GB2546827A - MEMS device and process - Google Patents

MEMS device and process Download PDF

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Publication number
GB2546827A
GB2546827A GB1604309.3A GB201604309A GB2546827A GB 2546827 A GB2546827 A GB 2546827A GB 201604309 A GB201604309 A GB 201604309A GB 2546827 A GB2546827 A GB 2546827A
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United Kingdom
Prior art keywords
membrane
moveable portion
mems transducer
flexible membrane
vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1604309.3A
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GB2546827B (en
GB201604309D0 (en
Inventor
Robert Jenkins Colin
Wei Hong Chung Colin
Lyall Cargill Scott
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Cirrus Logic International Semiconductor Ltd
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Cirrus Logic International Semiconductor Ltd
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Priority to GB1801317.7A priority Critical patent/GB2557755B/en
Publication of GB201604309D0 publication Critical patent/GB201604309D0/en
Priority to GB1700944.0A priority patent/GB2547103A/en
Priority to CN201780014131.7A priority patent/CN108702575B/en
Priority to PCT/GB2017/050166 priority patent/WO2017129958A1/en
Priority to US15/414,178 priority patent/US10266393B2/en
Priority to TW106103161A priority patent/TWI663120B/en
Publication of GB2546827A publication Critical patent/GB2546827A/en
Application granted granted Critical
Publication of GB2546827B publication Critical patent/GB2546827B/en
Active legal-status Critical Current
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0061Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051For defining the movement, i.e. structures that guide or limit the movement of an element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/007For controlling stiffness, e.g. ribs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B5/00Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0016Protection against shocks or vibrations, e.g. vibration damping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158Diaphragms, membranes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/01Electrostatic transducers characterised by the use of electrets
    • H04R19/016Electrostatic transducers characterised by the use of electrets for microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0264Pressure sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109Bridges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118Cantilevers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/058Rotation out of a plane parallel to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00Microstructural systems or auxiliary parts thereof
    • B81B2207/01Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15151Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A MEMS transducer comprising a flexible membrane 501 with a vent structure comprising at least one moveable portion 502 which, in response to differential pressure across the vent, is rotatable about two axes of rotation R1, R2 which are in the plane of the membrane 501. The vent bleed holes allow for pressure equalisation between cavities and the double hinge reduces the effect of high pressure impulses by utilising a double hinge thus preventing damage or overload of the diaphragm 501. The dual axes may allow a variable acoustic impedance. Rotation about R1 may cause deflection away from the membrane plane, whilst rotation about R2 may cause tilting, exposing an aperture which provides a flow path for pressure change. A joint or beam between the triangular, rectangular, or square shaped membrane 501 and flap 502 may be provided off-centre along an edge. The microeletromechanical transducer may use capacitive sensing with electrodes and may be utilised as a microphone in mobile telephones, computing devices or other portable electronics.

Description

MEMS DEVICE AND PROCESS
This invention relates to a rnicro-eiectro'machanlcel system (MEMS) device end process, end in particular to a MEMS device and process relating to a transducer, for example a capacitive microphone.
Various MEMS devices are becoming increasingly popular, MEMS transducers, and especially MEMS capacitive microphones, are Increasingly being used in portable electronic devices such as mobile telephones and portable computing devices.
Microphone devices formed using MEMS fabrication processes typically comprise one or more membranes with electrodes for read-out/drive deposited on the membranes and/or a substrate, in the case of MEMS pressure sensors and microphones, the read out is usually accomplished by measuring the capacitance between a pair of electrodes which will vary as the distance between the electrodes changes in response to sound waves incident on the membrane surface,
Figures 1a and 1b show a schematic diagram and a perspective view, respectively, of a known capacitive MEMS microphone device 100. The capacitive microphone device 100 comprises a membrane iayer 101 which forms a flexible membrane which is free to move in response to pressure differences generated by sound waves. A first electrode 102 is mechanically coupled to the flexible membrane, and together they form a first capacitive plate of the capacitive microphone device. A second electrode 103 is mechanically coupled to a generally rigid structural layer or back-plate 104, which together form a second capacitive piate of the capacitive microphone device, in the example shown in Figure 1a the second electrode 103 Is embedded within the back-plate structure 104,
The capacitive microphone Is formed on a substrate 105, for example a silicon wafer which may have upper and lower oxide Sayers 106, 107 formed thereon. A cavity 108 in the substrate and in any overlying layers (hereinafter referred to as a substrate cavity) is provided below the membrane, and may be formed using a "back-etch" through the substrate 105, The substrata cavity 108 connects to a first cavity 109 located directly below the membrane. These cavities 108 and 109 may collectively provide an acoustic volume thus allowing movement of the membrane in response to an acoustic stimulus. Interposed between the first and second electrodes 102 and 103 is a second cavity 110.
The first cavity 109 may be formed using a first sacrificial layer during the fabrication process, i.e, using a material to define the first cavity which can subsequently be removed, and depositing the membrane layer 101 over the first sacrificial material· Formation of the first cavity 109 using a sacrificial iayer means that the etching of the substrate cavity 108 does not play any part in defining the diameter of the membrane. Instead, the diameter of the membrane Is defined by the diameter of the first cavity 109 (which in turn is defined by the diameter of the first sacrificial layer) In combination with the diameter of the second cavity 110 (which in turn may be defined by the diameter of a second sacrificial layer). The diameter of the first cavity 109 formed using the first sacrificial layer can be controlled more accurately than the diameter of a back-etch process performed using a wet-etch or a dry-etch. Etching the substrate cavity 108 will therefore define an opening in the surface of the substrate underlying the membrane ioij|l)|l|l|ljj|J|||||i A plurality of holes, hereinafter referred to as bleed holes 111, connect the first cavity 109 and the second cavity 110,
As mentioned the membrane may be formed by depositing at least one membrane iayer 101 over a first sacrificial material. In this way the material of the membrane layer(s) may extend into the supporting structure, i.e. the side wails, supporting the membrane. The membrane and back-plate layer may be formed from substantially the same material as one another, for instance both the membrane end back-plate may be formed by depositing silicon nitride layers. The membrane iayer may be dimensioned to have the required flexibility whereas the back-plate may be deposited to be a thicker and therefore more rigid structure. Additionally various other material layers could be used in forming the back-plate 104 to control toe properties thereof. The use of a silicon nitride material system is advantageous In many ways, although other materials may be used, for instance fvSEMS transducers using poiysilicon membranes are known.
