GB2500029B - Curable compositions - Google Patents
Curable compositionsInfo
- Publication number
- GB2500029B GB2500029B GB1204011.9A GB201204011A GB2500029B GB 2500029 B GB2500029 B GB 2500029B GB 201204011 A GB201204011 A GB 201204011A GB 2500029 B GB2500029 B GB 2500029B
- Authority
- GB
- United Kingdom
- Prior art keywords
- curable compositions
- curable
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1204011.9A GB2500029B (en) | 2012-03-07 | 2012-03-07 | Curable compositions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1204011.9A GB2500029B (en) | 2012-03-07 | 2012-03-07 | Curable compositions |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201204011D0 GB201204011D0 (en) | 2012-04-18 |
GB2500029A GB2500029A (en) | 2013-09-11 |
GB2500029B true GB2500029B (en) | 2014-03-12 |
Family
ID=46003266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1204011.9A Expired - Fee Related GB2500029B (en) | 2012-03-07 | 2012-03-07 | Curable compositions |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2500029B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3004260B1 (en) * | 2013-05-30 | 2020-06-17 | Henkel IP & Holding GmbH | Primer compositions for injection molding |
JP6433651B2 (en) * | 2013-11-21 | 2018-12-05 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesive, adhesive-attached member, and connection method between members |
CA3216866A1 (en) | 2021-04-16 | 2022-10-20 | Blue Photon Technology & Workholding Systems LLC | Method and system to temporarily hold a workpiece during manufacturing using adhesive attachment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020058778A1 (en) * | 1999-05-28 | 2002-05-16 | Loctite Corporation | Toughened thermosetting resin compositions useful as underfill sealants |
US6616984B1 (en) * | 1997-10-10 | 2003-09-09 | Miguel Albert Capote | Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl |
JP2010180352A (en) * | 2009-02-06 | 2010-08-19 | Denso Corp | Rapidly photocurable epoxy adhesive composition and method for bonding therewith |
WO2011099292A1 (en) * | 2010-02-12 | 2011-08-18 | 株式会社Adeka | Solventless one-pack type cyanic ester/epoxy composite resin composition |
-
2012
- 2012-03-07 GB GB1204011.9A patent/GB2500029B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6616984B1 (en) * | 1997-10-10 | 2003-09-09 | Miguel Albert Capote | Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl |
US20020058778A1 (en) * | 1999-05-28 | 2002-05-16 | Loctite Corporation | Toughened thermosetting resin compositions useful as underfill sealants |
JP2010180352A (en) * | 2009-02-06 | 2010-08-19 | Denso Corp | Rapidly photocurable epoxy adhesive composition and method for bonding therewith |
WO2011099292A1 (en) * | 2010-02-12 | 2011-08-18 | 株式会社Adeka | Solventless one-pack type cyanic ester/epoxy composite resin composition |
Also Published As
Publication number | Publication date |
---|---|
GB2500029A (en) | 2013-09-11 |
GB201204011D0 (en) | 2012-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160307 |