GB2494640A - Optical substrate with recesses for passive alignment of optical components - Google Patents
Optical substrate with recesses for passive alignment of optical components Download PDFInfo
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- GB2494640A GB2494640A GB201115787A GB201115787A GB2494640A GB 2494640 A GB2494640 A GB 2494640A GB 201115787 A GB201115787 A GB 201115787A GB 201115787 A GB201115787 A GB 201115787A GB 2494640 A GB2494640 A GB 2494640A
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- optical
- motherboard
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- integral
- light
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
Abstract
An optical substrate or motherboard 1 made of an insulator or semiconductor material for placement and passive alignment of optical components. The substrate has pre-aligned grooves or recesses 2a, 3a for receiving the optical components and can be used to align an optical fibre 2 with a lens 3 or grating and one or more optical sensors 4. The substrate may be manipulated by etching to produce integral lenses, reflective surfaces or gratings. A controllable refractive index gel may be positioned in the light path to select wavelengths of light. The optical sensor may be a spectrometer chip.
Description
OPTICAL MOTHERBOARD
This invention relates to a device for the alignment and placement of optical components with one or more optical sensor[s], and more particularly the present invention relates to a substrate, hereafter referred to as a motherboard which has the capability of passively aligning optical components with one or more optical sensor[s] and a motherboard comprising one or more optical sensor[s] and/or optical components which direct the selected wavelengths of light to one or more optical sensor[s].
Optical sensor[s] such as for example a charge-coupled device (CCD) type sensor, generally require that wavelengths of electromagnetic radiation (for example but not limited to visible range light, far-infrared, mid-infrared, near-infrared or IJV light) to be detected is channeled to the photoactive surface of one or more sensor[s]. The 1 ight that impinges on the photoactive surface of the sensor is converted to an electrical culTent or voltage, and it is this electrical culTent or voltage which represents an electrical signal, and is recorded via ancillary signal processing apparatus as a quantitative and for qualitative measure of the electromagnetic radiation which originally impinged on the photoactive slLrface of the sensor. The photoactive surface of the sensor is generally made from a semiconductor based material, such as elemental (e.g. Si or Ge) or compound semiconductors and alloys thereof. A property of these materials is that they are able to convert a particular band of wavelengths of electromagnetic radiation into an electrical signal.
There are two general methods by which wavelengths of light are allowed to impinge on an optical sensor. The first method is a passive method in which general ambient light is allowed to fall on the photoactive surface of the sensor. This method could be used for example when all that is required is a broad measure of the intensity of daylight, or of a light sow-ce, e.g. a light bulb. The second method is when there is a requirement for light to be dispersed or filtered prior to falling on the photoacti ye surface of the sensor, or funneled to the photoactive surface of the optical sensor, e.g. for example, in a spectrophotometer, or a camera. A requisite feature of this type of system, is that for the system to work optimally, and reproducibly the optical sensor and all other components of the optical train (which may deliver and/or select light to the optical sensor) must be held in a fixed manner in a defined relationship to each other. It has been shown that minor movements or perturbations in relation to the relative positions of each of thc components (above) can result in loss of efficiency of signal, degeneration of the signal, and in some instances failure of the optical system.
For this reason it is often the case that the optical sensor[s] and components of the optical train
I
are mounted onto a motherboard (optical motherboard). The function of the motherboard is to hold each component of the optical train and sensor[s], allow adjustment of each component so that optimum optical alignment is achieved with the sensor[s], and once aligned "fix" each component in place in relation to each other.
A typical example of an optical motherboard is shown in GB0525408 (spectrophotometer). A feature of this spectrophotorneter is that the components of the optical train such as the fibre optical cable, minors, lenses diffraction gratings and sensors are all separately mounted upon a "scaffolding" which allows separate manual adjustment, alignment and "fixing" of each component independently of other components. To optimise the system is often time consuming and labor intensive, and as a result adds significant cost to the product.
The art has tried to address some of the problems identified above. For example US Patent 4902,136 entitled "Arrangement for High Resolution Spectrometer" describes a spatially or chronologically tunable interference filter with a wavelength selective diode array. However, the disclosed array suffers from at least one problem in that the position of the diode array has to be adjusted and fixed in relation to the input light of interest.
W02004/0681 I 9A1 entitled "A circular diochroism detection system" describes components of an optical system which are held in relation to each other. However, this citation is silent as to the means by which the system is configured.
US 2011/01 39990A1 describes a MEMS based FITR spectrometer. A feature of the spectrometer is that a mirror is mounted upon an optical sensor, said mirror directing light to the optical sensor. However, this disclosurn does not direct how the individual components of the spectrophotometer are aligned in relation to each other, for example paragraphs [0012-0016] are silent in this respect.
