GB2446161A - Backlight module with increased heat dissipating effect - Google Patents

Backlight module with increased heat dissipating effect Download PDF

Info

Publication number
GB2446161A
GB2446161A GB0701481A GB0701481A GB2446161A GB 2446161 A GB2446161 A GB 2446161A GB 0701481 A GB0701481 A GB 0701481A GB 0701481 A GB0701481 A GB 0701481A GB 2446161 A GB2446161 A GB 2446161A
Authority
GB
United Kingdom
Prior art keywords
frame body
light module
back light
radiating fins
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0701481A
Other versions
GB0701481D0 (en
Inventor
Tzung-Shiun Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TEAMWIN OPTO-ELECTRONICS CO., LTD.
Original Assignee
TEAMWIN OPTO ELECTRONICS CO LT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TEAMWIN OPTO ELECTRONICS CO LT filed Critical TEAMWIN OPTO ELECTRONICS CO LT
Priority to GB0701481A priority Critical patent/GB2446161A/en
Publication of GB0701481D0 publication Critical patent/GB0701481D0/en
Publication of GB2446161A publication Critical patent/GB2446161A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • F21V29/004—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package

Abstract

A back light module includes a frame body, a backboard, a reflecting sheet, a light-guiding plate, a lighting member, an optical film and an upper cover. The frame body and the backboard are formed integral. The frame body has its outer peripheral edge formed with lots of radiating fins, and the back board and the radiating fins are respectively disposed with numerous radiating grains for increasing the heat dissipation area and elevating heat dissipation effect of the back light module, able to effectively lower the working temperature and prolong the service life of the lighting member, and elevate the working efficacy of the lighting member and economise cost.