In some applications, the microphone may be arranged in use such that incident, sound is received via toe back-plate. In such instances a further plurality of holes, hereinafter referred to as acoustic holes 112, are arranged in the back-plate 104 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 110, The first and second cavities 109 and 110 in association with the substrate cavity 108 allow the membrane 101 to move in response to the sound waves entering via the acoustic holes 112 In the back-plate 104. in such instances the substrate cavity 108 is conventionally termed a "back volume", and it may be substantially sealed.
In other applications, the microphone may be arranged so that sound may be received via the substrate cavity 108 in use. In such applications the back-plate 104 is typically stiil provided with a plurality of holes to allow air to freely move between the second cavity and a further volume above the back-plate.
It should aiso be noted that whilst Figure 1 shows the back-plate 104 being supported on the opposite side of the membrane to the substrate 105, arrangements are known where the back-plate 104 is formed closest to the substrate with the membrane layer 101 supported above it.
In use, in response to a sound wave corresponding to a pressure wave Incident on the microphone, the membrane is deformed slightly from its equilibrium position. The distance between the lower electrode 102 and the upper electrode 103 is correspondingly altered, giving rise to a change in capacitance between the two electrodes that is subsequently detected by electronic circuitry (not shown). The bleed holes allow the pressure In the first and second cavities to equalise over a relatively long timescales (in acoustic frequency terms) which reduces the effect of low frequency pressure variations, e.g. arising from temperature variations and the like, but without impacting on sensitivity at the desired acoustic frequencies.
The transducer shown in Figure 1 is illustrated with substantially vertical side walls supporting the membrane layer 101 in spaced relation from the back-plate 104. Given the nature of the deposition process this can lead to a high stress concentration at the corners formed in the material layer that forms the membrane. Sloped or slanted side walls may be used to reduce the stress concentration. Additionally or alternatively It is known to include a number of support structures such as columns to help support the membrane In a way which reduces stress concentration. Such columns are formed by patterning the first sacrificial material used to define the first cavity 109 such that the substrate 105 is exposed in a number of areas before depositing the material forming the membrane layer 101. However, this process can lead to dimples In the upper surface of the back-plate layer in the area of the columns. MEMS transducers such as those shown in Figure 1 may usefully he used in a range of devices, including portable devices. Especially when used for portable devices it is desirable that the MEMS transducers are sufficiently rugged to survive expected handling end use of the device. There is therefore a general desire to improve the resilience of MEMS devices.
Thus, to be useful for use in portable electronic devices such transducers should be able to survive the expected handling and use of the portable device, which may mdude the device being accidentally dropped.
If a device such as a mobile telephone is subject to a fall, this can result not only in a mechanical shock due to impact but also s high pressure impulse incident on a MEMS transducer. Per example, a mobile telephone may have a sound/acoustic port for a MEMS microphone on one face of the device, if the device fails onto that face, some sir may be compressed by the failing device and forced into the sound port This may result in a high pressure impulse incident on the transducer. It has been found that in conventional MEMS transducers of the form described above high pressure impulses can potentially lead to damage of the transducer.
The sacrificial material used to define the first and second cavities is dimensioned so as to provide a desired equilibrium separation between the membrane layer 101 and the substrate 105 and also between the membrane layer 101 and the back-plate 104 so as to provide good sensitivity and dynamic range in use. in normal operation the membrane may deform within the volume defined by the first and second cavities without contacting the back-plate and/or substrate 105,
In response to a high pressure impulse however the membrane layer 101 may exhibit a greater amount of deformation than usual. Figure 2a illustrates the situation whore the membrane has been deformed downwards following a high pressure event and Figure 2b shows the situation where the membrane has been displaced upwards.
Consider the situation where the microphone is arranged to receive Incident sound from a sound port arranged above the back-plate 104 and the sound port pressure suddenly increases, for instance as a result of air trapped when the device falls being forced into the sound port This may result the pressure in the second cavity 110 being significantly greater than the pressure in the first cavity 109, displacing the membrane downwards to greater extent than is usual This may result in a relatively large stress at point 301 where membrane layer 101 forms part of the sidewall of supporting structure 201 and, in some instances, may thus result in determination of the membrane layer from the rest of the sidewail structure. Further, if the pressure difference is great enough the membrane may make contact with the substrate 105 at the edge of the substrate defined by the side wall 202 of the opening of substrate cavity 108. Typically the edge of the substrate at the location of the opening of substrate cavity has a relatively sharp angle and thus the membrane may be deformed round this edge, leading to a large stress concentration at this point 302.
As mentioned previously the membrane layer 101 wifS typically be formed from one or more thin layers of semiconductor material, such as silicon nitride, Whilst such a material can be flexible when subject to even stresses if there is a significant localised out-of-plane stress, such as may be introduced into the membrane at point 302 by contact with the edge of toe opening of substrate cavity 108, the membrane material ran be relatively brittle. Thus contact between the membrane and the edge of the opening of substrate cavity in this way can lead to damage such as cracking of the ........membrane.
The bleed holes discussed above with relation to Figure 1 will provide a flow path between the first and second cavities and thus flow of air through the bieed holes wiii reduce the pressure differential acting on the membrane over time. However the bieed holes are typically deliberately arranged to provide a limited amount of How so as to provide a desired frequency response. Thus a high pressure differential may be maintained across the membrane for a relatively long period of time before flow through the bleed holes acts to equalise the pressures in the first and second cavities. The time taken to equalise via the bieed holes could be changed by altering the size and/or number of bleed hole but this may impact negatively on transducer performance.