The art has identified several problems relating the alignment of optical trains with optical sensor[s].
Such systems comprise discrete optical components and sensor[s] which are individually mounted upon one or more mounting surfaces (motherboards) in an active manner and optical alignment is achieved through adjustment of each component. These features are time consuming and labor or machine intensive. As a result the cost of alignment and fixing of these components can amount to a significant percentage of the overall cost of the component.
To overcome some of these disadvantages MEMS based photo sensor[s] have been developed.
However such systems do not house all the features necessary for a functional system. MEMS provides a mechanism for manipulating and guiding light in two or three dimensions and utilizes moving structures such as mirrors to deflect the path of a light beam towards another optical component. Such systems are mechanical in nature, involve movement and typicaily require high voltages to operate.
Therefore the prior art does not address the identified problems.
It is therefore an object of the present invention to provide an Optical Motherboard which addresses the above identified problems.
Specifically this invention relates to an Optical Motherboard which allows the passive alignment of the optics with one or more optical sensors, such as solid state silicon chip based sensors. Alignment is achieved by the preparation of a receiving motherboard comprising an insulator or semi-conductor material (1) which has been etched to produce receptacles for any one or more of a fibre optic cable, one or more optical sensors (4, 8), lenses and where appropriate the direct formation of lenses (5) and reflective surfaces and etched gratings (6, 7) from the insulator or semi-conductor material (1). Thus advantageously, such a motherboard would allow direct integration, fixing and positioning of optical components into the architecture of the motherboard with a high predetermined accuracy in a passive manner. Such an approach negates the necessity to post align the optical components with the optical sensor[s]. Such a motherboard system essentially combines multiple optical and electrical functionality onto a single chip. The key advantages of such an approach are mechanical and thermal stability, the elimination of active-alignment processes and consequenay cost-reduction in manufacturing. The incorporation of etched lenses in the motherboard removes the need for separate lenses which further enhances the stability of the system. Furthermore, the optical wavefront can be modified in a precisely controlled manner due to the fact that the curvature of the lens can be uniquely manufactured within the optical motherboard.
Thus the first object of the invention is an optical motherboard (I) characterised in that the motherboard is manufactured from an insulator or semi-conductor material and is capable of being etched to form a grooved or recessed surface that allows placement of optical cornponent[s] and or optical sensor[s] upon/within the motherboard (I).
In the first non-limiting example (shown in figure 1 of the drawings), the optical motherboard (I) comprises a grooved, or recessed suiface (2a) on the top surface (lA) of the optical motherboard (1). Said grooved, or recessed surface is dimensioned to accept a fibre optic cable (2) or bundle of fibre optical cables. The cable can be fixed into the surface by either press fit, the use of an adhesive or any means known in the art. The advantage being that the insLilator or semi-conductor motherboard can be pre etched to produce the fibre optical cable receptacle using optical or electron beam lithography to a high degree of accuracy, tolerance and reproducibility.
Thus motherboard assembly adjustment of the position of the fibre optical cable[sI will not be necessary. This example further comprises a grooved or recessed surface (4a) to accept and align the optical sensor(s) (4) with the light exiting means (2b) of the fibre optical cable (2). The grooved or recessed surface is substantiaUy dimensioned to compliment the dimensions of the sensor. As above, the grooved or recessed surface can be manufactured to a high degree of accuracy, tolerance and reproducibility. Thus the longitudinal axis of (2a) and surface t4a) form an axis (A) which allows light to travel from the exit surface (2b) to the light active surface of the micro-optical sensor (4). It is anticipated that the sensor will either press fit into the surface, flip-chip bonded, or be held in place by an adhesive or solder. Alternatively other means can be used.
Thus an object of the present invention is a motherboard (I) comprising a insulator or semi-conductor material, in which the motherboard (I) further comprises one or more grooved or recessed surfaces dimensioned to accept one or more fibre optic cable[sI t2) and one or more optical sensors (4), wherein the grooves or recesses are aligned to allow light to pass from the exiting means (2b) of the fibre optical cable (2) to the light active region of the sensor.
A further object of the present invention is a motherboard (I) comprising an insulator or semi-conductor material, further comprising one or more fibre optic cables (2) and one or more optical sensors (4) fixed onto the motherboard by means of pre aligned grooved or recessed surfaces.
Optionally, the motherboard may also comprise one or more waveguides (which maybe tapered, straight, of curved geometry or combination thereof) to direct the light exiting the fibre optical cable[sj (2) to the sensor[s] (4).
Optionally this example further comprises a groove or recessed surface (3a) located on the axis (A) between the light exiting means (2b) and the optical sensor (4). Surface (3a) allows for the placing and fixing of a focusing lens between the fibre optical cable (2) and the optical sensor (4).
