GB2559272B - Electronic device and display device including the same - Google Patents
Electronic device and display device including the same Download PDFInfo
- Publication number
- GB2559272B GB2559272B GB1721231.7A GB201721231A GB2559272B GB 2559272 B GB2559272 B GB 2559272B GB 201721231 A GB201721231 A GB 201721231A GB 2559272 B GB2559272 B GB 2559272B
- Authority
- GB
- United Kingdom
- Prior art keywords
- same
- display device
- electronic device
- device including
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5628—Programming or writing circuits; Data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5642—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/349—Arrangements for evaluating degradation, retention or wearout, e.g. by counting erase cycles
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50004—Marginal testing, e.g. race, voltage or current testing of threshold voltage
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50016—Marginal testing, e.g. race, voltage or current testing of retention
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160017818A KR101751407B1 (en) | 2016-02-16 | 2016-02-16 | Analog information based emulation method for investigating reliability of flash memory and apparatus of the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201721231D0 GB201721231D0 (en) | 2018-01-31 |
GB2559272A GB2559272A (en) | 2018-08-01 |
GB2559272B true GB2559272B (en) | 2020-04-29 |
Family
ID=59354638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1721231.7A Active GB2559272B (en) | 2016-02-16 | 2017-12-19 | Electronic device and display device including the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101751407B1 (en) |
GB (1) | GB2559272B (en) |
WO (1) | WO2017142185A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109684150B (en) * | 2018-12-24 | 2022-04-26 | 北京得瑞领新科技有限公司 | Performance test system, test method and simulation platform of storage particle controller |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0147856A2 (en) * | 1983-12-27 | 1985-07-10 | Sony Corporation | Electrically conductive adhesive sheet |
JPS62115678A (en) * | 1985-11-13 | 1987-05-27 | 信越ポリマ−株式会社 | Connector |
EP0256756A2 (en) * | 1986-08-05 | 1988-02-24 | Minnesota Mining And Manufacturing Company | Electrically conductive tape |
US6617521B1 (en) * | 1998-12-21 | 2003-09-09 | Seiko Epson Corporation | Circuit board and display device using the same and electronic equipment |
US20060163724A1 (en) * | 2005-01-25 | 2006-07-27 | Samsung Electronics Co., Ltd. | Display apparatus |
EP1895585A2 (en) * | 2006-09-01 | 2008-03-05 | Samsung Electronics Co., Ltd. | Chip film package and display panel assembly having the same |
US20080078574A1 (en) * | 2006-10-02 | 2008-04-03 | Ha-Yun Kang | Gasket and display apparatus having the same |
US20080089018A1 (en) * | 2006-09-22 | 2008-04-17 | Jae-Kook Kim | Gasket and Display Apparatus Having the Same |
US20110176074A1 (en) * | 2010-01-20 | 2011-07-21 | Zhang Ge | Twisted nematic (tn) based 3d display system and method |
US20150160467A1 (en) * | 2013-12-11 | 2015-06-11 | Lg Display Co., Ltd. | Switchable lens device and 2- and 3-dimensional image display device using the same |
KR20160039101A (en) * | 2014-09-30 | 2016-04-08 | 엘지디스플레이 주식회사 | Switchable polarization lens, the method of manufacturing the same, and 2-dimensional and 3-dimensional image display device using the same |
KR20160059059A (en) * | 2014-11-17 | 2016-05-26 | (주)유니즌이엠씨 | Environment-friendly double-sided adhesive tape preventing oxidation of adherend |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2907808B1 (en) * | 1998-03-31 | 1999-06-21 | 三洋電機株式会社 | Flash memory emulation device and debug system using the same |
PL363945A1 (en) | 2003-12-08 | 2005-06-13 | Advanced Digital Broadcast Polska Spółka z o.o. | Software method for eeprom memory emulation |
JP4647446B2 (en) | 2005-09-20 | 2011-03-09 | 富士通株式会社 | Semiconductor memory device |
US7515456B2 (en) * | 2006-09-11 | 2009-04-07 | Infineon Technologies Ag | Memory circuit, a dynamic random access memory, a system comprising a memory and a floating point unit and a method for storing digital data |
JP2008077176A (en) * | 2006-09-19 | 2008-04-03 | Seiko Epson Corp | Emulation system and emulation method |
US7719901B2 (en) * | 2007-06-05 | 2010-05-18 | Micron Technology, Inc. | Solid state memory utilizing analog communication of data values |
-
2016
- 2016-02-16 KR KR1020160017818A patent/KR101751407B1/en active IP Right Grant
- 2016-12-23 WO PCT/KR2016/015240 patent/WO2017142185A1/en active Application Filing
-
2017
- 2017-12-19 GB GB1721231.7A patent/GB2559272B/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0147856A2 (en) * | 1983-12-27 | 1985-07-10 | Sony Corporation | Electrically conductive adhesive sheet |
JPS62115678A (en) * | 1985-11-13 | 1987-05-27 | 信越ポリマ−株式会社 | Connector |
EP0256756A2 (en) * | 1986-08-05 | 1988-02-24 | Minnesota Mining And Manufacturing Company | Electrically conductive tape |
US6617521B1 (en) * | 1998-12-21 | 2003-09-09 | Seiko Epson Corporation | Circuit board and display device using the same and electronic equipment |
US20060163724A1 (en) * | 2005-01-25 | 2006-07-27 | Samsung Electronics Co., Ltd. | Display apparatus |
EP1895585A2 (en) * | 2006-09-01 | 2008-03-05 | Samsung Electronics Co., Ltd. | Chip film package and display panel assembly having the same |
US20080089018A1 (en) * | 2006-09-22 | 2008-04-17 | Jae-Kook Kim | Gasket and Display Apparatus Having the Same |
US20080078574A1 (en) * | 2006-10-02 | 2008-04-03 | Ha-Yun Kang | Gasket and display apparatus having the same |
US20110176074A1 (en) * | 2010-01-20 | 2011-07-21 | Zhang Ge | Twisted nematic (tn) based 3d display system and method |
US20150160467A1 (en) * | 2013-12-11 | 2015-06-11 | Lg Display Co., Ltd. | Switchable lens device and 2- and 3-dimensional image display device using the same |
KR20160039101A (en) * | 2014-09-30 | 2016-04-08 | 엘지디스플레이 주식회사 | Switchable polarization lens, the method of manufacturing the same, and 2-dimensional and 3-dimensional image display device using the same |
KR20160059059A (en) * | 2014-11-17 | 2016-05-26 | (주)유니즌이엠씨 | Environment-friendly double-sided adhesive tape preventing oxidation of adherend |
Also Published As
Publication number | Publication date |
---|---|
KR101751407B1 (en) | 2017-07-11 |
WO2017142185A1 (en) | 2017-08-24 |
GB2559272A (en) | 2018-08-01 |
GB201721231D0 (en) | 2018-01-31 |
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