As the high pressure caused by trapped air may persist for a relatively long time, the pressure in the first arte second cavities may equalise by virtue of the bleed holes as discussed. Thus the pressure in the first cavity, arid substrate cavity, may increase until the pressures are equalized. However once air is no longer being forced into the sound port the pressure in the sound port will reduce quite quickly and. as typically the back-plate has a low acoustic impedance, the pressure in the second cavity wiii quickly reduce. At this point the pressure in the first cavity may be significantly greater than the pressure in the second cavity and thus the membrane may he deformed upwards, again to a greater extent than may usually be in the ease. Again this may lead ίο a significant stress in region 301 where the membrane layer 101 meets the sidewaii of the supporting structure, if the pressure difference is iarge enough the membrane may be displaced far enough to contact the back-plate 104. This may limit the amount of travel of the membrane as compared with the situation shown in Figure 2a but again this may introduce stress into the membrane layer at the point 303 where it contacts the back-plate 104. Again it may take a while for this pressure differential to reduce by virtue of flow through the bleed holes, it should be appreciated that both of these situations can also occur when sound is received via the substrate cavity 108 but in the opposite order.
Figures 3a to 3c show a previously proposed MEMS transducer comprising a flexible membrane 101 and a variable vent structure 401 in the form of a moveable portion or “flap” 402. The moveable flap portion is defined by a thin channel 403 which runs through the membrane and partially separates the moveable flap portion from the rest of the membrane whilst remaining attached to the rest of the membrane via a connecting portion 404.
The moveable flap portion 402 is arranged such that its equilibrium position - i.e. the position it adopts with substantially no pressure differential acting on the moveable portion, is within the plane of the membrane. In response to 3 pressure differential across the moveable portion of the vent structure the moveable portion Is deflected away from the plane of the membrane so as to expose a hole in the membrane, in this way, the size of a flow path through the vent structure between a first volume above the membrane to a second voiume below the membrane is varied in response to a variable pressure differentia! acting on the moveable portion.
Figure 3b illustrates in perspective view the part of the membrane and die variable vent, in this example the pressure In the volume below the membrane is sufficiently greater then the pressure in the voiume above the membrane such that the moveable flap portion 402 has been deflected upwards away from the rest of the membrane surface. This opens the flow channel through the membrane, i.e. effectively opens a hole in the substrate, if the pressure differentia! increases enough the moveable portion 402 may be further deflected end thus provide a greater amount of opening, i.e. a greeter How path, 'The moveable portion may thus adopt a range of positions. These positions depend on the pressure differential acting on the moveable portion (or the variable vent). The extern to which the moveable portion is deflected also determines how much the moveable portion biocks/exposes the hole through the membrane and thus the size of the flow path.
The structure shown in Figure 3 has been shown to act so to reduce the pressure differential acting on the membrane at relatively high pressure differentials. However, pressure impulse profiles arising as a resuit of e,g. air being forced into the sound port of a host device due to an impact, can often peak within a few milliseconds. Thus, unless the vent structure can respond quickly, ideally within this time range, damage may still be sustained by a high pressure or an “overpressure" event
The present invention is concerned with improving the resilience of MEMS devices to a high pressure impulse incident on a MEMS transducer, in particular, the present invention is concerned with improving the response time of a vent structure provided on a flexible membrane of a MEMS transducer. Thus, the present invention is concerned with facilitating an equalization of a pressure differential arising between the upper and lower surfaces of the membrane.
According to an aspect of the present invention there is provided a MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the vent structure is configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes or rotation extend in the plane of the membrane. in response to a differential pressure across the moveable portion of the vent structure the moveable portion deflects to reveal a variable-size aperture in the flexible membrane. Thus, in response to a differentia! pressure across the moveabie portion of toe vent structure the moveable portion deflects to provide a How path through the flexible membrane. The size of the aperture and thus the flow path increases as the moveable portion deflects This facilitates an equalisation of the pressure acting on the opposing surfaces of the membrane and lands to restore the moveable portion to its equilibrium position.
The flexible membrane exhibits an equilibrium position which can be considered to correspond to the minimum $1¾ of the flow path through the flexible membrane. Thus, at the equilibrium position, the differential pressure across the vent structure is insufficient to causa deflection of the moveable portion and the siea of the flow pall's through the membrane is minimal/negliglble, in response to a differential pressure across the vent structure the moveable portion can potentially rotate about two axes of rotation. Both axes of rotation can be considered to extend within the plane of the membrane. The axes of rotation may be mutually orthogonal or may be non-orthogonal to one another.
The axes of rotation can be conveniently defined with respect to a joint structure or ’hinge” which connects the/eaeh moveable portion to the flexible membrane. The joint structure may, for example, comprise a simple connecting portion so that the moveable portion is connected directly to the flexible membrane by means of the connecting portion. Alternatively, or additionally, the joint structure may comprise an elongate beam structure which is located between the rest of the membrane and the moveable portion. A first axis of rotation can be considered to substantially coincide with, or be parallel to, the line of the joint structure. Thus, the first axis of rotation may coincide with, or be parallel to, the width of a connecting portion or it may coincide with, or be parailel to, the iongitudinal section of a beam. Rotation of the moveable portion about this first axis of rotation will cause the moveable portion to deflect above or below the rest of the surface of the membrane, depending on the resultant forces acting on the vent structure. A second axis of rotation also extends in the plane of the membrane and has a component that is perpendicular to the joint structure. Rotation of the moveable portion about this second axis of rotation tends to cause one lateral edge/corner (depending on the shape of the moveable portion) of the moveable portion to deflect upwardly with respect to the plane of the membrane surface 'whilst the opposite lateral edge/corner deflects downwardly with respect to the plane of the membrane surface.
