GB2583099B - Precision laser machining apparatus - Google Patents

Precision laser machining apparatus Download PDF

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Publication number
GB2583099B
GB2583099B GB1905322.2A GB201905322A GB2583099B GB 2583099 B GB2583099 B GB 2583099B GB 201905322 A GB201905322 A GB 201905322A GB 2583099 B GB2583099 B GB 2583099B
Authority
GB
United Kingdom
Prior art keywords
machining apparatus
laser machining
precision laser
precision
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1905322.2A
Other versions
GB2583099A (en
GB201905322D0 (en
Inventor
Stewart Hall James
Graham Hall James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tannlin Technology Ltd
Original Assignee
Tannlin Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tannlin Technology Ltd filed Critical Tannlin Technology Ltd
Priority to GB1905322.2A priority Critical patent/GB2583099B/en
Publication of GB201905322D0 publication Critical patent/GB201905322D0/en
Priority to PCT/GB2020/050887 priority patent/WO2020212687A1/en
Publication of GB2583099A publication Critical patent/GB2583099A/en
Application granted granted Critical
Publication of GB2583099B publication Critical patent/GB2583099B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0823Devices involving rotation of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
GB1905322.2A 2019-04-15 2019-04-15 Precision laser machining apparatus Active GB2583099B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1905322.2A GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus
PCT/GB2020/050887 WO2020212687A1 (en) 2019-04-15 2020-04-02 Precision machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1905322.2A GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus

Publications (3)

Publication Number Publication Date
GB201905322D0 GB201905322D0 (en) 2019-05-29
GB2583099A GB2583099A (en) 2020-10-21
GB2583099B true GB2583099B (en) 2023-12-27

Family

ID=66809973

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1905322.2A Active GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus

Country Status (2)

Country Link
GB (1) GB2583099B (en)
WO (1) WO2020212687A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230234164A1 (en) * 2022-01-27 2023-07-27 Ii-Vi Delaware, Inc. Polycrystalline diamond (pcd) laser lapping machine
CN114654085B (en) * 2022-04-16 2024-02-06 绍兴豪春纺织科技有限公司 Nickel screen supporting structure of laser net making machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114287A1 (en) * 2011-09-26 2013-03-28 Keming Du System useful for irradiating and processing substrates with high-performance ultra-short pulse laser, comprises laser beam source, energy modulation unit, beam forming- or beam focusing unit, rotational axis, linear axis and cylinder
US20130256279A1 (en) * 2012-04-02 2013-10-03 Disco Corporation Laser processing method and laser processing apparatus
WO2014162145A1 (en) * 2013-04-05 2014-10-09 Tannlin Technology Limited Laser cutting machine
CN204524545U (en) * 2015-04-17 2015-08-05 温州大学 A kind of laser process machine processing spiral path

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114287A1 (en) * 2011-09-26 2013-03-28 Keming Du System useful for irradiating and processing substrates with high-performance ultra-short pulse laser, comprises laser beam source, energy modulation unit, beam forming- or beam focusing unit, rotational axis, linear axis and cylinder
US20130256279A1 (en) * 2012-04-02 2013-10-03 Disco Corporation Laser processing method and laser processing apparatus
WO2014162145A1 (en) * 2013-04-05 2014-10-09 Tannlin Technology Limited Laser cutting machine
CN204524545U (en) * 2015-04-17 2015-08-05 温州大学 A kind of laser process machine processing spiral path

Also Published As

Publication number Publication date
WO2020212687A1 (en) 2020-10-22
GB2583099A (en) 2020-10-21
GB201905322D0 (en) 2019-05-29

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