GB2449844A

GB2449844A - Heat sink assembly

Info

Publication number: GB2449844A
Application number: GB0710044A
Authority: GB
Inventors: Robert Liang
Original assignee: Malico Inc
Current assignee: Malico Inc
Priority date: 2007-05-25
Filing date: 2007-05-25
Publication date: 2008-12-10
Also published as: GB0710044D0

Abstract

A heat dissipating module (3) with low wind resistance and high dissipation efficiency includes a heat sink (31) and a fixing device (32). The heat sink has a base (312) and a plurality of fins (311) formed on an upper surface of the base. The fixing device includes a frame having an upper surface (3210), a cavity (3212), and a plurality of elastic rods (323) with bending ends (3231) extended from the upper surface of the frame to the center of the cavity. When the fixing device is used to fix the heat sink to the heat source, such as a chipset assembly, the heat sink passes through the cavity of the frame until the upper surface of the base (3121) is parallel to the upper surface of the frame 3210), and the bending end presses against the upper surface of the base, such that the fins can entirely expose to the air for efficiently dissipating heat.

Description

HEAT DISSIPATING MODULE WITH LOW WIND RESISTANCE

AND HIGH HEAT DISSIPATION EFFICIENCY

BACKGROUND OF THE INVENTION

LEield of the Invention The present invention generally relates to a heat dissipating device for dissipating heat, and in particular to a heat dissipating device which can reduce the wind resistance and enhance the heat dissipation efficiency.

2. The Prior Arts

Nowadays, lots of electrical devices, such as chipsets or Random Access Memory generate a large amount of heat during the operation. If the heat is not dissipated efficiently, the devices are easily broken down. Due to the increasing demand of the heat dissipation, different kinds of heat dissipating devices are proposed on the market to solve the heat problems.

FIG. 1 is a perspective exploded view showing a conventional heat dissipating assembly 1 and a chipset assembly 2 (heat source). The conventional heat dissipating assembly 1 comprises a heat sink 11 and a fixing device 12 for fixing the heat sink 11 to a top end 210 of a chipset assembly 2, thereby dissipating the heat from the heat source. The chipset assembly 2 includes a chipset 21 having a top end 210, a chipset base plate 22, and a printed circuit board 23. The heat sink 11 further includes a base 112 and a plurality of fins Ill formed on an upper surface 1121 of the base, in which fins 111 are arranged apart from each other at an interval, and a heat dissipating base plate 1122 is provided at a bottom of the base 112. The fixing device 12 comprises a frame 121 having an upper surface 1210, four edges 1211 and a cavity 1212 surrounded by the edges 1211. The size of the cavity 1212 is smaller than the size of the base 112. Two corresponding edges 1211 are provided with fixing boards 122 each having a clip 1221. When the heat sink Ii is fixed to the top end 210 of the chipset assembly 2, the clip 1221 fastens on the chipset base plate 23. The frame 121 further includes four elastic rods 123 extended from the upper surface 1210 of the frame 121 toward a center of the cavity 1212 and having a bending end 1231 facing the cavity 1212 for pressing against the heat sink 11, such that the heat sink 11 and the chipset assembly 2 can be closely contacted.

FIG 2 is a schematic view showing the conventional heat dissipating assembly 1 mounted on the top end 210 of the chipset assembly 2. Referring to FIG 3A and FIG 3B, the conventional frame 121 is covered on the margin of the base 112 where no fins are formed, and thereby the conventional heat dissipating assembly 1 has fewer fins 111 on the heat sink 11. Furthermore, when the fan (not shown) mounted above the heat sink 11 generates the airflow, the frame 121 will resist the airflow over the fins 111 of the heat sink 11, which substantially decreases the heat dissipation efficiency, especially when the height of the fins 111 is relatively lower than the frame 121 (shown in FIG 2).

