 2019-04-23 Sealing device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1806585.4A Withdrawn GB2573110A (en) 2018-04-23 2018-04-23 Load Lock

Country Status (2)

Country Link
GB (2) GB2573110A (en)
WO (1) WO2019207295A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10945752B2 (en) 2019-03-20 2021-03-16 Covidien Lp Tissue resecting instrument including a rotation lock feature

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891223A (en) * 1973-06-20 1975-06-24 Kleinewefers Ind Co Gmbh Seal for treatment containers, especially for width of textile goods
US20100038283A1 (en) * 2008-08-14 2010-02-18 Ming-Long Chiu Wafer container having the latch and inflatable seal element
US20120061605A1 (en) * 2010-09-10 2012-03-15 Applied Materials, Inc. Gate valve
US20140023460A1 (en) * 2008-08-28 2014-01-23 Applied Materials, Inc. Slit valve door with moving mating part

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7090743B2 (en) * 1999-09-20 2006-08-15 Hunter Douglas Inc. Pressure laminator apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891223A (en) * 1973-06-20 1975-06-24 Kleinewefers Ind Co Gmbh Seal for treatment containers, especially for width of textile goods
US20100038283A1 (en) * 2008-08-14 2010-02-18 Ming-Long Chiu Wafer container having the latch and inflatable seal element
US20140023460A1 (en) * 2008-08-28 2014-01-23 Applied Materials, Inc. Slit valve door with moving mating part
US20120061605A1 (en) * 2010-09-10 2012-03-15 Applied Materials, Inc. Gate valve

Also Published As

Publication number Publication date
GB2573110A (en) 2019-10-30
WO2019207295A1 (en) 2019-10-31
GB202018266D0 (en) 2021-01-06
GB201806585D0 (en) 2018-06-06

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)