The function of the lens is to focus the light exiting the fibre optical cable[s] (2h) onto the photo-active surface of the optical sensor[s] 4). Advantageously, such a system would allow the production of a motherboard (1) with reduced tolerances for the fixing and positioning of the grooved or recessed surfaces that accept the fibre optical cable and/or the optical sensor. A further advantage is that pre-positioning of the lens accepting means on the motherboard (I) reduces/negates the necessity for post alignment of the lens on the motherboard (1). In the example given above the surface (2a) is not truncated in that it extends from surfaces (I a/lb) to the surface (laJlc). A further advantage of this system is that lenses of similar dimensions (being able to fit into the receptacle) but having different characteristics may be used interchangeably on a standardized motherboard, thus reducing costs of manufacture.
Thus an object of the present invention comprises a motherboard (1) comprising a groove or recessed surface (3a) located on the axis (A) between the light exiting means (2b) and the optical sensor (4), dimensioned to accept and fix a focusing tens (3).
A further object of the present in vention comprises a motherboard (1) having a non-integral focusing lens positioned between the exiting means (2a) and the micro-optical sensor.
In the second non-limiting example (figure 2 of the drawings) the non-integral lens (3) is replaced by an integral lens (5), said lens being comprised of an insulator or semi-conductor material of the motherboard (1). It is known in the art that insulators or semi-conductor materials are transparent to certain electro-magnetic wavelengths of light. The transparency of the insulator or semi-conductor is determined by its band gap, which, in turn is determined by its chemical composition and crystallographic structure. Therefore, by matching the insulator or semi-conductor to the desired electromagnetic wavelength, it is possible to make a lens which focuses the selected wavelength that match the transparency of the conductor or semi-conductor. In addition, such a configuration would also act as a filter for wavelengths of light, in that the wavelengths of light which cannot pass through the insulator or semi-conductor material will be eliminated and "pre-filtered" and thus prevented from reaching the photo-active surface of the optical sensor (4). In the example given above the groove (2a) is truncated and abuts the kns (5). Advantageously a motherboard in which the lens is integral could provide significant cost savings to a manufacturer in that the lens would be fixed in position in relation to the light source (2a) and the optical sensor, thus negating the need for post assembly alignment of the optical components of the motherboard (1). Furthermore, the focusing properties of the aforementioned lens element can be engineered by the choice of semiconductor or insulating material by virtue of the complex refractive index (where the real component defines the change in speed of light on passing through the material and the imaginary component defines the absorption of light on passing through the material) and through control of the surface profile geometry via the etch. Doping of the semiconductor or insulating material or the use of an epitaxial structure would provide further mechanisms for controlling the optical properties, such as the complex refractive index, of the etched lens element. In addition it is anticipated that a motherboard (I) with an integral lens could be manufactured at less cost than the separate manufacture of a motherboard (1) and a lens.
Thus an object of thc present invention comprises a motherboard (I) which furthcr comprises onc or more integral lens[es] [5]. wherein the lens is made from the insulator or semi-conductor material.
Optionally, the lens may be coated with one or more index matching gels, or coatings (single-layer or multi-layer) that retard or enhance the passage of certain wavelengths of light. Such materials are known in the art. Thus the integral lens may also act as a filter of wavelengths of light which would normally be transparent to the insulator or semi-conductor material.
In a third non limited example (figure 3 of the drawings) the motherboard (I) may further comprise a groove or recess located on the axis (A) either between the exit of the fibre optic cable[s] or waveguide [s] (2b) and lens [es] (3, 5) and/or between the lens [es] (3. 5) and the optical sensor (4). This groove or recess can accommodate a gel of controllable complex refractive index. These gels have the effect of filtering out selective wavelengths of light or to change the focusing properties of the lens. Thus they can be used to "filter" or block light which would otherwise impinging upon the sensor. Advantageously, such a motherboard (I) would allow selected wavelengths of light to be "filtered" prior to the wavelengths of light impinging on the optical sensor (4). Tn addition such a groove or recess could be filled with different types of gels, thereby producing a uniform motherboard (1) which is capable of "filtering" different wavelength ranges of light.
Thus an object of the present invention is a motherboard (1) comprising an insulating or semi-conducting material which further comprises a groove or recess located on the axis (A) either between the exit of the fibre optic cable [s] and/or waveguide [s] (2b) and lens [es] (2,5) or between the lens [es] (3, 5) and the optical sensor [s] (4).
A further object of the invention is a motherboard (I) comprising an insulating or semi-conducting material which further comprises a groove or recess located on the axis (A) either between the exit of the fibre optic cable [s] (2b) and lens [es] (3, 5) or between the lens [es] (3. 5) and the optical sensor [s] (4) in which the groove or recess has an index matching gel or coating placed within it.