SUMMARY OF THE INVENTION

A primary objective of the present invention is to provide a heat dissipating module having a heat sink and a fixing device, which can reduce the wind resistance and improve the heat dissipation efficiency.

Accordingly, the heat sink includes a base and a plurality of fins formed on an upper surface of the base. The fins are arranged apart from each other at an interval. The fixing device includes a frame having an upper surface, a cavity, and a plurality of elastic rods extended from the upper surface of the frame toward the center of the cavity and having bending ends facing the cavity. A size of the cavity is larger than a size of the base. A side of the frame is provided with a clip. When the fixing device is used to fix the heat sink to a chipset assembly, the heat sink passes through the cavity of the frame until the upper surface of the base is parallel to the upper surface of the frame and the bending ends of the elastic rods press against the upper surface of the base, and thereafter, the clip fastens on a chipset base plate of the chipset assembly.

According to the present invention, the elastic rods fit into the space among the fins.

According to the present invention, the fixing device further includes two corresponding first edge, two corresponding second edge, two positioning baffles extended downward form the second edges for positioning the heat sink, and two fixing boards extended downward from the first edges, in which the chips are defined at an end of fixing boards.

According to the present invention, the elastic rods, the fixing boards and the positioning baffles are integrated with the frame.

According to the present invention, the base further includes a heat dissipating base plate.

According to the present invention, a distance from the upper surface of the frame to the clip is greater than or equal to the thickness of the heat dissipating base plate and the chipset assembly.

According to the present invention, a distance from the upper surface of the frame to the clip is greater than or equal to the thickness of the base and the chipset assembly.

According to the present invention, when frame sleeved on the heat sink, the fins can entirely pass through the cavity and expose to the air for efficiently dissipating heat.

BRIEF DESCRFTION OF THE DRAWINGS

The present invention will be apparent to those skilled in the art by reading the following detailed description of a preferred embodiment thereof, with reference to the attached drawings, in which: FIG I is a perspective exploded view of a conventional heat dissipating assembly and a chipset assembly; FIG 2 is an assembled view of FIG 1; FIG 3A is a transverse-sectional view of FIG 2; FIG 3B is a longitudinal-sectional view of FIG 2; FIG. 4 is a perspective exploded view showing a preferred embodiment of a heat dissipating module and a chipset assembly in accordance with the present invention; FIG. 5 is an assembled view of FIG 4; FIG 6A is a transverse-sectional view of FIG 5; and FIG 6B is a view of FIG 5.

DETAILED DESCRiPTiON OF THE PREFERRED EMBODIMENT

Referring to FIG. 4, the heat dissipating module 3 in accordance with the present invention comprises a heat sink 31 and a fixing device 32 for fixing the heat sink 31 to a top end 210 of a chipset assembly 2.

The chipset assembly 2 (heat source) includes a chipset 21 having the top end 210, a chipset base plate 22 and a printed circuit board 23.

The heat sink 31 comprises a base 312 and a plurality of fins 311 formed on an upper surface 3121 of the base 312, in which a heat dissipating base plate 3122 is provided at a bottom of the base 312.

The fixing device 32 includes a frame 321 having an upper surface 3210, two corresponding first edges 32111, two corresponding second edges 32112, and a cavity 3212 surrounded by the first edges 32111 and the second edges 32112. The size of the cavity 3212 is larger than the size of the base 312. The fixing device 32 further includes two fixing boards 322 extended downward from the first edges 32111. A clip 3221 is formed at an end of the fixing boards 322 and fastens on the chipset base plate 22 of the chipset assembly 2. Two elastic rods 323 are extended from the upper surface 3210 of the frame 321 toward a center of the cavity 3212, and have bending ends 3231 facing the cavity 3212, The frame 321 is further provided with two positioning baffle 324 extended downward form the second edges 32112 for positioning the heat sink 31. When the fixing device 32 is used to fix the heat sink 31 to the top end 210 of the chipset assembly 2, the heat dissipating base plate 3122 contacts the top end 210 of the chipset assembly 2, the heat sink 31 passes through the cavity 3212 of the frame 321 until the bending end 3231 of the elastic rod 323 presses against the base 312 of the heat sink 31, and the upper surface 3121 of the base 312 is parallel to the upper surface 3120 of the fixing device 32, and the clips 3221 fasten on the chipset base plate 22, such that the heat sink 31 can dissipate the heat generated by the chipset assembly 2 (heat source).

