GB2480458B - Cooling apparatus for cooling an electronic device - Google Patents

Cooling apparatus for cooling an electronic device

Info

Publication number
GB2480458B
GB2480458B GB1008304.6A GB201008304A GB2480458B GB 2480458 B GB2480458 B GB 2480458B GB 201008304 A GB201008304 A GB 201008304A GB 2480458 B GB2480458 B GB 2480458B
Authority
GB
United Kingdom
Prior art keywords
cooling
electronic device
cooling apparatus
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1008304.6A
Other versions
GB201008304D0 (en
GB2480458A (en
Inventor
Richard John Moulding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JOHN G PECK Ltd
Original Assignee
JOHN G PECK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JOHN G PECK Ltd filed Critical JOHN G PECK Ltd
Priority to GB1008304.6A priority Critical patent/GB2480458B/en
Publication of GB201008304D0 publication Critical patent/GB201008304D0/en
Publication of GB2480458A publication Critical patent/GB2480458A/en
Application granted granted Critical
Publication of GB2480458B publication Critical patent/GB2480458B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0202—Header boxes having their inner space divided by partitions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1008304.6A 2010-05-19 2010-05-19 Cooling apparatus for cooling an electronic device Expired - Fee Related GB2480458B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1008304.6A GB2480458B (en) 2010-05-19 2010-05-19 Cooling apparatus for cooling an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1008304.6A GB2480458B (en) 2010-05-19 2010-05-19 Cooling apparatus for cooling an electronic device

Publications (3)

Publication Number Publication Date
GB201008304D0 GB201008304D0 (en) 2010-06-30
GB2480458A GB2480458A (en) 2011-11-23
GB2480458B true GB2480458B (en) 2013-02-06

Family

ID=42334959

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1008304.6A Expired - Fee Related GB2480458B (en) 2010-05-19 2010-05-19 Cooling apparatus for cooling an electronic device

Country Status (1)

Country Link
GB (1) GB2480458B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10462941B2 (en) 2017-11-06 2019-10-29 Caterpillar Inc. Heat sink assembly
DE102020200303A1 (en) * 2020-01-13 2021-07-15 Zf Friedrichshafen Ag Cooling system and inverter

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
DE10203239A1 (en) * 2002-01-28 2003-06-05 Siemens Ag Cooling component for semiconducting devices has coolant channels of each of 2 planes joined by transverse channel, each of 2 connection arrangements connected to transverse channel
US20030221813A1 (en) * 2002-05-31 2003-12-04 General Electric Company Heat sink assembly
US20050200001A1 (en) * 2004-03-10 2005-09-15 Intel Corporation Method and apparatus for a layered thermal management arrangement
JP2008121932A (en) * 2006-11-09 2008-05-29 Daikin Ind Ltd Heat exchanger

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
DE10203239A1 (en) * 2002-01-28 2003-06-05 Siemens Ag Cooling component for semiconducting devices has coolant channels of each of 2 planes joined by transverse channel, each of 2 connection arrangements connected to transverse channel
US20030221813A1 (en) * 2002-05-31 2003-12-04 General Electric Company Heat sink assembly
US20050200001A1 (en) * 2004-03-10 2005-09-15 Intel Corporation Method and apparatus for a layered thermal management arrangement
JP2008121932A (en) * 2006-11-09 2008-05-29 Daikin Ind Ltd Heat exchanger

Also Published As

Publication number Publication date
GB201008304D0 (en) 2010-06-30
GB2480458A (en) 2011-11-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150519