Thus, the joint structure can be considered to comprise a doubie hinge which allows the, or each, moveable portion to rotate about first and second rotational axes.
Thus, the moveable portion is able to "tilt” about the joint structure relative to the plane of the membrane by rotating about the second axis of rotation. This tilting about the second rotational axis which tends to occur initiaily foliowing a high pressure event, tends to results in a larger proportion of the aperture being initially exposed than would be revealed if the moveable portion were constrained to rotate only about the first axis of rotation.
The ability of the moveable portion to rotate about the second axis of rotation advantageously enables the vent structure to open more quickiy in response to a differential pressure across the membrane. This beneficially results in a more rapid equalisation of pressure across the membrane following a pressure impulse event.
According to another aspect of the present invention there is provided a ME.MS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the/each moveable portion is connected to the membrane by a joint structure, the vent structure being configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about an axis of rotation which has a component that is perpendicular to the joint structure in the plane of the membrane.
Thus, the vent structure may be configured such that rotation of the moveable portion takes piece about an axis of rotation that has a component perpendicular to the joint structure. This can, for example, be as a result of the shape of the moveable porticn(s) and/or the manner -n which each moveable portion is connected to the rest of the membrane.
According to another aspect of the present invention there is provided a MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the moveable portion is connected to the rest of the membrane by a joint structure, and wherein a notional line which extends orthogonally from the centre of the joint structure across the moveable portion, dissects the moveable portion into first and second sections, the first section having a greater surface area than the second section.
According to another aspect of the present invention there is provided a MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the moveable portion is connected to the rest of the membrane by a joint structure, and wherein the moveable portion is asymmetrical about a notional line which extends orthogonally from the centre of the joint structure across the moveable portion.
As a result of a differential pressure across the vent structure a resultant force acts on the moveable portion causing it to deflect. Thus, in circumstances such as an impact event which lead to a difference between the pressure (i.e. force/unit area) acting on one planar surface of the moveable portion and the pressure acting on the opposite planar surface of the moveable portion, a resultant force acts on the surface of the moveable portion in the direction of the greater pressure.
As a result of a differential pressure across the vent (e.g. in a direction from the upper surface to the lower surface of the moveable portion or visa versa) a greater overall force will act on the larger surface area of one section of the moveable portion than on the small surface area of the section. This causes a rotation of the moveable portion about the second axis of rotation.
According to another aspect there is provided a MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion and a joint structure provided on a connecting edge of the moveable portion which connects the moveable portion to the flexible membrane, wherein the joint structure is provided at m off-centre position on the connecting edge.
According to another aspect of the present invention there is provided a MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the moveabie portion is connected to the rest of the membrane by a joint structure, and wherein a notional line which extends substantially orthogonally from the centre of the joint structure across the moveabie portion, dissects the moveable portion into first and second sections such that, in response to a differentia! pressure across the membrane, the resultant force arising on the first portion induces a moment about the notional line that is greater than a moment induced by resultant forces arising on the second portion.
According to another aspect of the present invention there is provided a ME MS transducer comprising a vent structure, the vent structure comprising a moveable portion which, in response to a differential pressure across the vent structure, tilts such that one edge of the moveable portion deflects below the plane of the membrane whilst an opposite edge of the moveable portion deflects above the plane of the membrane,
In general there Is provided a MEMS transducer that comprises at least one vent structure provided in a flexible membrane of the transducer. The M Elvis transducer may be a capacitive microphone. The flexible membrane may be supported between a first volume and a second volume and a flow path may be provided between the first and second volumes by means of the vent. The vent structure may comprise a moveable portion which is moveable so as to open a hole extending from the first volume to the second volume. The moveable portion may quiescently occupy at least some, end possibly most, of the area of the hole, but is moveable in response to a iocai pressure differential across the hole so as to vary the size of the hole which is open to provide a flow path. In other words the moveable portion may, in equilibrium, effectively dose at least part of the hole, but is moveable so as to vary to degree to which the hole is closed. The moveable portion is preferably arranged to remain closing the hole, i.e. aperture, at normal operating pressure differentials but to more to increase the size of the flow path, e.g. dose less of the hole, at higher pressure differentials that couSd potentially cause damage to the membrane. The vent can therefore be seen as a variable aperture.
The vent structure thus acts as a type of pressure relief valve to reduce the pressure differential acting on the membrane. However unlike, the bleed holes in the membrane (if present) which have a fixed area and thus a fixed size of flow path, the variable vent has a flow path size, i.e. aperture, which varies in response to a pressure differential Thus the degree to which the vent allows venting depends on the pressure differential acting on the vent - which clearly depends on the pressure of at least one of the first and second volumes. The vent structure therefore provides a variable acoustic impedance."""""·
The transducer may comprise a back-plate structure wherein the flexible membrane layer is supported with respect to sa-d back-plats structure. The back-plate structure may comprises a plurality of holes through the back-plate structure. When at least one vent structure is formed in the flexible membrane layer at least one of the holes through the back-plate structure may comprise a vent hole In a location that corresponds to the location of a vent structure in the flexible membrane layer. The area of the vent hole in the back-plate may extend laterally away from the area of opening of the vent in the flexible membrane at a position where the variable vent in the flexible membrane first opens. When at least one vent structure is formed in the flexible membrane layer and comprises a moveable portion which is connected to the rest of the membrane via a beam structure and the moveable portion and beam structure are defined by channels running through the flexible membrane; then the location of the channels in the membrane which do not form part of the variable flow path through the membrane in use may be arranged so as to not substantially overlap with the location of any of said plurality of holes in the back-plate structure.