In a fourth non-limiting example (figure 4 of the drawings) the motherboard C) may further comprise an undercut lens and a fresnel lens. Advantageously, such lenses would provide additional control on the focusing of the light onto the optical sensor.
In a fifth non-limiting example (Figure 5 and Figure 6 of the drawings) the motherboard (1) may further comprise an etched mirror surface, or a diffraction grating surface (6, 7) that is used to reflect or diffract light onto the optical sensor [s] (4), and is located between the exit of the fibre optic cable [s] (2a) and the optical sensor [s] (4). Advantageously, the motherboard (1) may further comprise housings to locate a plurality of optical sensors 4) (Figure 6) such that the reflected and diffracted light may fall onto the photo sensitive surface of the sensor (4). The diffraction system may be comprised from a fixed reflection or transmission grating system. Such systems are known to those in the art. Advantageously, such a system could be used to diffract light and select wavelengths of light to impinge on the sensor, therefore allowing a means to select the wavdengths of hght that interact with the sensor. A further advantage of such a system is that the etched surface or diffraction grating ispre-aligned with the recesses or grooves of the fibre optical cable and receptor (above) upon manufacture of the motherboard (1). Thus such a system would reduce manufacturing costs and reduce post assembly alignment, as it would not be necessary.
Therefore it is an object of the present invention to provide a motherboard (1) made from an insulator or semi-conductor material which further comprises an integral etched mirrored surface or a diffraction grating surface located on the light path between the exit of the fibre optic cable (2a) and the optical sensor (4).
In a further option the lenses (3, 5) and reflective suifaces (6. 7) may comprise one or more coatings which sclectively "filtcr" and selcct for light that will land on thc photo sensitivc surface of the optical sensor (4).
Thus it is a further object of the present invention to provide a mother board (1) comprising of an insulator or semi-conductor material and an integral etched mirror or diffraction grating surface in which the mirror or grating is further coated with a single-layer or multi-layer coating or gel.
Advantageously such a motherboard (1) could be manufactured and assembled at a reduced price, and reduced time when compared to a conventional optical assembly. Conventional assemblies generally comprise several different types of material. For example patent application GB0525428 describes a hand held spectrophotometer which comprises an input fibre optical cable, a focusing mirrors, a diffraction grating and photosensitive detectors. All the above components are housed in an aluminium housing. Howevei-, each component is separately mounted and optimal alignment of the optical train is achieved by manual adjustment in the X, Y and Z planes of each component in the optical train. Adjustment is achieved by screw adjustment or vernier adjustment. Thus it can be seen from this example that the motherboard (aluminum housing) comprises several sub-assemblies, all of which have to be manually aligned to achieve optimal frmnction of the light train.
Thus it can be seen that both the cost of manufacturing individual components of the motherboard and the downstream adjustment adds to the cost and time to manufacture of a ifinctioning mothcrboard. In addition such mothcrboards are complcx to producc and often require sub assembly systems for each sub component and systems to assemble each sub assembly on the motherboard.
The advantage of the motherboard (1) system described above is that the insulator or semi-conductor material of the type used for example in photovoltaic cells, MEMS. computer and telecommunication systems, can be manipulated in shape at a very precise, reproducible and small scale using for example an F-beam which has nanometre resolution. Thus it is possible to precisely manufacture a motherboard (1) having accepting facets which have a high degree of precision and reproducibility. Such a motherboard (1) allows for precise, passive alignment to optical devices, such as sensors, with micron level accuracy.
A further advantage is that the insulator or semi-conductor material is rigid in structure and durable in nature. Therefore these materials are an ideal surface to mount the components of an optical system, as once mounted the components wifl be held ngidly in place in relation to each other. Furthermore, the optical assembly can be planar with no protrusions above a surface.
This allows the possibility of stacking motherboards or integrating with other devices or electrical or optical circuits.
A further advantage is that the insulator and semi-conductor materials have the property of selectively all owing certain wavelengths of light to pass through the material, and conversely to block the passage of other wavelengths of light from passing through the insulator or semi-conductor material. As a result the motherboard (I) can advantageously be fashioned to form integral lenses and waveguides which allow the passage of selective wavelengths of light to pass through the waveguide or lens.
A further advantage is that the insulator or semi-conductor material can be etched to form diffracting surfaces. These surfaces have the advantage in that they also have the ability (in a similar manner to that described above) to allow certain wavelengths of light to pass through the materiaL Thus the diffraction grating made from this material can also select out certain "transparent" wavelengths of light.
A further advantage is that the insulator or semi-conductor material can be coated to form a muiored or controlled reflectance surface. Such coatings are usually but not exclusively formed by the deposition of metallic or single or multiple dielectric layers onto the surfhce of the insulator or semi-conductor material. Therefore such coatings could be used to controllably reflect light in that has entered the optical train of the motherboard (1).