Description

BACK LIGHT MODULE
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a back light module, particularly to one formed with a multi-layer structure and having the outer side of its frame body and back board provided with numerous radiating fins and radiating grains for increasing the heat-dissipating area of the back light module, having excellent effect in heat disstpaton.
2. Description of the Prior Art
A conventional back light module, as shown in Fig. 1, is formed with a multi-layer structure, which is composed from bottom to top of a reflecting sheet, a light-guiding plate, a diffusing plate and a prism sheet.
The light-guiding plate has its peripheral side installed with cold cathode fluorescent lamps (CCFL) and light emitting diodes (LED) and its bottom surface provided with reflecting net points. This multi-layer structure is engaged in an outer frame and then mounted on a bottom board to make up the back light module. The light-guiding plate of the conventional back light module is disposed with a mirror surface, and the diffusion plate and the prism sheet are respectively bored with through holes for presenting the mirror surface of the light-guiding plate.
The conventional back light module is provided with the mirror surface, and the CCFLs and the LEDs installed at the peripheral side of the light-guiding plate as a light source to be scattered by the reflecting net points at the bottom surface of the light-guiding plate and then reflected to the topside of the light-gui ding plate by the reflecting sheet for rein forcing the lighting at the peripheral side of the mirror surface and increasing irradiation effect on the mirror surface. Generally, the outer frame of the conventional back light module is made of plastic molded in shape to lighten the back light module, and the luminous intensity of the light source has to be elevated for making clear the image on the back light plate. Thus, the heat energy produced by the light source will be relatively heightened and the outer frame will receive a certain extent of heating effect, and since the plastic outer frame has bad effect in heat dissipation; therefore, the CCFLs and LEDs are likely to be damaged due to bad heat dissipation. In addition, only through the light-guiding plate and the diffusion sheet and the prism plate, can the CCFLs and LEDs increase irradiation effect on the mirror; therefore, the conventional back light module needs to increase its structural layers in order to make images clear, thus complicating manufacturing processes.
SUMMARY OF THE INVENTION
The objective of the invention is to offer a back light module including a frame body, a back board, a reflecting sheet, a light-guiding plate, a lighting member, an optical film and an upper cover. The frame body and the backboard can be formed integral or independent. The frame body has its central portion formed with an depositing space for receiving therein the reflecting sheet, the light-guiding plate and the optical film, and the lighting member is positioned at the inner peripheral edge of the frame body and firmly bonded with the frame body by means of radiating paste, having one end provided with a connector for connecting an external power unit. The frame body has its outer peripheral edge disposed with lots of radiating fins, and the back board and the radiating fins are respectively formed with numerous radiating grains for increasing the heat dissipation area of the back light module. In addition, the frame body and the backboard have parts of the outer side bored with depositing recesses for receiving a PCB and its IC chips and other passive elements.
The frame body and the back board of the back light module of this invention are made of aluminum; therefore, the frame body of this invention is much better than the conventional plastic frame body in hardness and heat conduction as well as in heat dissipation. Further, the back light module of this invention is provided with numerous radiating fins and radiating grains for increasing the heat dissipation area of the back light module, able to effectively conduct and dissipate high temperature generated by the lighting member. Therefore, the lighting member of this invention can make electrical connection with comparatively high electric current for elevating its brightness and its working efficacy. Furthermore, the back light module of this invention has excellent effect in heat dissipation, able to prolong the service life of the lighting member and lower the cost of replacing lighting members with new ones.
BRIEF DESCRIPTION OF DRAWINGS
This invention will be better understood by referring to the accompanying drawings, wherein: Fig. I is an exploded perspective view of a conventional back light module; Fig. 2 is an exploded perspective view of a back light module in the present invention; Fig. 3 is a rear view of the frame of the back light module in the present invention; Fig. 4 is a side cross-sectional view of the frame of the back light module in the present invention; and Fig. 5 is a front view of radiating fins and various shapes of their notches in the present invention.
DETAILED DESCRIPTION OF THE PREFERRED
EMBODIMENT
A preferred embodiment of a back light module I in the present invention, as shown in Figs. 2, 3 and 4, includes a frame body 10, a back board 11, a reflecting sheet 30, a light-guiding plate 2, an optical firm 4, a lighting member 5 and an upper cover 6 as main components combined together.
The frame body 10 and the backboard 11 can be formed integral or independent from each other The frame body 10 has its central portion formed with depositing space for receiving therein the reflecting sheet 30, the light-guiding plate 2 and the optical film 4, which consists of a diffusion sheet 40, an upper prism 41 and a lower prism 42. The outer upper cover 6 is provided with engage members to be respectively engaged with the engage notches 15 of the frame body to combine the upper cover 6 and the frame body 10 together for fixing and protecting the lightguiding plate 2 and other members in the frame body 10. Further, the frame body 10 has its outer peripheral edge formed with lots of serrated radiating fins 13, and the back board 11 and the radiating fins 13 are respectively provided with numerous serrated radiating grains 14 for increasing the heat dissipation area of the back light module 1. Furthermore, the frame body 10 and the back board 11 has parts of their outer side bored with depositing recesses 12 for receiving and protecting a PCB and its IC chips and other passive elements therein.
In addition, the frame body 10 has one inner edge installed with the lighting member 5 installed thereon with a plurality of high power LEDs that are tin soldered on an aluminum-sheet PCB, and then the PCB is combined with the frame body 10 by means of heat-dissipating paste.
