GB2491390B - Heat dissipation structure of light-emitting diode - Google Patents

Heat dissipation structure of light-emitting diode

Info

Publication number
GB2491390B
GB2491390B GB1109264.0A GB201109264A GB2491390B GB 2491390 B GB2491390 B GB 2491390B GB 201109264 A GB201109264 A GB 201109264A GB 2491390 B GB2491390 B GB 2491390B
Authority
GB
United Kingdom
Prior art keywords
light
emitting diode
heat dissipation
dissipation structure
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1109264.0A
Other versions
GB201109264D0 (en
GB2491390A (en
Inventor
Wen-Kung Sung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB1109264.0A priority Critical patent/GB2491390B/en
Publication of GB201109264D0 publication Critical patent/GB201109264D0/en
Publication of GB2491390A publication Critical patent/GB2491390A/en
Application granted granted Critical
Publication of GB2491390B publication Critical patent/GB2491390B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
GB1109264.0A 2011-06-02 2011-06-02 Heat dissipation structure of light-emitting diode Expired - Fee Related GB2491390B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1109264.0A GB2491390B (en) 2011-06-02 2011-06-02 Heat dissipation structure of light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1109264.0A GB2491390B (en) 2011-06-02 2011-06-02 Heat dissipation structure of light-emitting diode

Publications (3)

Publication Number Publication Date
GB201109264D0 GB201109264D0 (en) 2011-07-20
GB2491390A GB2491390A (en) 2012-12-05
GB2491390B true GB2491390B (en) 2013-10-09

Family

ID=44343302

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1109264.0A Expired - Fee Related GB2491390B (en) 2011-06-02 2011-06-02 Heat dissipation structure of light-emitting diode

Country Status (1)

Country Link
GB (1) GB2491390B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050151231A1 (en) * 2004-01-05 2005-07-14 Kenichi Yoshida Surface mount type semiconductor device and lead frame structure thereof
US20070081313A1 (en) * 2005-07-29 2007-04-12 Kozo Tanaka Surface mounting semiconductor device
US20070252246A1 (en) * 2006-05-01 2007-11-01 Ng Kee Y Light emitting diode package with direct leadframe heat dissipation
US20100163918A1 (en) * 2007-06-05 2010-07-01 Seoul Semiconductor Co., Ltd Led package
US20100320485A1 (en) * 2007-01-12 2010-12-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged led light source

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050151231A1 (en) * 2004-01-05 2005-07-14 Kenichi Yoshida Surface mount type semiconductor device and lead frame structure thereof
US20070081313A1 (en) * 2005-07-29 2007-04-12 Kozo Tanaka Surface mounting semiconductor device
US20070252246A1 (en) * 2006-05-01 2007-11-01 Ng Kee Y Light emitting diode package with direct leadframe heat dissipation
US20100320485A1 (en) * 2007-01-12 2010-12-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged led light source
US20100163918A1 (en) * 2007-06-05 2010-07-01 Seoul Semiconductor Co., Ltd Led package

Also Published As

Publication number Publication date
GB201109264D0 (en) 2011-07-20
GB2491390A (en) 2012-12-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180602