A further advantage is that the insulator or semi-conductor material may be used in conjunction with controllable complex refractive index gels or coatings. Such gels or coating may be placed on appropriate surfaces of the motherboard (1) or in facets of the motherboard (1) such as grooves or recesses as described above. Such index matching materials would have the advantage that they are able to selectively "filter" out wavelengths of light which impinge on the gel or coating.
Embodiments of the present invention will now be described in more detail, by way of example only, with reference to and as illustrated by figures I toô of the accompanying drawings of which: Figure 1. Embodiment using a separate external microlens showing device with accompanying fibre optic fibre, microlens and spectrometer chip A) Parametric view B) lop view.
Figure 2. Embodiment using a built-in lens showing device, accompanying fibre optic cable and spectrometer chip A) Parametric view, B) top view Figure 3. Alternative embodiment with a gap at the end of the fibre to allow dispersal of light before focusing by the built-in lens. The figure shows the device, accompanying fibre optic cable and spectrometer chip A) Parametric view, B) top view Figure 4. Variation showing undercut lens embodiments. A) convex lens, B) Fresnel lens Figure 5. Embodiment using an etched mirror to reflect and focus light onto a spectrometer chip.
Figure shows the device with accompanying fibre optic cable and a spectrometer chips A) Parametric view, B) top view Figure 6. Embodiment using an etched grating to focus light onto a series of spectrometer chips.
Figure shows the device with accompanying fibre optic cable and a series of spectrometer chips A) Parametric view, B) top view In all the figures: 1 is front end optics body, 2 is a bare fibre optic cable, 2a is a recess to house the fibre optic cable. 2b is the exit aperture of the fibre optic cable, 3 is a microlens, 3a are etched grooves to house a microlens, 4 indicates the spectrometer chip(s) location, 5 built in lens etched from body. 6 etched mirror, 7 etched grating.
It should also be noted that certain aspects of the drawings are not to scale and that certain aspects are exemplified or omitted to aid clarity.
This invention will be exemplified by reference to its most preferred embodiments. However, the invention is not limited to said embodiments, This invention relates to an optical motherboard (1) manufactured substantially from an insulator or semi-conductor material and in which grooves or facets have been incorporated into the surfaces of the motherboard (I) that allow precise and reproducible fixing and alignment of ancillary optical components such as fibre optical cables, mirrors, gratings, lenses and optical sensors.
The invention also relates to an optical motherboard (1) manufactured substantially from an insulator or semi-conductor material in which lenses, mirrors, gratings or waveguides are comprised from the material of the motherboard and thus integral to the motherboard.
The invention also relates to an optical motherboard (1) manufactured substantially fl-oman insulator or semi-conductor material in which the insulator or semi-conductor material has coatings which "filter" wavelengths of light or enhance the passage of light through the material.
The motherboard described is an optical motherboard (I) which allows the passive alignment of the optics with one or more optical sensors, such as solid state semicondcutor chip based sensors. Alignment is achieved by the preparation of a receiving motherboard (1) comprising an insulator or semi-conductor material (1) which has been etched to produce receptacles for a fibre optic cable, one or more optical sensors (4), lenses (3) and where appropriate the direct formation of lenses (5) and reflective surfaces and etched gratings (6, 7) from the insulator or semi-conductor material (1). Thus advantageously, such a motherboard (1) would allow direct integration, fixing and positioning of optical components into the architecture of the motherboard (i) with a high predetermined accuracy in a passive manner. Such an approach negates the necessity to post align the optical components with the optical sensor[s]. Alignment features in the optical motherboard (I) ensure that optical components such as, but not limited to, optical fibres, detectors, or spectrometer chips may passively align within the optical motherboard (I) negating the need for any active alignment. The provision of in-situ etched components such as lenses, reflective surfaces or gratings further simplifies the optical alignment and complexity of the optical system.
Thus the first object of the invention is an optical motherboard (I) characterised in that the motherboard is manufactured from an insulator or semi-conductor material and is capable of being selectively etched to form a grooved or recessed surface that allows placement of optical component[s] and or optical sensor[s] upon/within the motherboard (1).
Thus an object of the present invention is a motherboard (I) comprising an insulator or semi-conductor material, in which the motherboard (I) further comprises one or more grooved or recessed surfaces dimensioned to accept one or more fibre optic cable[s] (2) and one or more optical sensors (4), wherein the grooves or recesses are aligned to allow light to pass from the exiting means (2b) of the fibre optical cable (2) to the light active region of the sensor.