The transducer may be a capacitive sensor such as a microphone. The transducer may comprise readout circuitry (analogue and/or digital). The transducer and circuitry may be provided together on a single semiconductor chip - e.g. an integrated microphone. Alternatively, the transducer may be on one chip and the circuitry may be provided on a second chip. The transducer may be located within a package having a sound port, i.e. an acoustic port. The transducer may be implemented in an electronic device which may be at least one of: a portable device; a battery powered device; an audio device; a computing device; a communications device; a persona! media player; a mobile telephone; a tablet device; a games device; and a voice controlled device.
Features of any given aspect may be combined with the features of any oilier aspect and the venous features described herein may be implemented in any combination in a given embodiment
Associated methods of fabricating a MEMS transducer are provided for each of the above aspects.
The invention will now he described by way of example only with reference to the accompanying drawings, in which:
Figures 1a and 1b illustrate known capacitive MEM3 transducers in section and cutaway perspective views;
Figures 2a and 2b illustrate how a high pressure event may affect the membrane Figures 3a - 3c illustrate a known variable vent structure;
Figure 4 illustrates a flexible membrane having vent structure according to a first example In which the vent structure is in the equilibrium position;
Figure 5 illustrates a flexible membrane having vent structure according to the first example under circumstances of a first pressure differential across the vent;
Figure 6 illustrates a flexible membrane having vent structure according to the first example under circumstances of a second pressure differentia! across the vent;
Figure 7 illustrates a number of other vent structures exemplifying the present invention; and
Figures 8a to 8h illustrate various MEMS transducer packages.
Embodiments of the present invention relate to MEMS transducers comprising a transducer structure comprising a flexible membrane supported between a first volume and a second volume. The first volume may for instance comprise the first cavity 109 between the membrane and the substrate and/or the volume formed in the substrate 108, The second volume may comprise the second cavity 110 between the membrane and back-plate and /or any volume In fluid communication with the second cavity (e.g, a sound port in top-port embodiments).
To reduce the likelihood of damage in high pressure situations the transducer structure comprises at least one vent structure in communication with at least one of said first and second volumes. The vent structure comprises at least one moveable portion which is moveable in response to a pressure differential across the vent structure.
Figures 4. 5 and 6 illustrate a flexible membrane 501 according to a first example.
Referring to the example illustrated in Figures 4, 5 and 6, the flexible membrane 501 comprises a vent structure having three moveable portions 502a, 502b, 502c, In this example each of the moveable portions are irregular polygons and are connected to the rest of the membrane by a joint structure which, in this example, comprises a beam structure 503a, 503b, 503c. Each of the moveable portions is formed by a channel 403 which runs through the membrane. The channel 403, which may be formed by etching through the membrane, partially separates each of the moveable portions from the rest of the membrane 501, Each of the beam structures is formed by a secondary channel 504, which extends through the membrane and which may be formed by etching through the membrane, and a connecting portion 505a, 505b, 505c which is defined between two portions of the channel 403.
Each of the moveable portions is connected to the rest of the membrane along a connecting edge that is generally coincident with a cooperating edge of the membrane. The connecting edge of the moveable portion is separated from the rest of the membrane by the channel 4Ό3 except at the pint structure. The width of the connecting portion of the joint structure is defined by the distance between two terminating ends of the channel 403. In this example the joint structure is provided at an off-centre position on the connecting edge of the moveable portion, it will be appreciated that me “connecting edge” of the moveable portion is defined as the edge incorporating the joint and extending between the points X and Y shown on Figure 4a.
If wifi of course be appreciated that the channel 403 does represent a path for air to flow through the membrane, however the channel 403 may be formed with a very-narrow width and thus there may be no or limited air flow through the channel when the moveable flap portions are in the equilibrium position whereby the moveable portions tessellate to substantially close the aperture.
The width of channel 403 may be limited by the photolithographic process constraints on the minimum etchabie gap, or the need for some mechanical clearance for the moveable elements) fo bend and flex yet clear the rest of the structure. Also narrow gaps will tend to have a larger fractional manufacturing tolerance, leading to a wider variation in the acoustic impedance when dosed and thus a wider variation in of e.g. the low-frequency roll-oil a microphone, A typical width might be 1pm, relative to a typical vent structure of 20um to 50pm in extent. However the width might be ter? times smaller or larger depending on the acoustic specifications or the manufacturing process capability. As mentioned the tine width of the channels defining the moveable vent pari may influence factors such as the low-frequency roll-off. In choosing appropriate line widths the effect of different widths may be simulated and/or different designs could be fabricated and tested.
Figures 4a, 4b and 4c show the vent structure in a substantially closed, or “equilibrium", state when the pressure differential across trie membrane is zero or dose to zero. Figures 5a, 5b and 5c show the positions of the moveable portions of the vent structure at a first relatively low, pressure differential. Figures 6a, 6b and 6c show the positions of the moveable portions of the vent structure at a second, relatively high, pressure differential.
Figures 4a, 4b and 4c respectively shows plan, side and eievaiional views of the flexible membrane 501 when the pressure differential across the membrane is zero or dose to zero and the moveable portions 502a, 502b and 502c are therefore substantially in plane, or “flush" with the planar surface of the membrane. In this case the flow path through the membrane is substantially dosed (with any, minimal, airflow through the membrane depending on the size of the channel 403),
With reference to Figure 4a, which shows a plan view from an upper surface of the flexible, the moveable portions 502 can be seen to exhibit an irregular polygon shape. Each of the moveable portions can be considered to extend either side of a notional “centre-line” C which extends orthogonally from the centre of the joint structure across the moveable portion and dissects the moveable portion into first and second sections a1 and a2. The moveable portion 502 is asymmetrical about the notional centre-line C and the first section a1 can be seen to exhibit a larger surface area than the second section a2.
