GB2569222B - Circuit assembly - Google Patents

Circuit assembly Download PDF

Info

Publication number
GB2569222B
GB2569222B GB1816880.7A GB201816880A GB2569222B GB 2569222 B GB2569222 B GB 2569222B GB 201816880 A GB201816880 A GB 201816880A GB 2569222 B GB2569222 B GB 2569222B
Authority
GB
United Kingdom
Prior art keywords
circuit assembly
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1816880.7A
Other versions
GB201816880D0 (en
GB2569222A (en
Inventor
Armitage Adam
James Heaton Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MBDA UK Ltd
Original Assignee
MBDA UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MBDA UK Ltd filed Critical MBDA UK Ltd
Publication of GB201816880D0 publication Critical patent/GB201816880D0/en
Publication of GB2569222A publication Critical patent/GB2569222A/en
Application granted granted Critical
Publication of GB2569222B publication Critical patent/GB2569222B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB1816880.7A 2017-10-18 2018-10-17 Circuit assembly Active GB2569222B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1717121.6A GB201717121D0 (en) 2017-10-18 2017-10-18 Circuit Assembly

Publications (3)

Publication Number Publication Date
GB201816880D0 GB201816880D0 (en) 2018-11-28
GB2569222A GB2569222A (en) 2019-06-12
GB2569222B true GB2569222B (en) 2020-04-01

Family

ID=60419379

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB1717121.6A Ceased GB201717121D0 (en) 2017-10-18 2017-10-18 Circuit Assembly
GB1816880.7A Active GB2569222B (en) 2017-10-18 2018-10-17 Circuit assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB1717121.6A Ceased GB201717121D0 (en) 2017-10-18 2017-10-18 Circuit Assembly

Country Status (1)

Country Link
GB (2) GB201717121D0 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
US5821279A (en) * 1995-04-25 1998-10-13 Goo Chemical Co., Ltd. Filling material composition used for a process of manufacturing a printed circuit board with plated through-holes
US20020000932A1 (en) * 1999-04-01 2002-01-03 Phillip Lee Metzen Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
US6479763B1 (en) * 1998-08-28 2002-11-12 Matsushita Electric Industrial Co., Ltd. Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821279A (en) * 1995-04-25 1998-10-13 Goo Chemical Co., Ltd. Filling material composition used for a process of manufacturing a printed circuit board with plated through-holes
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
US6479763B1 (en) * 1998-08-28 2002-11-12 Matsushita Electric Industrial Co., Ltd. Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
US20020000932A1 (en) * 1999-04-01 2002-01-03 Phillip Lee Metzen Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same

Also Published As

Publication number Publication date
GB201816880D0 (en) 2018-11-28
GB201717121D0 (en) 2017-11-29
GB2569222A (en) 2019-06-12

Similar Documents

Publication Publication Date Title
EP3701609A4 (en) Pyro-fuse circuit
GB2570618B (en) Components
SG11202005555XA (en) Integrated circuit
HUE039255T2 (en) Mounting assembly
PL3404818T3 (en) Semiconductor circuit assembly
EP3467855C0 (en) Electrical component
GB2562533B (en) Components
GB201506651D0 (en) An assembly
GB2570805B (en) Interface circuit
LT3623027T (en) Assembly structure
GB2549927B (en) Circuit architecture
GB201513402D0 (en) Electrical assembly
EP3486580C0 (en) An improved refrigeration circuit
GB2560778B (en) Circuit Board Assembly
GB201716605D0 (en) An electrical component
GB201514934D0 (en) Electrical assembly
GB2564713B (en) Driver Circuit
GB2547716B (en) An electrical assembly
GB201608019D0 (en) Electrical assembly
GB2569222B (en) Circuit assembly
TWI562687B (en) Circuit board assembly
GB201511919D0 (en) Mounting assembly
GB2557911B (en) Circuit arrangement
GB2560761B (en) Assembly
EP3615700C0 (en) Assembly component