A further object of the present invention is a motherboard (I) comprising an insulator or semi-conductor material, further comprising one or more fibre optic cables (2) and one or more optical sensors (4) fixed onto the motherboard (I) by means of pre-aligned grooved or recessed surfaces.
Optionally this example further comprises a groove or recessed surface (3a) located on the axis (A) between the light exiting means (2b) and the optical sensor (4). Surface (3a) allows for the placing and fixing of a focusing lens between the fibre optical cable (2) and the optical sensor (4).
The function of the lens is to focus the light exiting the fibre optical cable[s] (2b) onto the photo-active surface of the optical sensor[s] (4). Advantageously, such a system would allow the production of a motherboard (I) with reduced tolerances for the fixing and positioning of the grooved or recessed surfaces that accept the fibre optical caNe andlor the optical sensor. A further advantage is that pre-positioning of the lens accepting means on the motherboard (1) reduces/negates the necessity for post alignment of the lens on the motherboard (1). In the example given above the surface (2b) is not truncated in that it extends from surfaces (la/lb) to the surface (lallc). A further advantage of this system is that lenses of the similar dimensions (being able to fit into the receptacle) but having different characteristics may be used interchangeably on a standardized motherboard (1), thus reducing costs of manufacture.
Thus an object of the present invention comprises a motherboard (i) comprising a groove or recessed surface (3a) located on the axis (A) between the light exiting means (2b) and the optical sensor 4), dimensioned to accept and fix a focusing lens (3).
A further object of the present invention comprises a motherboard (1) having a non-integral focusing lens positioned between the exiting means (2a) and the optical sensor.
In the second non-limiting example (figure 2 of the drawings) the non-integral lens (3) is replaced by an integral lens (5), said lens being comprised of the insulator or semi-conductor material of the motherboard (I). It is known in the art that insulator and semi-conductor materials are transparent to certain electro-magnetic wavelengths of light. The transparency of the insulator or semi-conductor is determined by its chemical composition and its crystallographic structure.
Therefore, by matching the insulator or semi-conductor to the desired electromagnetic wavelength, it is possible to make a lens which focuses the selected wavelength that match the transparency of the insulator or semi-conductor. In addition, such a configuration would also act as a selective filter for wavelengths of light, in that the wavelengths of light which cannot pass through the insulator or semi-conductor material will be eliminated and "filtered" and thus prevented from reaching the photo-active surface of the optical sensor (4). In the example given above the groove (2a) is truncated and abuts the surface of the lens (5). Advantageously a motherboard (I) in which the lens is integral could provide significant cost savings to a manufacturer in that the lens would be fixed in position in relation to the light source (2) and the optical receptor, thus negating the need for post assembly alignment of the optical components of the motherboard (I). In addition it is anticipated that a motherboard (1) with an integral lens could be manufactured at less cost than the separate manufacture of a motherboard (I) and a lens.
Thus an object of the present invention comprises a motherboard (1) which further comprises one or more integral lens[es] (5), wherein the lens is made from the insulator or semi-conductor material.
Optionally, the lens may be coated with one or more gels or coatings with defined complex refractive index that retard or enhance the passage of certain wavelengths of light. Such materials are known in the art. Thus the integral lens may also act as a filter of wavelengths of light which would normally be transparent to the insulator or semi-conductor material.
In a third non limited example (figure 3 of the drawings) the motherboard (1) may further comprise a groove or recess located on the axis (A) either between the exit of the fibre optic cable[s] (2b) and lens [es] (3, 5) and/or between the lens [es] (3, 5) and the optical sensor (4).
This groove or recess can accommodate a gel of controllable complex refractive index. These gels have the effect of filtenng out selective wavelengths of light and altering the refraction of light along the optical path. Thus they can be used to "filter" or block light which would otherwise impinging upon the sensor. Advantageously, such a motherboard (I) would allow selected wavelengths of light to be "filtered" prior to the wavelengths of light impinging on the optical sensor (4). In addition such a groove or recess could be filled with different types of index matching gels, thereby producing a uniform motherboard (1) which is capable of "filtering" different wavelength ranges of light.
Thus an object of the present invention is a motherboard (1) comprising an insulator or semi conductor material which further comprises a groove or recess located on the axis (A) either between the exit of the fibre optic cable [s] 2b) and lens [es] (3, 5) or between the lens [es] (3, 5) and the optical sensor [s] (4).
A further object of the invention is a motherboard (1) comprising an insuintor or semi-conductor material which further comprises a groove or recess located on the axis (A) either between the exit of the fibre optic cable [s](2b) and lens [es] (3, 5) or between the lens [es] (3, 5) and the optical sensor [s] 4) in which the groove or recess has a gel of controllable refractive index placed within it.