Following an event which gives rise to a pressure differential between the pressure experienced on the upper and lower surfaces of the membrane, the moveable portions deflect out of the plane of the membrane. Figures 5a, 5b and 5c respectively show plan, side and etevationa! views of the flexible membrane 501 under circumstances of a first pressure differential across the vent. As can be seen most ciearly from Figures 5b and 5c, each of the moveable portions 502 has been rotated about first and second rotational axes R1 and R2 {shown on Figure 5c), thereby causing the moveable portion to defiect away from the rest of the membrane so as to reveal an aperture A in the membrane. The aperture A provides a flow path through the membrane.
The first rotational axis R1 of each moveable portion is substantially coincident with, or parallel to, the elongate portion of the beam. The aperture A can be considered to be generally circular (although it will be appreciated that, in this example, the outer edges of the aperture are formed of straight edges). Thus, the first rotational axis R1 can be considered to have a tangential component t - i.e. a component that can be resolved tangentially with respect to the vent structure or aperture. In this particular example the rotational axis is substantially coincident with the tangential component.
The second rotational axis R2 extends across the vent structure in the plane of the membrane Thus R2 has a component Rc which extends from the joint structure towards the centre of the vent structure in the plane of the membrane. The second rotational axis R2 may be substantially orthogonal to the first rotational axis.
Considering the rotational axis that has taken about the first rotational axis R1, it can be seen that the first pressure differentia! acting on the moveable portion has caused rotation about R1 so as deflect the moveable portion upwardly, out of the plane of the membrane.
From Figures 5b and 5c, it can be seen that as a result of the first pressure differential acting across the vent structure, the rotational movement that takes place about the second rotational axis R2 tends to causa the movable portions to “tilt”. Thus, the lateral edge of section ai of the moveable portion has been deflected upwardly with respect to the plane of the membrane, whilst the lateral edge of section a2 of the moveable portion has been deflected downwardly with respect to the plane of the membrane. Since the amount of rotation that has taken place about the first rotational axis R1 is relatively small, the lateral edge of section a2 of the moveable portion that has been deflected downwardly about R2 actually projects slightly below the surface of the membrane. This can be seen in Figure 5b.
At this relatively low differential pressure., when the vent structure is closer to the equilibrium position, a pressure differential across the vent tends to give rise to a greater rotation about R2 than R1, Continued deflection of the moveable portions about the second axis of rotation tends to cause a larger proportion of the aperture to be revealed (end thus a larger flow' path) than would be revealed as a result of rotation about the Rl. This enables the vent structure to open more quickly from the equilibrium position in response to a high pressure event and, thus, for a larger aperture to be revealed in response to relatively low pressure differentials. This beneficially enables a faster equalisation of the relative pressure above and below the membrane, thereby protecting the transducer from potential damage.
Figures 6a, 6b and 6c respectively show plan, side and elevational views of the flexible membrane 501 under circumstances of a second pressure differential across the vent, the second pressure differential being higher than the first pressure differential discussed above with reference to Figure 5. In tills case the moveable portions have experienced a large deflection as a result of the differential pressure across the vent structure. Specifically, rotation about the first axis R1 which is provided by torsion or twisting of the beam 503, tends to cause the moveable portions 502 to be deflected upwardly towards a plane that is orthogonal to the plane of the rest of the membrane.
At this relatively high differential pressure, continued deflection of the moveable portion portions tends to take place about R1.
The/each moveable portion of the vent structure may rotate about either or both of the rotational axes in response to a differential pressure across the membrane. For example, considering the pressure profile that occurs following an event which cause trapped air to be forced into a sound port of a host device, e.g. due to the host device falling an impacting with a surface. The pressure of the sound port will rise over a certain time and will reach a peak pressure differential before diminishing as the vent structure opens to equalise the pressure across the vent. As the air pressure increases, ihe/each moveable portion may initially rotate around an axis having a component that is perpendicular to the hinge in tire horizontal plane (the “second rotational axis"). As the pressure continues to rise, the/each moveable portion may also simultaneously rotate about the first axis. Then, at higher pressure, the/each movable portion may rotate around an axis having a component that is substantially parallel to the joint structure in the horizontal plane (the "first" rotational axis).
The vent structure shown in Figures 4, » and 6 comprises three moveable portions arranged around the periphery of the membrane aperture A. Although it will be appreciated that this design can be generalised to incorporate any number of moveable portions; of any shape including club/ciover shaped, this configuration has been found to be particularly beneficial since it balances the contradictory objectives of speed of response, which is proportional to the number of moveable portions, and the leakage” fi.e. air flow through the membrane that takes place ’when the vent is In the equilibrium position} associated with providing more channels in the membrane to define the moveable portions.
Figure 7 shows example further vent structures.
Figure ?a shows a flexible membrane 601 for a MEMs transducer comprising a single moveable portion 602. The moveable portion 601 extends either side of a notions! '’centre-line’' C which extends orthogonally from the centre of the joint structure 604 across the moveable portion and dissects the moveable portion into first and second sections al and a2. The moveable portion 602 is asymmetrical about the notional centre-line C and the first section si can be seen to exhibit a larger surface area than the second section m2,
The moveable portion is connected to the rest of the membrane along a connecting edge 603 at a position that is offset from the centre of the connecting edge. In response to a differentia! pressure across the membrane 601, the moveable portion can rotate about first and second rotational axes R1 and R2.
The vent may act as a non-linear vent, which is a vent whose fiow path sixe is not fixed and in which the extent to which the vent is open, and also fiow rate through the vent, varies with pressure differentia! in a non-linear way.
Embodiments of the invention therefore relate generally to MEMS transducers comprising a transducer structure including a flexible membrane supported between a first volume and a second voiume and at least one vent structure. The vent structure has at least one moveable portion which is moveable in response to a high pressure differential across the moveable portion so as to provide a fiow path for venting fluid, a.g. gas from at least one of said first and second volumes.