When the fixing device 32 is coupled with on the heat sink 31, the fins 311 of the heat sink 31 can entirely pass the cavity 3212 of the frame 321 and expose to the air, thereby decreasing the wind resistance. Therefore, the heat dissipating module 3 in accordance with the present invention can have more fins on the heat sink, and allow more airflow over the heat sink 31 to increase the heat dissipating rate, such that the heat generated by the chipset assembly 3 can be efficiently dissipated.

FIG 5 is a schematic view illustrating that the heat dissipating module 3 in accordance with the present invention is mounted on the top end 210 of the chipset assembly 2.

FIG 6A is a transverse sectional view of FIG 5 showing that the assembly of the heat dissipating module 3 and the chipset assembly 2 in accordance with the present invention; and FIG. 6B is a longitudinal sectional view of FIG 5 showing that the assembly of the heat dissipating module 3 and the chipset assembly 2 in accordance with the present invention.

The heat dissipating module 3 in accordance with the present invention can solve the drawback of the conventional heat dissipating assembly and enhance the thermal conduction of the heat source. The fixing device 32 is used to fix the heat sink 31 to the top end 210 of the chipset 21 by the clip 3221. The fins 311 of heat sink 31 can pass the cavity 3212 of the frame 321 and expose to the air, such that fixing device 32 will not resist the airflow to enter into the space 3111 of heat sink 31. Therefore, the present S invention has low wind resistance and better heat dissipating efficiency.

Although the present invention has been described with reference to the preferred embodiment thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.

Claims

WHAT IS CLAIMED IS: I. A heat dissipating module with low wind

resistance and high heat dissipation efficiency, comprising: a heat sink having a base and a plurality of fins formed on an upper surface of the base, wherein the fins are arranged apart from each other at an interval; a fixing device for fixing the heat sink to a chipset assembly, including a frame having an upper surface, two corresponding first edges, two corresponding second edges, a cavity surrounded by the first edges and the second edges, and a plurality of elastic rods extended from upper surface of the frame toward a center of the cavity and having a bending end facing the cavity, wherein a size of the cavity is larger than a size of the base, a fixing plate or a positioning baffle is extended downward form the first edge, a fixing plate or a positioning baffle is extended downward form the second edge, and an end of the fixing plate has a clip.
2. The heat dissipating module as claimed in claim 1, wherein the base has a heat dissipating base plate at a bottom thereof.
3. The heat dissipating module as claimed in claim 2, wherein a distance from the upper surface of the frame to the clip is greater than or equal to the thickness of the heat dissipating base plate and the chipset assembly.
4. The heat dissipating module as claimed in claim I, wherein a distance from the upper surface of the frame to the clip is greater than or equal to the thickness of the base and the chipset assembly.
5. The heat dissipating module as claimed in claim 1, wherein when the frame is used to fix the heat sink to a top end of the chipset assembly with the clip fastened on a chipset base plate of the chipset assembly, the heat sink passes the cavity with the upper surface of the base higher than the upper surface of the frame.
6. The heat dissipating module as claimed in claim I, wherein when the frame is used to fix the heat sink to a top end of the chipset assembly with the clip fastened on a chipset base plate of the chipset assembly, the heat sink passes the cavity with the upper surface of the base lower than the upper surface of the frame.
7. A heat dissipating module with low wind resistance and high heat dissipation efficiency constructed and arranged substantially as descnbed in relation to Figs. 4,5, 6A and 613 of the accompanying drawings.