In a fourth non limiting example (figure 4 of the drawings) the motherboard (1) may further comprise an undercut lens or a fresnel lens. Advantageously, such lenses would provide additional control on the focusing of the light onto the optical sensor.
In a fifth non limiting example (figure 5 of the drawings) the motherboard (1) may further comprise an etched minor surface (6), or a diffraction grating surface (7) that is used to reflect light onto the optical sensor [s] (4). and is located between the exit of the fibre optic cable Es] (2b) and the optical sensor Es] (4). Advantageously, the motherboard (I) may further comprise housings to locate a plurality of optical sensors (4) such that the reflected and diffracted light may fall onto the photo sensitive surface of the sensors (4). The diffraction system may be comprised from a fixed grating system. Such systems are known to those in the art. Advantageously, such a system could be used to diffract light and select wavelengths of light to imping on the sensor, therefore allowing a means to select the wavelengths of light that interact with the sensor. A further advantage of such a system is that the etched surface or diffraction grating is pre aligned with the recesses or grooves of the fibre optical cable and receptor (above) upon manufacture of the motherboard (i). Thus such a system would reduce manufacturing costs and reduce post assembly alignment, as it would not be necessary.
Therefore it is an object of the present invention to provide a motherboard (I) made from an insulator or semi-conductor material which further comprises an integral etched mirrored surface or a diffraction grating surface located on the light path between the exit of the fibre optic cable (2a) and the optical sensor(s) 4).
In a further option the lenses (3. 5) and reflective surfaces (6. 7) may comprise one or more coatings which selectively "filter" and select for light that will land on the photo sensitive surface of the optical sensor(s) (4).
Thus it is a further object of the present invention to provide a mother board (1) comprising of an insulator or semi-conductor material and an integral etched mitTor or diffraction grating surface in which the mirror or grating is further coated with a gel or coating(s) of controllable complex refractive index.
Advantageously such a motherboard (1) could be manufactured and assembled at a reduced price, and reduced time when compared to a conventional mother board. Conventional motherboards generally comprise several different types of material. For example patent application GB0525428 describes a hand held spectrophotometer which comprising an input fibre optical cable, a focusing mirrors, a diffraction grating and photosensitive detectors. All the above components are housed in an aluminum housing. However, each component is separately mounted and optimal alignment of the optical train is achieved by manual adjustment in the X, Y and Z planes of each component in the optical train. Adjustment is achieved by screw adjustment or Vernier adjustment. Thus it can be seen from this example that the motherboard (aluminum housing) comprises several sub-assemblies, all of which have to be manually aligned to achieve optimal function of the light train.
Thus it can be seen that both the cost of manufacturing individual components of the motherboard and the downstream adjustment adds to the cost and time to manufacture of a functioning motherboard. li addition such motherboards are complex to produce and often require sub assembly systems for each sub component and systems to assemble each sub assembly on the motherboard.
The advantage of the motherboard (1) system described above is that the insulator or semi-conductor material of the type used for example in photovoltaic cells. MEMS, computer and telecommunication systems, can be manipulated in shape at a very precise, reproducible and small scale using for example optical or electron beam lithography which has nanometre resolution. Thus it is possible to precisely manufacture a motherboard (1) having accepting facets which have a high degree of precision and reproducibility.
A further advantage is that the conductor or semi-conductor material is rigid in structure and durable in nature. Therefore these materials are an ideal surface to mount the components of an optical system, as the one mounted the components will be held rigidly in place in relation to each other.
A further advantage is that the conductor and semi-conductor matenals have the property of allowing certain wavelengths of light to pass through the material, and conversely to block the passage of other wavelengths of light from passing through the insulator or semi-conductor material. As a result the motherboard (I) can advantageously be fashioned to form integral lenses and waveguides which allow the passage of selective wavelengths of light to pass through the waveguide or lens.
A further advantage is that the insulator or semi-conductor material can be etched to form diffracting surfaces. These surfaces have the advantage in that they also have the ability (in a similar manner to that described above) to allow certain wavelengths of light to pass through the material. Thus the diffraction grating made from this material can also select out certain "transparent" wavclcngths of light.
A further advantage is that the insulator or semi-conductor material can be coated to form a controllably reflective surface. Such coatings are usually but not exclusively formed by the deposition of metallic or single or multiple dielectric layers onto the surface of the insulator or semi-conductor material. Therefore such coatings could be used to reflect light hi that has entered the optical train of the motherboard (1).
A further advantage is that the insulator or semi-conductor material may be used in conjunction with gels or coatings of controllable complex refractive index. Such gels or coating may be placed on appropriate surfaces of the motherboard (1) or in facets of the motherboard (1) such as grooves or recesses as described above. Such controllable complex refractive index materials would have thc advantage that thcy are able to sclcctively "filtcr" out wavelengths of light which impinge on the material.
hdustria applicability has been described above in that the innovation finds utility in motherboards (1) suitable for optical sensing and has the advantage of cost reduction in manufacture.
