GB2434252A - Printed circuit board arrangement for voltage drop measurement - Google Patents

Printed circuit board arrangement for voltage drop measurement Download PDF

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Publication number
GB2434252A
GB2434252A GB0600656A GB0600656A GB2434252A GB 2434252 A GB2434252 A GB 2434252A GB 0600656 A GB0600656 A GB 0600656A GB 0600656 A GB0600656 A GB 0600656A GB 2434252 A GB2434252 A GB 2434252A
Authority
GB
United Kingdom
Prior art keywords
component
portions
voltage drop
pcb
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0600656A
Other versions
GB2434252B (en
GB0600656D0 (en
Inventor
Robert Carter
Andrew Hunt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens PLC
Original Assignee
Siemens PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens PLC filed Critical Siemens PLC
Priority to GB0600656A priority Critical patent/GB2434252B/en
Publication of GB0600656D0 publication Critical patent/GB0600656D0/en
Publication of GB2434252A publication Critical patent/GB2434252A/en
Application granted granted Critical
Publication of GB2434252B publication Critical patent/GB2434252B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A printed circuit board comprises a component pad separated into two or more portions corresponding to the number of terminals of a component (not shown) to be connected to the component pad. At least two of the portions are subdivided into main portions 4, to which the terminals of a component may be connected, and auxiliary portions 3, to which voltage drop measurement tracks 5 are connected. The current which flows through the auxiliary portions is relatively small compared to that which flows through the component. The component connected to the main portions may be a resistor which forms part of a current measuring arrangement.

Description

<p>Component Current Measuring Arrangement It is often desirable to
measure current using a resistor. This can be done e.g. by measuring the voltage drop across the resistor when the current flows through it; however this often means the measuring is done across the solder which attaches the resistor to the printed circuit board. Of particular concern is the resistive temperature coefficient of the solder joint; where a significant proportion of the overall resistance is provided by the solder, this part of the resistance has a temperature coefficient of around 0.45%/K whereas the resistor has been carefully developed for a low temperature coefficient typically 0.005%/K.</p>
<p>Until now this problem has been solved using a more expensive resistor having four terminals. Two of these terminals are used for the main current flow and two terminals are used for measuring the voltage drop across the resistor. This means that the voltage drop caused by the current to be measured in the solder joint is not seen at the measurable terminals. An example of such a four terminal type resistor is a Isabel lenhutte BVR type resistor.</p>
<p>It is an object of the invention to provide a cheaper yet reliable method of measuring current across a resistor or other component.</p>
<p>Figure 1 compares the prior art (Figure 1 a) with two embodiments of the invention shown in Figures 1(b) and (c).</p>
<p>Figure 1(a) shows a conventional pad lay-out showing a portion of a printed circuit board (PCB) 1 having a main current carrying track 2 (e.g. copper strip). The PCB is usually also coated with thin film (not shown) during the soldering process. Two portions of resistor pad 3 are shown, which are effectively gaps in the film and a layer of solder (e.g. tin or tin-lead).. The resistor (not shown), having two flat terminals, is then connected to the resistor pad.</p>
<p>According to embodiment of the invention in figures lb and ic each portion of the resistor pad is divided into two parts, a smaller portion 3 which is separate to the main resistor portion 4. The two smaller portions are connected to voltage drop measurement tracks. In these arrangements the main current does not flow through the solder that is connected to the voltage drop measurement tracks 5. The heating effect is much smaller than that with the main resistor pad.</p>
<p>The fact that there are no high currents flowing through the solder joints of the measurement connections gives a much more accurate measurement of the voltage drop across the resistor.</p>
<p>Furthermore standard two terminal resistors cost less and are more readily available than the equivalent four terminal resistor.</p>

Claims (1)

  1. <p>Claims 1. A printed circuit board (PCB) arrangement including a
    component pad, separated into two or more portions corresponding to the number of terminals of a particular component, at least two of said portions being subdivided into a main portion and an auxiliary portion, said auxiliary portions connected to voltage drop measurement tracks.</p>
    <p>2. A PCB arrangement as claimed in claim 1 wherein said component is a resistor.</p>
    <p>3. A PCB arrangement as claimed in claim 1 or 2 wherein said auxiliary portion is substantially smaller than said main portion.</p>
    <p>4. A PCB arrangement as claimed in claim 1 including the component soldered or otherwise fixed to the PCB to contact the component pad.</p>
    <p>5. A method of manufacturing a PCB, comprising providing said PCB with a component pad, separated into two or more portions corresponding to the number of terminals of a particular component, at least two of said portions being subdivided into a main portion and an auxiliary portion, said auxiliary portions connected to voltage drop measurement tracks.</p>
    <p>6. A method as claimed in claim 5 wherein said component is a resistor.</p>
    <p>7. A method as claimed in claim 5 or 6 wherein said auxiliary portions are substantially smaller than said main portion.</p>
    <p>8. A method as claimed in claim 5 including soldering or otherwise fixing the component to the PCB to contact the component pad.</p>
GB0600656A 2006-01-13 2006-01-13 Component Current Measuring Arrangement Expired - Fee Related GB2434252B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0600656A GB2434252B (en) 2006-01-13 2006-01-13 Component Current Measuring Arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0600656A GB2434252B (en) 2006-01-13 2006-01-13 Component Current Measuring Arrangement

Publications (3)

Publication Number Publication Date
GB0600656D0 GB0600656D0 (en) 2006-02-22
GB2434252A true GB2434252A (en) 2007-07-18
GB2434252B GB2434252B (en) 2009-03-04

Family

ID=35997975

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0600656A Expired - Fee Related GB2434252B (en) 2006-01-13 2006-01-13 Component Current Measuring Arrangement

Country Status (1)

Country Link
GB (1) GB2434252B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014161624A1 (en) * 2013-04-05 2014-10-09 Isabellenhütte Heusler Gmbh & Co. Kg Measuring resistor and corresponding measuring method
CN106535463A (en) * 2015-09-15 2017-03-22 展讯通信（上海）有限公司 Bonding pad structure and circuit for improving current detection accuracy
CN111385961A (en) * 2018-12-29 2020-07-07 浙江宇视科技有限公司 Pad structure and circuit board structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110072327A (en) * 2018-01-23 2019-07-30 展讯通信（上海）有限公司 4-Pin pad structure and printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030020592A1 (en) * 2001-06-14 2003-01-30 Koichi Hirasawa Current detection resistor, mounting structure thereof and method of measuring effective inductance

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030020592A1 (en) * 2001-06-14 2003-01-30 Koichi Hirasawa Current detection resistor, mounting structure thereof and method of measuring effective inductance

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014161624A1 (en) * 2013-04-05 2014-10-09 Isabellenhütte Heusler Gmbh & Co. Kg Measuring resistor and corresponding measuring method
EP3139183A1 (en) * 2013-04-05 2017-03-08 Isabellenhütte Heusler GmbH & Co.KG Measurement resistance and corresponding measuring method
US10151779B2 (en) 2013-04-05 2018-12-11 Isabellenhuette Heusler GmbH & Co., LG Measuring resistor and corresponding measuring method
CN106535463A (en) * 2015-09-15 2017-03-22 展讯通信（上海）有限公司 Bonding pad structure and circuit for improving current detection accuracy
CN111385961A (en) * 2018-12-29 2020-07-07 浙江宇视科技有限公司 Pad structure and circuit board structure

Also Published As

Publication number Publication date
GB2434252B (en) 2009-03-04
GB0600656D0 (en) 2006-02-22

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20140113