The embodiments have been described in terms of venting air from a volume. The same principles apply to other gases and indeed other fluids, possibly including liquids. In some embodiments the transducer may be arranged in a sealed environment which is filled with a fluid other than air, the seaied environment being arranged to allow transmission of pressure waves to/from outside the sealed environment. There may still be large pressure differentials that can be generated within the seaied environment and the use of variable vents in such embodiments may be beneficial
Embodiments of the present invention also relate to MEMS transducers comprising a flexible membrane supported between a first volume and a second volume and a vent structure connecting said first and second volumes. The vent provides a flow path having a size that, varies with pressure differential across the membrane.
Embodiments of the invention also relate to MEMS transducers having a membrane supported between first and second volumes wherein the acoustic impendence between the first and second volumes is variable with the differential pressure between the volumes.
Although the various embodiments describe a MEMS capacitive microphone, the invention is aiso applicable to any form of ME MS transducers other than microphones, for example pressure sensors or ultrasonic transmitters/receivers.
Embodiments of the invention may be usefully implemented in a range of different material systems, however the embodiments described herein are particularly advantageous for ME MS transducers having membrane layers comprising silicon nitride.
It is noted that the embodiments described above may be used in a range of devices, including, but not limited to: analogue microphones, digital microphones, pressure sensor or ultrasonic transducers. The invention may aiso be used in a number of applications, Including, but not limited to, consumer applications, medical applications, industrial applications and automotive applications. For example, typical consumer applications include portable audio players, laptops, mobile phones, PDAs and personal computers. Embodiments may aiso be used in voice activated or voice controiled devices. Typical medical applications include hearing aids. Typical industrial applications include active noise cancellation, s ypical automotive applications include hands-free sets, acoustic crash sensors and active noise cancellation.
One or more transducers according to the any of the embodiments described above may be incorporated in a package. Figures 8a to 8g illustrate various different packaging arrangements. Figures 8a to 8g each show one transducer element located in the package but it will be appreciated that in some embodiments there may be more one than transducer, e.g. a transducer array, and the various transducers may be formed on the same transducer substrate, l.e. a monolithic transducer substrate, or may be formed as separate transducers with separate transducer substrates each separate transducer substrate being bonded to a package substrate.
Figure 8a shows a first arrangement where a transducer 1100 is located in a cover 1101, which forms at least part of a housing, on a package substrate 1102. The cover in this example could be a metaliic housing which is tended to the substrate. The package substrate may comprise at least one insulating layer. The package substrate may also comprise at least one conductive layer. The package substrate may be a semiconductor material or may be formed from a material such as PCB, ceramic or the like. Where the cover 1101 is metaliic, or Itself composes a conductive layer, the cover may be electrically coupled to the conductive layer of the substrate, e.g. so that the housing provides shielding for electromagnetic interference (EMI), Bond wires 1103 may connect the transducer to bond pads on trie package substrate. In some embodiments, read-out circuitry, for instance amplifier circuitry, may be located within the housing formed in or connected to the package substrate Through-vias through the package substrate (not illustrated) may connect to contacts, i.e. solder pads, 1104 for electrically connecting external circuitry (not illustrated) to the package to allow transmission of electrical signals to/from the transducer 1100, In the example shown in Figure 8a there is a sound port or acoustic port in the cover 1101 to allow sound to enter the package arid the transducer is arranged in a top port arrangement.
Figure 8b illustrates an alternative arrangement where the sound port is provided in the package substrate 1102 and may, in use, be sealed. A ring 1105, which may be a sealing ring or a solder pad ring (for use in forming a solder ring) may be provided around the periphery of the sound port on the outer side of the package to allow, in use, sealing of a sound path leading to the sound port when the package is connected to another PCB for example. In this embodiment the transducer is arranged in a bottom ροή arrangement with the volume defined by the housing 1101 forming part of the back-volume of the transducer.
Figure 8c illustrates an example where instead of bond wires connecting the transducer to the package substrate the transducer structure is inverted and flip-chip bonded to package substrate via connections 1106. In this example the sound port is in 11½ package substrate such that the package is arranged in a bottom port arrangement
Figure 8d illustrates an alternative example to that of Figure 8b wherein a housing 1107 is formed from various panels of material, for example RGB or the iike. In this instance the housing 1107 may comprise one or more conductive layers and/or one or more insulating layers. Figure 8d shows the sound port in the package substrate. Figure Be shows an alternative arrangement to that of Figure 8b wherein a housing 1107 is formed from various panels of material, for example RGB or the like as described in relation to Figure 8d, Figure 8f shows a further embodiment whore the transducer structure is bonded via connections 1106 to the housing upper layer, which may for instance be RGB or layered conductive/insulating material, in this example however the electrical connections to the package are still via contacts, sofder pads, 1104 on the package substrate, e.g, througSvvias (not illustrated) in the package substrate with conductive traces on the inside of the housing to the transducer. Figure 8g illustrates an alternative example to that of Figure Sc wherein a transducer is flip-chip bonded to the package substrate in a housing 1107 formed from panels of material, for example PCB or the iike as described in relation to Figure 8d, in general, as illustrated in Figure 8h, one or more transducers may be located in a package, the package is then operatively interconnected to another substrate, such as a mother-board, as known in the art. it should be noted that the above*mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. The word “comprising" does not exclude the presence of elements or steps other than those listed in a claim, ’‘a*’ or “an" does not exclude a plurality, and a single feature or other unit may fulfil the functions of several units recited in the claims. Any reference signs in the claims shall not be construed so as to limit their scope.

Claims (35)

1. A MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, the vent structure being configured such that, in response to a differential pressure across the vent structure, the moveeble portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane,
2. A MEMS transducer as claimed in claim 1, wherein the/each moveable portion is connected lo the membrane by a joint structure,
3. A MEMS transducer as claimed in claim 2, wherein the first axis of rotation has a component that is substantially parallel to the joint structure in the plane of the membrane.
4. A MEMS transducer as claimed in claim 2 or 3, wherein the second axis of rotation has a component that is substantially perpendicular to the joint structure in the plane of the membrane,
5. A MEMS transducer as claimed in any preceding claim, wherein rotation about the first axis of rotation tends to cause the moveable portion to deflect above or below the plane of the membrane.