The claims, as tiled form part of the description.
Claims (1)
- <claim-text>WHAT IS CLAIMED1) An optical motherboard (1) characterised in that the motherboard (I) is comprised substantially of an insulator or semi-conductor material, said material being manipulated to produce pre-aligned grooves or recesses surfaces, said surfaces are made with a tolerance and positioning to allow passive alignment of the components of the optical train and/or optical sensors.</claim-text> <claim-text>2) The optical motherboard of claim 1, characterized in that the insulator or semiconductor material has been manipulated to produce receptacles for one or more fibre optic cable, one or more non-integral optical sensors (4), non-integral lens, non-integral reflective surfaces, non-integral etched surfaces, or non-integral gratings.</claim-text> <claim-text>3) The optical motherboard of claim I, characterised in that the insulator or semiconductor material has been manipulated to produce integral optical sensors (4). integral lenses, integral reflective surfaces, integral etched surfaces, or integral gratings.</claim-text> <claim-text>4) The optical motherboard of claim 2 characterized in that the motherboard (1) may further comprise any one or more of the characterising features of claim 3.</claim-text> <claim-text>5) The optical motherboard (I) of any one or more of claims I to 4, characterized in that the motherboard (1) may further comprise a coating of a controllable complex refractive index gel or dielectric, said gel or dielectric being positioned at some point on the light path of the optical train, and serves the function to select for wavelengths of light.</claim-text> <claim-text>6) The optical motherboard (I) according to any one of the preceding claims, characterized in that non-integral components are fixed in place.</claim-text> <claim-text>7) The optical motherboard (I) according to any one of the preceding clams characterised in that each grooved or recessed surface is shaped to allow the fixing of interchangeable components.</claim-text>
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB201115787A GB2494640A (en) | 2011-09-13 | 2011-09-13 | Optical substrate with recesses for passive alignment of optical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB201115787A GB2494640A (en) | 2011-09-13 | 2011-09-13 | Optical substrate with recesses for passive alignment of optical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201115787D0 GB201115787D0 (en) | 2011-10-26 |
| GB2494640A true GB2494640A (en) | 2013-03-20 |
Family
ID=44908474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB201115787A Withdrawn GB2494640A (en) | 2011-09-13 | 2011-09-13 | Optical substrate with recesses for passive alignment of optical components |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2494640A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0640853A1 (en) * | 1993-08-31 | 1995-03-01 | Fujitsu Limited | Hybrid type integrated optical device having double-layered substrate |
| US6250819B1 (en) * | 1999-04-28 | 2001-06-26 | Highwave Optical Technologies | Mounting of an integrated optic circuit on a motherboard for the connection of optic fibers to form a miniature optical component |
| US20020186477A1 (en) * | 2001-06-11 | 2002-12-12 | Axsun Technologies, Inc. | Reentrant-walled optical system template and process for optical system fabrication using same |
| WO2003029847A2 (en) * | 2001-10-01 | 2003-04-10 | Catchmark Jeffrey M | Optical, optoelectronic and electronic packaging platform |
| WO2003107043A2 (en) * | 2002-06-13 | 2003-12-24 | Steve Lerner | Optoelectronic assembly with embedded optical and electrical components |
| EP1515364A2 (en) * | 2003-09-15 | 2005-03-16 | Rohm and Haas Electronic Materials, L.L.C. | Device package and methods for the fabrication and testing thereof |
-
2011
- 2011-09-13 GB GB201115787A patent/GB2494640A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0640853A1 (en) * | 1993-08-31 | 1995-03-01 | Fujitsu Limited | Hybrid type integrated optical device having double-layered substrate |
| US6250819B1 (en) * | 1999-04-28 | 2001-06-26 | Highwave Optical Technologies | Mounting of an integrated optic circuit on a motherboard for the connection of optic fibers to form a miniature optical component |
| US20020186477A1 (en) * | 2001-06-11 | 2002-12-12 | Axsun Technologies, Inc. | Reentrant-walled optical system template and process for optical system fabrication using same |
| WO2003029847A2 (en) * | 2001-10-01 | 2003-04-10 | Catchmark Jeffrey M | Optical, optoelectronic and electronic packaging platform |
| WO2003107043A2 (en) * | 2002-06-13 | 2003-12-24 | Steve Lerner | Optoelectronic assembly with embedded optical and electrical components |
| EP1515364A2 (en) * | 2003-09-15 | 2005-03-16 | Rohm and Haas Electronic Materials, L.L.C. | Device package and methods for the fabrication and testing thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201115787D0 (en) | 2011-10-26 |
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