The light-guiding plate 2 has one inner edge formed with a transparent portion corresponding with the location of the lighting member 5 and other edges formed with opaque portions respectively stuck thereon with a reflecting strip 31. Further, the light-guiding plate 2 has one side formed with a net-shaped surface (2A) formed thereon with numerous net points, and the other side formed with a mirror-like smooth surface (2B). The reflecting sheet 30 is positioned between the net-shaped surface (2A) of the light-guiding plate 2 and the frame body 10, and the optical film 4 is stuck on the smooth surface (2B) of the light-guiding plate 2, composed of the diffusion sheet 40 abutting on the light-guiding plate 2, the upper prism 41 and the lower prism 42.
Thus, a back light module able to carry Out image formation and lighting is made by combining the frame body 10 with the light-guiding plate 2 and its reflecting strips 31 on the edges, the reflecting sheet and the optical film 4 respectively stuck on the opposite sides of the light-guiding plate 2, and the lighting member 5 for emitting light source to pass through the transparent portion of the light-guiding plate 2 and be refracted in the interior of the light-guiding plate 2. The upper and the lower prism 41, 42 of the optical film 4 are provided for enabling the back light module 1 to carry out image indication with excellent effect, and the prisms 41,42 can be increased or reduced in number according to customers' requirements and consideration of cost.
The feature of this invention is the numerous radiating fins 13 with serrated recesses formed at the outer peripheral edge of the frame body 10 and the numerous serrated radiating grains 14 disposed on the back board 11. The bottom and (he outer edge of the recess between every two radiating fins 13 can be formed into a round shape, as shown in Figs. (al) and (b 1) of Fig. 5, or a pointed shape, as shown in Fig. (ci) of Fig. 5, or a rectangular shape, as shown in Fig. (dl) of Fig. 5. Moreover, referring to Figs. 3 and 4, after a research, the inventor of this invention reached a conclusion that if the width (A) of the radiating fin 13 is within 10 mm. and the width (B) of the recess between Iwo radiating fins 1 3 is within 10 mm. the back light module of this invention may obtain an excellent effect in heat dissipation. Similarly, the length (C), the width (D) and the height (E) of the radiating grain 14 of this invention are respectively designed to be with in 10mm.; therefore, such radiating grains 14 will be best protected and can carry out heat dissipation with excellent effect. Provided with numerous radiating fins 13 and the radiating grains 14, the back light module of this invention can increase its heat dissipation area and elevate its heat dissipation efficiency, able to quickly and effectively lower the working temperature of the lighting member 5 and prolong the service life of the LEDs.
Provision of the radiating fins 13 and the radiating grains 14, and the shaping specifications of the backboard 11 of this invention can be planned in accordance with the requirements of customers. For instance, the back board II can be formed with a size as large the area surrounded by the frame body 10, or formed with a size a half, one third or one sixth as large as the area surrounded by the frame body 10, depending on customers' requirements in the respect of heat dissipation.
Subsequently, aluminum is harder than plastic, and is excellent in heat conduction and heat dissipation.
The frame body 10 and the back board 11 of the back light module I of this invention are made of aluminum; therefore, they not only can protect and position the lighting member 5, the light-guiding plate 2 and other
S
members installed in the interior of the frame body 10, but also can exhaust out heat energy produced by the lighting member 5 and conducted to the frame body 10 and the back board 11 through the aluminum PCB and the bonding radiating paste. In addition, for consideration of cost and the requirements of customers, the frame body 10 and the backboard 11 or the PCB of this invention can be made of aluminum-magnesium alloy or pottery or porcelain, equally having good effect in heat conduction arid heat dissipation.
Furthermore, after the aluminum frame body 10 and the back board 11 of this invention are shaped, their surfaces can be anodized to let the surface of the frame body 10 and the back board 11 formed with a protective layer that has good effect in insulation, able to prevent electric conduction and elevate visual be auty.
As can be understood from the above description,
this invention has the following advantages.
1. Compared with the plastic frame body of the conventional back light module, the frame body and the back board of the back light module of this invention, which are made of aluminum or aluminum-magnesium alloy, are much better in heat conduction and heat dissipation as well as in hardness, able to effectively protect and position the light-guiding plate and other members positioned in the frame body as well as the PCB and its IC chips and other passive elements in the depositing recesses of the frame body 10, thus saving energy and avoiding pollution of an environment.
2. The numerous radiating fins formed at the outer peripheral edge of the frame body, and the numerous radiating grains provided on the back board and the radiating fins are able to increase the heat dissipation area of the back light module, able to quickly scatter and exhaust out the heat energy generated by the LEDs and effectively lower the working temperature and the service life of the LEDs.
3. The back light module 1 of this invention is provided with numerous radiating fins and radiating grains for conducting and dissipating the heat energy produced by the LEDs and prolonging the service life of the LEDs. Therefore, the LEDs can make electric connection with comparatively high electric current for elevating their shining brightness under the condition of not shortening their service life. In addition, the LEDs can be reduced in number and the light-guiding plate can be made thinner so as to economize cost, save energy source and lessen the size, weight and thickness of the back light module.
4. The back light module of this invention uses LEDs instead of conventional electric bulbs for lighting, conforming to requirement of environmental I0 protection.
5. The back light module of this invention is simple in structure, easy in manufacturing and able to attain the desired output of products.
While the preferred embodiment of the invention has been described above, it will be recognized and understood that various modifications may be made therein and the appended claims are intended to cover all such modifications that may fall within the spirit and scope of the invention.
II