6. A MEMS transducer as claimed in any preceding claims, wherein rotation about the second axis of rotation tends to cause the respective moveable portion to tilt relative to the plane of the membrane.
7. A MEMS transducer as claimed in any preceding claim, wherein the first and second axes of rotation are mutually orthogonal.
8. A MEMS transducer comprising a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the/each moveable portion is connected to the membrane by a joint structure, the vent structure being configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about an axis of rotation which has a component perpendicular to the joint structure in the plane of the membrane,
9. A MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the moveable portion is connected to the rest of the membr ane by a joint structure, and wherein a notional line which extends orthogonally from the centre of the joint structure across the moveable portion, dissects the moveable portion into first and second sections, the first section having a greater surface area than the second section.
10. A MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion, wherein the moveable portion is connected to the rest of the membrane by a joint structure, and wherein the moveable portion Is asymmetrical about a notional line which extends orthogonally from the centre of the joint structure across the moveable portion.
11. A MEMS transducer comprising: a flexible membrane, the flexible membrane having a vent structure comprising at feast one moveable portion and a joint structure provided on a connecting edge of the moveable portion which connects the moveable portion to the flexible membrane, wherein the joint structure is provided at an off-centre position on the connecting edge.
12. A MEMS transduceras claimed in any one of claims 9,10 or 11, wherein, in response to a differential pressure across the vent structure, the moveable portion is rotatable about an axis of rotation that has a component perpendicular to the joint structure in the plane of the membrane.
13. A MEMS transducer as claimed in any preceding claim, wherein the moveable portion rotates to expose an aperture in the membrane to thereby by provide a flow path through the membrane.
14. A MEMS transducer as claimed in claim 13, wherein the vent structure comprises three moveable portions which are arranged around the outer periphery of the aperture In the membrane.
15. A MEMS transducer as da lined in any preceding claim wherein the, or each, moveable portion has an equilibrium position at which the pressure differentia! across the membrane is negligible end at which the flow path through the vent structure is at a minimum.
18. A MEMS transducer as claimed in any preceding claim, wherein the flexible membrane is supported between a first volume and a second volume and where-η the flow path is between the first and second volumes.
17. A MEMS transducer as claimed in the any preceding claim, wherein the at least one moveable portion of the flexible membrane is defined by one or more channels running through the flexible membrane.
18. A MEMS transducer as claimed In any preceding claim, wherein the at least one moveable portion is an irregular polygon.
19. A MEMS transducer as claimed in preceding claim, wherein said moveable portion is connected to the rest of the flexible membrane via a beam structure.
20. A ME MS transducer as claimed in any preceding claim comprising a back-plate structure wherein the flexible membrane is supported with respect to said back-plate structure.
21. A MEMS transducer as claimed in claim 20 wherein said back-plate structure comprises a plurality of holes through the back-plate structure,
22. A MEMS transducer comprising a vent structure, the vent structure comprising a moveable portion which, in response to a differential pressure across the vent structure, tilts such that one edge of the moveable portion deflects below the plane of the membrane whilst an opposite edge of the moveable portion deflects above the plane of the membrane.
23. A MEMS transduce! as claimed in any preceding claim wherein said transducer comprises a capacitive sensor
24, A MEMS transducer as claimed in any preceding claim wherein said transducer comprises a microphone.
25, A MEMS transducer as claimed in claim 23 or 24 further comprising readout circuitry.
26. A MEMS transducer as claimed in claim 25, wherein the readout circuitry may comprise analogue and/or digital circuitry.
27. A MEMS transducer as claimed in any preceding claim wherein the transducer is located within a package having a sound port.
28, An electronic device comprising a MEMS transducer as claimed in any preceding claim.
29. An electronic device as claimed in claim 2β wherein said device is at least one of; a portable device; a battery powered device; an audio device; a computing device; a communications device; a personal media player; a mobile telephone; a games device; and a voice controiled device.
30- An integrated circuit comprising a MEMS transducer as claimed in any preceding claim and readout circuitry,
31. A method of fabricating a MEMS transducer having a flexible membrane, the method comprising: forming a structure having a flexible membrane supported between a first volume and a second volume; and forming a? least one vent structure in communication with at least one of said first and second volumes, said at least one vent structure composing at least one moveable portion connected to the flexible membrane by a joint structure wherein, in response to a differential pressure across the vent structure, the moveable portion is rotatable about an axis of rotation which has a component that Is perpendicular to the joint structure in the plane of the membrane.
32. A method of fabricating a MEMS transducer having a flexible membrane, the method comprising: forming a structure having a flexible membrane supported between a first volume and a second volume; and forming at least one vent structure In communication with at least one of said first arid second volumes, said at least one vent structure comprising at least one moveable portion and forming a joint structure on a connecting edge of the moveable portion which connects the moveable portion to the flexible membrane, wherein the pint structure Is formed at an off-centre position on the connecting edge.
33. A method as claimed In claim 31 or 32 comprising forming a membrane layer to form at least part of said flexible membrane and forming at least one said vent structure in said membrane layer.
34. A method as claimed in claim 31, 32 or 33 wherein forming said vent structure comprises forming one or more channels through the membrane layer so that a portion of the flexible membrane can bo deflected away from the surface of the rest of the flexible membrane in response to a pressure differential.
35. A MEMS transducer substantially as hereinbefore described with reference to Figures 4 to 7 of the accompanying drawings.
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CN201780014131.7A CN108702575B (en) 2016-01-28 2017-01-23 MEMS device and method
PCT/GB2017/050166 WO2017129958A1 (en) 2016-01-28 2017-01-23 Mems device and process
US15/414,178 US10266393B2 (en) 2016-01-28 2017-01-24 MEMS device and process
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US10266393B2 (en) 2019-04-23
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