GB2559982B - Tooling support and workpiece support assembly - Google Patents

Tooling support and workpiece support assembly Download PDF

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Publication number
GB2559982B
GB2559982B GB1702911.7A GB201702911A GB2559982B GB 2559982 B GB2559982 B GB 2559982B GB 201702911 A GB201702911 A GB 201702911A GB 2559982 B GB2559982 B GB 2559982B
Authority
GB
United Kingdom
Prior art keywords
support
tooling
workpiece
assembly
support assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1702911.7A
Other versions
GB201702911D0 (en
GB2559982A (en
Inventor
randall Christopher
Short Neil
Ash Paddy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT SMT Singapore Pte Ltd
Original Assignee
ASM Assembly Systems Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Assembly Systems Singapore Pte Ltd filed Critical ASM Assembly Systems Singapore Pte Ltd
Priority to GB1702911.7A priority Critical patent/GB2559982B/en
Publication of GB201702911D0 publication Critical patent/GB201702911D0/en
Priority to CN201810142206.6A priority patent/CN108466194B/en
Publication of GB2559982A publication Critical patent/GB2559982A/en
Application granted granted Critical
Publication of GB2559982B publication Critical patent/GB2559982B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulding By Coating Moulds (AREA)
GB1702911.7A 2017-02-23 2017-02-23 Tooling support and workpiece support assembly Active GB2559982B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1702911.7A GB2559982B (en) 2017-02-23 2017-02-23 Tooling support and workpiece support assembly
CN201810142206.6A CN108466194B (en) 2017-02-23 2018-02-11 Tool support and workpiece support assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1702911.7A GB2559982B (en) 2017-02-23 2017-02-23 Tooling support and workpiece support assembly

Publications (3)

Publication Number Publication Date
GB201702911D0 GB201702911D0 (en) 2017-04-12
GB2559982A GB2559982A (en) 2018-08-29
GB2559982B true GB2559982B (en) 2021-11-24

Family

ID=58544088

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1702911.7A Active GB2559982B (en) 2017-02-23 2017-02-23 Tooling support and workpiece support assembly

Country Status (2)

Country Link
CN (1) CN108466194B (en)
GB (1) GB2559982B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2580347A (en) * 2019-01-03 2020-07-22 Asm Assembly Systems Singapore Pte Ltd Alignment of singulated workpieces
DE102023110268B3 (en) * 2023-04-21 2024-06-20 Schunk Electronic Solutions Gmbh Holding device with vacuum modules and brushes for holding a flat material, modular system and processing device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456426A1 (en) * 1990-05-07 1991-11-13 Canon Kabushiki Kaisha Vacuum type wafer holder
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US20050036267A1 (en) * 2003-05-20 2005-02-17 Savas Stephen Edward Clamp for holding and efficiently removing heat from workpieces
US20090060688A1 (en) * 2005-03-28 2009-03-05 Naoki Asada Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device
US20140370659A1 (en) * 2013-06-13 2014-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Singulation apparatus and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019936A1 (en) * 1990-06-22 1992-02-13 Airbus Gmbh DEVICE FOR ADJUSTING THE HEIGHT OF A TENSIONER
ATE143843T1 (en) * 1993-10-05 1996-10-15 Gfm Fertigungstechnik WORK TABLE FOR MACHINE TOOLS
DE19521616C1 (en) * 1995-06-14 1997-07-17 Felber Peter Economical vacuum application to worktable holding down flexible film
IT1279409B1 (en) * 1995-11-13 1997-12-10 Fk Systema S R L MODULAR BLOCK FOR THE FORMATION OF SUCTION TABLES IN MACHINES FOR CUTTING FABRICS WITH AN ALTERNATIVE MOVING BLADE
CN104526418B (en) * 2014-12-08 2016-08-31 南京航空航天大学 Intelligent universal vacuum holding clipping system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456426A1 (en) * 1990-05-07 1991-11-13 Canon Kabushiki Kaisha Vacuum type wafer holder
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US20050036267A1 (en) * 2003-05-20 2005-02-17 Savas Stephen Edward Clamp for holding and efficiently removing heat from workpieces
US20090060688A1 (en) * 2005-03-28 2009-03-05 Naoki Asada Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device
US20140370659A1 (en) * 2013-06-13 2014-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Singulation apparatus and method

Also Published As

Publication number Publication date
CN108466194A (en) 2018-08-31
GB201702911D0 (en) 2017-04-12
GB2559982A (en) 2018-08-29
CN108466194B (en) 2020-07-24

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