Claims (15)

CLAIM
1. A back light module comprising: a frame body having its central portion formed with an depositing space; a back board formed integral with said frame body; a lighting member installed at the inner peripheral edge of said frame body; a reflecting sheet positioned in said frame body; a light-guiding plate disposed in said frame body and positioned in front of said reflecting sheet, said light-guiding plate having one edge formed with a transparent portion corresponding with the location of said lighting member, said light-guiding plate having the other edges respectively formed with an opaque portion, said opaque portion respectively stuck thereon with a reflecting strip; a diffusion sheet provided in said frame body and positioned before said light- guiding plate; and an upper cover fixedly combined with said frame body by mutual engagement.
2. The back light module as claimed in Claim 1, wherein said backboard is provided independent.
3. The back light module as claimed in Claim 1, wherein said frame body has its peripheral edge disposed with radiating fins.
4. The back light module as claimed in Claim 1, 2 or 3, wherein said back board and said radiating fins are respectively provided with radiating grains, the interval between every two said radiating grains and the length, the width and the height of each said radiating grain are respectively within 10 mm.
5. The back light module as claimed in Claim 1, wherein said lighting member has LEDs assembled on a PCB.
6. The back light module as claimed in Claim 3, wherein said radiating fins are formed with serrated recesses, and the bottom of each said serrated recess and the outer edge of each said radiating fin can be formed into any shape, the depth and the interval between every two said radiating fins being within 10 mm. respectively.
7. The back light module as claimed in Claim 1, wherein said frame body has its surface anodized after shaped.
8. The back light module as claimed in Claim I, wherein said frame body has its surface treated to be insulated after shaped.
9. The back light module as claimed in Claim 1, 2, 3 or 5, wherein said frame body, said back board, said radiating fins and said PCB are made of aluminum.
10. The back light module as claimed in Claim 1, 2, 3 or 5, wherein said frame body, said back board, said radiating fins and said PCB are made of aluminum-magnesium alloy.
11. The back light module as claimed in Claim 1, 2, 3 or 5, wherein said frame body, said back board, said radiating fins and said PCB are made of pottery or porcelain.
12. The back light module as claimed in Claim 5, wherein said PCB is made of fiberglass.
13. The back light module as claimed in Claim 5, wherein a flexible printed circuit (FPC) takes the place of said PCB.
14. The back light module as claimed in Claim 1, wherein the thickness of said light-guiding plate is within 10 mm.
15. A back light module substantially as hereinbefore described with reference to and as shown in Figures 2 to 5 of the accompanying drawings.
GB0701481A 2007-01-26 2007-01-26 Backlight module with increased heat dissipating effect Withdrawn GB2446161A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0701481A GB2446161A (en) 2007-01-26 2007-01-26 Backlight module with increased heat dissipating effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0701481A GB2446161A (en) 2007-01-26 2007-01-26 Backlight module with increased heat dissipating effect

Publications (2)

Publication Number Publication Date
GB0701481D0 GB0701481D0 (en) 2007-03-07
GB2446161A true GB2446161A (en) 2008-08-06

Family

ID=37872810

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0701481A Withdrawn GB2446161A (en) 2007-01-26 2007-01-26 Backlight module with increased heat dissipating effect

