GB2546761B - Methods and circuits - Google Patents

Methods and circuits Download PDF

Info

Publication number
GB2546761B
GB2546761B GB1601515.8A GB201601515A GB2546761B GB 2546761 B GB2546761 B GB 2546761B GB 201601515 A GB201601515 A GB 201601515A GB 2546761 B GB2546761 B GB 2546761B
Authority
GB
United Kingdom
Prior art keywords
circuits
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1601515.8A
Other versions
GB201601515D0 (en
GB2546761A (en
Inventor
Dominic Ogier Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neudrive Ltd
Original Assignee
Neudrive Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neudrive Ltd filed Critical Neudrive Ltd
Priority to GB1601515.8A priority Critical patent/GB2546761B/en
Publication of GB201601515D0 publication Critical patent/GB201601515D0/en
Priority to PCT/GB2017/050101 priority patent/WO2017129945A1/en
Priority to CN201780012655.2A priority patent/CN108701646A/en
Publication of GB2546761A publication Critical patent/GB2546761A/en
Application granted granted Critical
Publication of GB2546761B publication Critical patent/GB2546761B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/202—Integrated devices comprising a common active layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
GB1601515.8A 2016-01-27 2016-01-27 Methods and circuits Active GB2546761B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB1601515.8A GB2546761B (en) 2016-01-27 2016-01-27 Methods and circuits
PCT/GB2017/050101 WO2017129945A1 (en) 2016-01-27 2017-01-17 Methods and circuits
CN201780012655.2A CN108701646A (en) 2016-01-27 2017-01-17 Method and circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1601515.8A GB2546761B (en) 2016-01-27 2016-01-27 Methods and circuits

Publications (3)

Publication Number Publication Date
GB201601515D0 GB201601515D0 (en) 2016-03-09
GB2546761A GB2546761A (en) 2017-08-02
GB2546761B true GB2546761B (en) 2020-07-22

Family

ID=55535029

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1601515.8A Active GB2546761B (en) 2016-01-27 2016-01-27 Methods and circuits

Country Status (3)

Country Link
CN (1) CN108701646A (en)
GB (1) GB2546761B (en)
WO (1) WO2017129945A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110241202A1 (en) * 2010-03-30 2011-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy Metal Design for Packaging Structures
US20130106942A1 (en) * 2011-10-31 2013-05-02 Samsung Electronics Co., Ltd. Methods of forming patterns on a substrate
US20140021604A1 (en) * 2011-10-25 2014-01-23 Globalfoundries Inc. Integrated circuit devices with bump structures that include a protection layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002901A1 (en) * 1993-07-15 1995-01-26 Astarix, Inc. Top level via structure for programming prefabricated multi-level interconnect
US5741727A (en) * 1997-05-23 1998-04-21 Industrial Technology Research Institute Circuit modification and repair using a low resistance conducting metal bridge and a focused ion beam
KR101205191B1 (en) * 2003-12-19 2012-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor integrated circuit
US8890338B2 (en) * 2006-09-27 2014-11-18 Agere Systems, Inc. Method of identifying and/or programming an integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110241202A1 (en) * 2010-03-30 2011-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy Metal Design for Packaging Structures
US20140021604A1 (en) * 2011-10-25 2014-01-23 Globalfoundries Inc. Integrated circuit devices with bump structures that include a protection layer
US20130106942A1 (en) * 2011-10-31 2013-05-02 Samsung Electronics Co., Ltd. Methods of forming patterns on a substrate

Also Published As

Publication number Publication date
GB201601515D0 (en) 2016-03-09
CN108701646A (en) 2018-10-23
GB2546761A (en) 2017-08-02
WO2017129945A1 (en) 2017-08-03

Similar Documents

Publication Publication Date Title
PL3718370T3 (en) Methods and related devices for multi-connectivity
HK1243741A1 (en) Tnfrsf-binding agents and uses thereof
IL255577B (en) Tigit-binding agents and uses thereof
GB201605126D0 (en) Inhibitors and their uses
HK1244591A1 (en) Integrated circuit devices and methods
HK1250146A1 (en) Anti-pre-bcr antagonists and methods
IL259582B (en) Imaging circuits and method
GB201612858D0 (en) New uses and methods
GB201608779D0 (en) Methods and compounds
GB201608776D0 (en) Methods and compounds
PL3565374T3 (en) Region configuration methods and devices
GB2548839B (en) New uses and methods
GB201603311D0 (en) New uses and methods
SG11201706048SA (en) Magnetoresistive device and method of forming the same
GB201510606D0 (en) Integrated circuit inputs and outputs
IL254241A0 (en) Etv2 and uses thereof
GB201411932D0 (en) Apparatus and circuit
GB2560211B (en) Methods and devices
GB201508377D0 (en) Circuits and systems
GB201705626D0 (en) Compositions and methods
ZA201807665B (en) Methods and compositions
GB201715820D0 (en) Compositions and methods
GB201621119D0 (en) Device and method
HK1222898A1 (en) Stage representation device and stage representation method
ZA201804064B (en) Device and method

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20180809 AND 20180815

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20190124 AND 20190130

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20230622 AND 20230628