GB2515173B - Post-synthesis processing of diamond and related super-hard materials - Google Patents

Post-synthesis processing of diamond and related super-hard materials

Info

Publication number
GB2515173B
GB2515173B GB1407124.5A GB201407124A GB2515173B GB 2515173 B GB2515173 B GB 2515173B GB 201407124 A GB201407124 A GB 201407124A GB 2515173 B GB2515173 B GB 2515173B
Authority
GB
United Kingdom
Prior art keywords
diamond
post
synthesis processing
hard materials
related super
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1407124.5A
Other versions
GB2515173A (en
GB201407124D0 (en
Inventor
Mark Robin Mcclymont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Element Six Technologies Ltd
Original Assignee
Element Six Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Element Six Technologies Ltd filed Critical Element Six Technologies Ltd
Publication of GB201407124D0 publication Critical patent/GB201407124D0/en
Publication of GB2515173A publication Critical patent/GB2515173A/en
Application granted granted Critical
Publication of GB2515173B publication Critical patent/GB2515173B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB1407124.5A 2013-04-25 2014-04-23 Post-synthesis processing of diamond and related super-hard materials Expired - Fee Related GB2515173B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201307480A GB201307480D0 (en) 2013-04-25 2013-04-25 Post-synthesis processing of diamond and related super-hard materials

Publications (3)

Publication Number Publication Date
GB201407124D0 GB201407124D0 (en) 2014-06-04
GB2515173A GB2515173A (en) 2014-12-17
GB2515173B true GB2515173B (en) 2015-09-30

Family

ID=48626821

Family Applications (2)

Application Number Title Priority Date Filing Date
GB201307480A Ceased GB201307480D0 (en) 2013-04-25 2013-04-25 Post-synthesis processing of diamond and related super-hard materials
GB1407124.5A Expired - Fee Related GB2515173B (en) 2013-04-25 2014-04-23 Post-synthesis processing of diamond and related super-hard materials

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB201307480A Ceased GB201307480D0 (en) 2013-04-25 2013-04-25 Post-synthesis processing of diamond and related super-hard materials

Country Status (2)

Country Link
GB (2) GB201307480D0 (en)
WO (1) WO2014173934A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11078380B2 (en) 2017-07-10 2021-08-03 Entegris, Inc. Hard abrasive particle-free polishing of hard materials

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876271A (en) * 1993-08-06 1999-03-02 Intel Corporation Slurry injection and recovery method and apparatus for chemical-mechanical polishing process
US6056851A (en) * 1996-06-24 2000-05-02 Taiwan Semiconductor Manufacturing Company Slurry supply system for chemical mechanical polishing
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
US6783446B1 (en) * 1998-02-26 2004-08-31 Nec Electronics Corporation Chemical mechanical polishing apparatus and method of chemical mechanical polishing
US20080090503A1 (en) * 2004-07-01 2008-04-17 Samsung Electronics Co., Ltd. Polishing pad and chemical mechanical polishing apparatus comprising the same
US20080160890A1 (en) * 2006-12-27 2008-07-03 Yanghua He Chemical mechanical polishing pad having improved groove pattern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4087581B2 (en) * 2001-06-06 2008-05-21 株式会社荏原製作所 Polishing equipment
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
BE1017837A3 (en) * 2007-11-05 2009-08-04 Wetenschappelijk En Tech Onder METHOD AND DEVICE FOR MECHANICALLY PROCESSING DIAMOND.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876271A (en) * 1993-08-06 1999-03-02 Intel Corporation Slurry injection and recovery method and apparatus for chemical-mechanical polishing process
US6056851A (en) * 1996-06-24 2000-05-02 Taiwan Semiconductor Manufacturing Company Slurry supply system for chemical mechanical polishing
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
US6783446B1 (en) * 1998-02-26 2004-08-31 Nec Electronics Corporation Chemical mechanical polishing apparatus and method of chemical mechanical polishing
US20080090503A1 (en) * 2004-07-01 2008-04-17 Samsung Electronics Co., Ltd. Polishing pad and chemical mechanical polishing apparatus comprising the same
US20080160890A1 (en) * 2006-12-27 2008-07-03 Yanghua He Chemical mechanical polishing pad having improved groove pattern

Also Published As

Publication number Publication date
GB2515173A (en) 2014-12-17
GB201307480D0 (en) 2013-06-12
WO2014173934A1 (en) 2014-10-30
GB201407124D0 (en) 2014-06-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180423