Country Status (1)

Country Link
GB (1) GB2446161A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040185248A1 (en) * 2003-03-19 2004-09-23 Power Mate Technology Co., Ltd. Heat-dissipative coating
JP2005037823A (en) * 2003-07-18 2005-02-10 Denki Kagaku Kogyo Kk Liquid crystal color display device
JP2005122057A (en) * 2003-10-20 2005-05-12 Sharp Corp Liquid crystal display device and method for assembling the same
EP1566688A1 (en) * 2004-02-18 2005-08-24 Samsung Electronics Co., Ltd. Backlight assembly for liquid crystal display device
JP2006114447A (en) * 2004-10-18 2006-04-27 Chatani Sangyo Kk Plane light source
US20060138951A1 (en) * 2004-12-27 2006-06-29 Ra-Min Tain Light source with LED and optical protrusions
KR20060093956A (en) * 2005-02-23 2006-08-28 삼성에스디아이 주식회사 Back-light unit of liquid crystal display device of having packaged reflection element
US20060203510A1 (en) * 2005-03-12 2006-09-14 Samsung Electronics Co., Ltd. Edge light type backlight unit having heat sink system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040185248A1 (en) * 2003-03-19 2004-09-23 Power Mate Technology Co., Ltd. Heat-dissipative coating
JP2005037823A (en) * 2003-07-18 2005-02-10 Denki Kagaku Kogyo Kk Liquid crystal color display device
JP2005122057A (en) * 2003-10-20 2005-05-12 Sharp Corp Liquid crystal display device and method for assembling the same
EP1566688A1 (en) * 2004-02-18 2005-08-24 Samsung Electronics Co., Ltd. Backlight assembly for liquid crystal display device
JP2006114447A (en) * 2004-10-18 2006-04-27 Chatani Sangyo Kk Plane light source
US20060138951A1 (en) * 2004-12-27 2006-06-29 Ra-Min Tain Light source with LED and optical protrusions
KR20060093956A (en) * 2005-02-23 2006-08-28 삼성에스디아이 주식회사 Back-light unit of liquid crystal display device of having packaged reflection element
US20060203510A1 (en) * 2005-03-12 2006-09-14 Samsung Electronics Co., Ltd. Edge light type backlight unit having heat sink system

Also Published As

Publication number Publication date
GB0701481D0 (en) 2007-03-07

Similar Documents

Publication Publication Date Title
US7563015B2 (en) Back light module
JP6214892B2 (en) Lighting device
US8550680B2 (en) Lighting device
US7699498B2 (en) LED lamp
CN102484195B (en) Luminescent device and use the light unit of this luminescent device
JP2001160312A (en) Plane-illuminating device
EP2014970A1 (en) High-power light emitting diode (LED) street lamp
TW201124671A (en) Lighting device
US8287171B2 (en) Light emitting diode device and display device
JP2010219049A (en) Light emitting diode lamp
WO2008074245A1 (en) Blacklight apparatus and manufacturing method of the same
US8042970B2 (en) LED illuminator
US20230326421A1 (en) Light-emitting assembly
US20090147516A1 (en) Solid illumination device
JP3163443U (en) LED lighting device
JP2012119436A (en) Lead linear light source and backlight
KR200479637Y1 (en) Planar Light Source
US7942549B2 (en) LED lamp having light guiding heat sink
CN101975376B (en) Luminous source heat-dissipation structure of backlight module
EP2325557A1 (en) Illumination device with heat dissipation structure
US20140376256A1 (en) Light source module
GB2446161A (en) Backlight module with increased heat dissipating effect
TW201510426A (en) LED lamp with heat dissipating structures
KR101188350B1 (en) Light Emitting Diode Lamp using Heat Spreader
JPH038204A (en) Led lamp device

Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application

Owner name: TEAMWIN OPTO-ELECTRONICS CO., LTD.

Free format text: FORMER APPLICANT(S): TSAI, TZUNG-SHIUN

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)